Naomi MASUDA

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing thereof
- Patent number 9,437,573
- Issue date Sep 6, 2016
- Cypress Semiconductor Corporation
- Naomi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for stack type semiconductor packaging
- Patent number 9,418,940
- Issue date Aug 16, 2016
- Cypress Semiconductor Corporation
- Masataka Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip package covered with tape
- Patent number 9,385,014
- Issue date Jul 5, 2016
- Cypress Semiconductor Corporation
- Naomi Masuda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,293,441
- Issue date Mar 22, 2016
- Cypress Semiconductor Corporation
- Masataka Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip bonded semiconductor device with shelf
- Patent number 8,796,864
- Issue date Aug 5, 2014
- Spansion LLC
- Naomi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,765,529
- Issue date Jul 1, 2014
- Spansion LLC
- Naomi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing thereof
- Patent number 8,637,986
- Issue date Jan 28, 2014
- Spansion LLC
- Naomi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,598,717
- Issue date Dec 3, 2013
- Spansion LLC
- Naomi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip bonded semiconductor device with shelf and method of manu...
- Patent number 8,486,756
- Issue date Jul 16, 2013
- Spansion LLC
- Naomi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing thereof
- Patent number 8,446,015
- Issue date May 21, 2013
- Spansion LLC
- Naomi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure, method and system for assessing bonding of electrodes in...
- Patent number 8,274,158
- Issue date Sep 25, 2012
- Spansion LLC
- Junichi Kasai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,030,179
- Issue date Oct 4, 2011
- Spansion, LLC
- Masataka Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing thereof
- Patent number 7,892,892
- Issue date Feb 22, 2011
- Spansion LLC
- Naomi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip package covered with tape
- Patent number 7,846,780
- Issue date Dec 7, 2010
- Spansion LLC
- Naomi Masuda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Structure, method and system for assessing bonding of electrodes in...
- Patent number 7,816,788
- Issue date Oct 19, 2010
- Spansion LLC
- Junichi Kasai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,605,457
- Issue date Oct 20, 2009
- Spansion LLC
- Masataka Hoshino
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20140113411
- Publication date Apr 24, 2014
- SPANSION LLC
- Naomi MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140094001
- Publication date Apr 3, 2014
- SPANSION LLC
- Naomi MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE WITH SHELF AND METHOD OF MANUFACTURING THEREOF
- Publication number 20130277834
- Publication date Oct 24, 2013
- Naomi MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20120049362
- Publication date Mar 1, 2012
- Naomi MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120025364
- Publication date Feb 2, 2012
- Masataka HOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP PACKAGE COVERED WITH TAPE
- Publication number 20110074029
- Publication date Mar 31, 2011
- Naomi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE, METHOD AND SYSTEM FOR ASSESSING BONDING OF ELECTRODES IN...
- Publication number 20110057309
- Publication date Mar 10, 2011
- Junichi KASAI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090325346
- Publication date Dec 31, 2009
- Masataka HOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20090302469
- Publication date Dec 10, 2009
- Naomi MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE WITH SHELF AND METHOD OF MANUFACTGURING THERE OF
- Publication number 20090200684
- Publication date Aug 13, 2009
- Naomi MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20090121361
- Publication date May 14, 2009
- SPANSION LLC
- Naomi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR STACK TYPE SEMICONDUCTOR PACKAGING
- Publication number 20090115044
- Publication date May 7, 2009
- Masataka HOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-chip package covered with tape
- Publication number 20090039531
- Publication date Feb 12, 2009
- Naomi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20090026609
- Publication date Jan 29, 2009
- Naomi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE, METHOD AND SYSTEM FOR ASSESSING BONDING OF ELECTRODES IN...
- Publication number 20080303144
- Publication date Dec 11, 2008
- Junichi KASAI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20070145579
- Publication date Jun 28, 2007
- Masataka Hoshino
- H01 - BASIC ELECTRIC ELEMENTS

Naomi MASUDA

Person

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing thereof

Structures and methods for stack type semiconductor packaging

Flip-chip package covered with tape

Semiconductor device and method of manufacturing the same

Flip chip bonded semiconductor device with shelf

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing thereof

Semiconductor device and method for manufacturing the same

Flip chip bonded semiconductor device with shelf and method of manu...

Semiconductor device and method for manufacturing thereof

Structure, method and system for assessing bonding of electrodes in...

Semiconductor device and method of manufacturing the same

Semiconductor device and method for manufacturing thereof

Flip-chip package covered with tape

Structure, method and system for assessing bonding of electrodes in...

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

FLIP CHIP PACKAGE WITH SHELF AND METHOD OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

FLIP-CHIP PACKAGE COVERED WITH TAPE

STRUCTURE, METHOD AND SYSTEM FOR ASSESSING BONDING OF ELECTRODES IN...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF

FLIP CHIP PACKAGE WITH SHELF AND METHOD OF MANUFACTGURING THERE OF

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF

STRUCTURES AND METHODS FOR STACK TYPE SEMICONDUCTOR PACKAGING

Flip-chip package covered with tape

Semiconductor device and method for manufacturing the same

STRUCTURE, METHOD AND SYSTEM FOR ASSESSING BONDING OF ELECTRODES IN...

Semiconductor device and method of manufacturing the same