Naoto Hosotani

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Battery block
- Patent number 9,548,477
- Issue date Jan 17, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yasuhiro Asaida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Battery module
- Patent number 8,835,032
- Issue date Sep 16, 2014
- Panasonic Corporation
- Hiroshi Takasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heating and pressurizing apparatus for use in mounting electronic c...
- Patent number 7,938,929
- Issue date May 10, 2011
- Panasonic Corporation
- Shozo Minamitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heating and pressurizing apparatus for use in mounting electronic c...
- Patent number 7,490,652
- Issue date Feb 17, 2009
- Panasonic Corporation
- Shozo Minamitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component connecting apparatus
- Patent number 7,357,288
- Issue date Apr 15, 2008
- Matsushita Electric Industrial Co., Ltd.
- Naoto Hosotani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressurizing method
- Patent number 7,076,867
- Issue date Jul 18, 2006
- Matsushita Electric Industrial Co., Ltd.
- Akihiro Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for bonding electronic component, circuit boar...
- Patent number 6,995,342
- Issue date Feb 7, 2006
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Yamauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting apparatus
- Patent number 6,839,959
- Issue date Jan 11, 2005
- Matsushita Electric Industrial Co., Ltd.
- Naoto Hosotani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for bonding electronic component, circuit boar...
- Patent number 6,797,926
- Issue date Sep 28, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Yamauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding head and component mounting apparatus
- Patent number 6,561,408
- Issue date May 13, 2003
- Matsushita Electric Industrial Co., Ltd.
- Naoto Hosotani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heating and pressurizing apparatus for use in mounting electronic c...
- Patent number 6,544,377
- Issue date Apr 8, 2003
- Matsushita Electric Industrial Co., Ltd.
- Shozo Minamitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for mounting component
- Patent number 6,506,222
- Issue date Jan 14, 2003
- Matsushita Electric Industrial Co., Ltd.
- Shozo Minamitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for mounting component
- Patent number 6,264,704
- Issue date Jul 24, 2001
- Matsushita Electric Industrial Co., Ltd.
- Shozo Minamitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting apparatus and method
- Patent number 6,246,789
- Issue date Jun 12, 2001
- Matsushita Electric Industrial Co., Ltd.
- Naoto Hosotani
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
LAMINATING DEVICE
- Publication number 20230271410
- Publication date Aug 31, 2023
- PANASONIC CORPORATION
- Ryuta ABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATTERY BLOCK
- Publication number 20130344376
- Publication date Dec 26, 2013
- PANASONIC CORPORATION
- Yasuhiro Asaida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATTERY MODULE
- Publication number 20130216884
- Publication date Aug 22, 2013
- PANASONIC CORPORATION
- Hiroshi Takasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATING AND PRESSURIZING APPARATUS FOR USE IN MOUNTING ELECTRONIC C...
- Publication number 20090120998
- Publication date May 14, 2009
- Shozo Minamitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heating and pressurizing apparatus for use in mounting electronic c...
- Publication number 20060016562
- Publication date Jan 26, 2006
- Shozo Minamitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component connecting apparatus and method and component mounting ap...
- Publication number 20050034302
- Publication date Feb 17, 2005
- Naoto Hosotani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for bonding electronic component, circuit boar...
- Publication number 20050011934
- Publication date Jan 20, 2005
- Hiroshi Yamauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pressurizing method and pressurizing apparatus
- Publication number 20030145459
- Publication date Aug 7, 2003
- Akihiro Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heating and pressurizing apparatus for use in mounting electronic c...
- Publication number 20030121616
- Publication date Jul 3, 2003
- Shozo Minamitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for bonding electronic component, circuit boar...
- Publication number 20030080108
- Publication date May 1, 2003
- Hiroshi Yamauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding head and component mounting apparatus
- Publication number 20020092887
- Publication date Jul 18, 2002
- Naoto Hosotani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for mounting component
- Publication number 20010026012
- Publication date Oct 4, 2001
- Shozo Minamitani
- H01 - BASIC ELECTRIC ELEMENTS

Naoto Hosotani

Person

Patents Grantslast 30 patents

Battery block

Battery module

Heating and pressurizing apparatus for use in mounting electronic c...

Heating and pressurizing apparatus for use in mounting electronic c...

Component connecting apparatus

Pressurizing method

Apparatus and method for bonding electronic component, circuit boar...

Component mounting apparatus

Apparatus and method for bonding electronic component, circuit boar...

Bonding head and component mounting apparatus

Heating and pressurizing apparatus for use in mounting electronic c...

Method and apparatus for mounting component

Method and apparatus for mounting component

Component mounting apparatus and method

Patents Applicationslast 30 patents

LAMINATING DEVICE

BATTERY BLOCK

BATTERY MODULE

HEATING AND PRESSURIZING APPARATUS FOR USE IN MOUNTING ELECTRONIC C...

Heating and pressurizing apparatus for use in mounting electronic c...

Component connecting apparatus and method and component mounting ap...

Apparatus and method for bonding electronic component, circuit boar...

Pressurizing method and pressurizing apparatus

Heating and pressurizing apparatus for use in mounting electronic c...

Apparatus and method for bonding electronic component, circuit boar...

Bonding head and component mounting apparatus

Method and apparatus for mounting component