Naoto Kimura

Person

Kumamoto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 7,705,437
- Issue date Apr 27, 2010
- NEC Electronics Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,521,778
- Issue date Apr 21, 2009
- NEC Electronics Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 7,432,588
- Issue date Oct 7, 2008
- NEC Electronics Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-sealed-type semiconductor device, and production process for...
- Patent number 7,030,505
- Issue date Apr 18, 2006
- NEC Electronics Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,984,889
- Issue date Jan 10, 2006
- NEC Electronics Corporation
- Naoto Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with improved heatsink structure
- Patent number 6,933,612
- Issue date Aug 23, 2005
- NEC Electronics Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus with spurious vibration suppressing structure
- Patent number 6,779,702
- Issue date Aug 24, 2004
- NEC Electronics Corporation
- Naoto Kimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked chip-size package type semiconductor device capable of bein...
- Patent number 6,744,141
- Issue date Jun 1, 2004
- NEC Electronics Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,734,553
- Issue date May 11, 2004
- NEC Electronics Corporation
- Naoto Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having reliable coupling with mounting substrate
- Patent number 6,690,090
- Issue date Feb 10, 2004
- NEC Electronics Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a coated metallic wire, method of removing in...
- Patent number 6,640,436
- Issue date Nov 4, 2003
- NEC Electronics Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having stacked multi chip module structure
- Patent number 6,621,156
- Issue date Sep 16, 2003
- NEC Electronics Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved cooling efficiency and reduced e...
- Patent number 6,605,869
- Issue date Aug 12, 2003
- NEC Electronics Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with stacked semiconductor chips
- Patent number 6,600,221
- Issue date Jul 29, 2003
- NEC Electronics Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus with spurious vibration suppressing structure
- Patent number 6,575,348
- Issue date Jun 10, 2003
- NEC Electronics Corporation
- Naoto Kimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 6,476,500
- Issue date Nov 5, 2002
- NEC Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array type semiconductor device
- Patent number 6,472,759
- Issue date Oct 29, 2002
- NEC Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a BGA structure
- Patent number 6,331,738
- Issue date Dec 18, 2001
- NEC Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CSP type semiconductor device with reduced package size
- Patent number 6,268,652
- Issue date Jul 31, 2001
- NEC Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated fine metallic wire and method for fabricating semiconductor...
- Patent number 6,239,376
- Issue date May 29, 2001
- NEC Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold-BGA-type semiconductor device and method for making the same
- Patent number 6,218,728
- Issue date Apr 17, 2001
- NEC Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic-packaged semiconductor integrated circuit
- Patent number 6,028,356
- Issue date Feb 22, 2000
- NEC Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating same
- Patent number 6,011,306
- Issue date Jan 4, 2000
- NEC Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having simple protective structure and process...
- Patent number 5,962,918
- Issue date Oct 5, 1999
- NEC Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making plastic-packaged semiconductor integrated circuit
- Patent number 5,715,593
- Issue date Feb 10, 1998
- NEC Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array type of semiconductor device
- Patent number 5,663,594
- Issue date Sep 2, 1997
- NEC Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device
- Publication number 20090096074
- Publication date Apr 16, 2009
- NEC Electronics Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20080258318
- Publication date Oct 23, 2008
- NEC Electronics Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE S...
- Publication number 20080224280
- Publication date Sep 18, 2008
- NEC Electronics Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20080038872
- Publication date Feb 14, 2008
- NEC ELECTRONICS CORPORATION
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20070108570
- Publication date May 17, 2007
- NEC ELECTRONICS CORPORATION
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of fabricating the same
- Publication number 20060138614
- Publication date Jun 29, 2006
- NEC Electronics Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20040195682
- Publication date Oct 7, 2004
- Naoto Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device
- Publication number 20040099944
- Publication date May 27, 2004
- NEC Electronics Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin-sealed-type semiconductor device, and production process for...
- Publication number 20040099933
- Publication date May 27, 2004
- NEC Electronics Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with improved heatsink structure
- Publication number 20040080041
- Publication date Apr 29, 2004
- NEC Electronics Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030151139
- Publication date Aug 14, 2003
- NEC ELECTRONICS CORPORATION
- Naoto Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonding apparatus with spurious vibration releasing structure
- Publication number 20030106923
- Publication date Jun 12, 2003
- Naoto Kimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacked chip-size package type semiconductor device capable of bein...
- Publication number 20030011067
- Publication date Jan 16, 2003
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding apparatus with spurious vibration releasing structure
- Publication number 20020185518
- Publication date Dec 12, 2002
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20020175421
- Publication date Nov 28, 2002
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20020140084
- Publication date Oct 3, 2002
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20020135050
- Publication date Sep 26, 2002
- NEC Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having reliable coupling with mounting substrate
- Publication number 20020100977
- Publication date Aug 1, 2002
- NEC Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having stacked multi chip module structure
- Publication number 20020096785
- Publication date Jul 25, 2002
- NEC Corporation
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20020053727
- Publication date May 9, 2002
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20020011654
- Publication date Jan 31, 2002
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20020008311
- Publication date Jan 24, 2002
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20010042916
- Publication date Nov 22, 2001
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS

Naoto Kimura

Person

Patents Grantslast 30 patents

Semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device and method of fabricating the same

Resin-sealed-type semiconductor device, and production process for...

Semiconductor device

Semiconductor device with improved heatsink structure

Wire bonding apparatus with spurious vibration suppressing structure

Stacked chip-size package type semiconductor device capable of bein...

Semiconductor device

Semiconductor device having reliable coupling with mounting substrate

Method of fabricating a coated metallic wire, method of removing in...

Semiconductor device having stacked multi chip module structure

Semiconductor device with improved cooling efficiency and reduced e...

Semiconductor device with stacked semiconductor chips

Wire bonding apparatus with spurious vibration suppressing structure

Semiconductor device

Ball grid array type semiconductor device

Semiconductor device having a BGA structure

CSP type semiconductor device with reduced package size

Coated fine metallic wire and method for fabricating semiconductor...

Mold-BGA-type semiconductor device and method for making the same

Plastic-packaged semiconductor integrated circuit

Semiconductor device and method for fabricating same

Semiconductor device having simple protective structure and process...

Method of making plastic-packaged semiconductor integrated circuit

Ball grid array type of semiconductor device

Patents Applicationslast 30 patents

Semiconductor device

Semiconductor device

LEAD FRAME, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE S...

Method of manufacturing semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device and method of fabricating the same

Semiconductor device

Semiconductor device

Resin-sealed-type semiconductor device, and production process for...

Semiconductor device with improved heatsink structure

Semiconductor device

Wire bonding apparatus with spurious vibration releasing structure

Stacked chip-size package type semiconductor device capable of bein...

Wire bonding apparatus with spurious vibration releasing structure

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device having reliable coupling with mounting substrate

Semiconductor device having stacked multi chip module structure

Semiconductor device

Semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same