Naoto Miyashita

Person

Yokohama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor device and polishing apparatus
- Patent number 7,351,131
- Issue date Apr 1, 2008
- Kabushiki Kaisha Toshiba
- Kenro Nakamura
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing method and apparatus
- Patent number 7,101,259
- Issue date Sep 5, 2006
- Ebara Corporation
- Norio Kimura
- B24 - GRINDING POLISHING
Information Patent Grant
Aqueous dispersion for chemical mechanical polishing, chemical mech...
- Patent number 7,005,382
- Issue date Feb 28, 2006
- JSR Corporation
- Kazuo Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and polishing apparatus
- Patent number 6,933,234
- Issue date Aug 23, 2005
- Kabushiki Kaisha Toshiba
- Kenro Nakamura
- B24 - GRINDING POLISHING
Information Patent Grant
Method of chemical/mechanical polishing of the surface of semicondu...
- Patent number 6,867,138
- Issue date Mar 15, 2005
- Kabushiki Kaisha Toshiba
- Naoto Miyashita
- B24 - GRINDING POLISHING
Information Patent Grant
Electropolishing method
- Patent number 6,783,658
- Issue date Aug 31, 2004
- Kabushiki Kaisha Toshiba
- Yoshitaka Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for forming electrolytic water and apparatus f...
- Patent number 6,723,226
- Issue date Apr 20, 2004
- Kabushiki Kaisha Toshiba
- Jun Takayasu
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Grant
Method for dressing a polishing pad, polishing apparatus, and metho...
- Patent number 6,716,087
- Issue date Apr 6, 2004
- Kabushiki Kaisha Toshiba
- Naoto Miyashita
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing method and apparatus
- Patent number 6,667,238
- Issue date Dec 23, 2003
- Ebara Corporation
- Norio Kimura
- B24 - GRINDING POLISHING
Information Patent Grant
Method of chemical/mechanical polishing of the surface of semicondu...
- Patent number 6,468,911
- Issue date Oct 22, 2002
- Kabushiki Kaisha Toshiba
- Naoto Miyashita
- B24 - GRINDING POLISHING
Information Patent Grant
Abrasive and method for polishing semiconductor substrate
- Patent number 6,354,913
- Issue date Mar 12, 2002
- Kabushiki Kaisha Toshiba
- Naoto Miyashita
- B24 - GRINDING POLISHING
Information Patent Grant
Method for dressing a polishing pad, polishing apparatus, and metho...
- Patent number 6,241,581
- Issue date Jun 5, 2001
- Kabushiki Kaisha Toshiba
- Naoto Miyashita
- B24 - GRINDING POLISHING
Information Patent Grant
Double side cleaning apparatus for semiconductor substrate
- Patent number 6,167,583
- Issue date Jan 2, 2001
- Kabushiki Kaisha Toshiba
- Naoto Miyashita
- B08 - CLEANING
Information Patent Grant
Method of manufacturing a semiconductor device and an apparatus for...
- Patent number 6,098,638
- Issue date Aug 8, 2000
- Kabushiki Kaisha Toshiba
- Naoto Miyashita
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing method, semiconductor device fabrication method, and semi...
- Patent number 6,069,083
- Issue date May 30, 2000
- Kabushiki Kaisha Toshiba
- Naoto Miyashita
- B24 - GRINDING POLISHING
Information Patent Grant
Abrasive material for polishing a semiconductor wafer, and methods...
- Patent number 6,045,605
- Issue date Apr 4, 2000
- Kabushiki Kaisha Toshiba
- Kenji Doi
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for manufacturing electrolytic ionic water and...
- Patent number 6,007,696
- Issue date Dec 28, 1999
- Kabushiki Kaisha Toshiba
- Jun Takayasu
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Grant
Method for purifying pure water and an apparatus for the same
- Patent number 6,001,238
- Issue date Dec 14, 1999
- Kabushiki Kaisha Toshiba
- Jun Takayasu
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Grant
Method for producing electrolytic ionic water and an apparatus for...
- Patent number 5,993,639
- Issue date Nov 30, 1999
- Kabushiki Kaisha Toshiba
- Naoto Miyashita
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Grant
Polishing slurry
- Patent number 5,968,239
- Issue date Oct 19, 1999
- Kabushiki Kaisha Toshiba
- Naoto Miyashita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor manufacturing apparatus including temperature control...
- Patent number RE36328
- Issue date Oct 5, 1999
- Kabushiki Kaisha Toshiba
- Naoto Miyashita
- 427 - Coating processes
Information Patent Grant
Method of manufacturing a semiconductor device having an element is...
- Patent number 5,943,578
- Issue date Aug 24, 1999
- Kabushiki Kaisha Toshiba
- Ichiro Katakabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical-mechanical polishing (CMP) method for controlling polishin...
- Patent number 5,922,620
- Issue date Jul 13, 1999
- Kabushiki Kaisha Toshiba
- Mariko Shimomura
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for manufacturing a semiconductor device
- Patent number 5,880,032
- Issue date Mar 9, 1999
- Kabushiki Kaisha Toshiba
- Kenji Doi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat treatment apparatus for semiconductor wafers
- Patent number 5,878,191
- Issue date Mar 2, 1999
- Kabushiki Kaisha Toshiba
- Naoto Miyashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing slurry
- Patent number 5,861,054
- Issue date Jan 19, 1999
- Kabushiki Kaisha Toshiba
- Naoto Miyashita
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor device having a trench for device isolation fabricati...
- Patent number 5,858,859
- Issue date Jan 12, 1999
- Kabushiki Kaisha Toshiba
- Naoto Miyashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating trench isolation structure having tapered ope...
- Patent number 5,683,908
- Issue date Nov 4, 1997
- Kabushiki Kaisha Toshiba
- Naoto Miyashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical-mechanical polishing (CMP) method for controlling polishin...
- Patent number 5,643,406
- Issue date Jul 1, 1997
- Kabushiki Kaisha Toshiba
- Mariko Shimomura
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing method and apparatus for detecting a polishing end point...
- Patent number 5,643,046
- Issue date Jul 1, 1997
- Kabushiki Kaisha Toshiba
- Ichiro Katakabe
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
FILM FORMING APPARATUS
- Publication number 20160348238
- Publication date Dec 1, 2016
- Kabushiki Kaisha Toshiba
- Rempei Nakata
- C30 - CRYSTAL GROWTH
Information Patent Application
SEMICONDUCTOR MANUFACTURING EQUIPMENT AND MANUFACTURING METHOD OF S...
- Publication number 20150255317
- Publication date Sep 10, 2015
- Kabushiki Kaisha Toshiba
- KYOICHI SUGURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing semiconductor device and polishing apparatus
- Publication number 20050250423
- Publication date Nov 10, 2005
- Kabushiki Kaisha Toshiba
- Kenro Nakamura
- B24 - GRINDING POLISHING
Information Patent Application
Aqueous dispersion for chemical mechanical polishing, chemical mech...
- Publication number 20040132305
- Publication date Jul 8, 2004
- JSR Corporation
- Kazuo Nishimoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Polishing method and apparatus
- Publication number 20040087258
- Publication date May 6, 2004
- Norio Kimura
- B24 - GRINDING POLISHING
Information Patent Application
Method for manufacturing semiconductor device and polishing apparatus
- Publication number 20030139049
- Publication date Jul 24, 2003
- Kenro Nakamura
- B24 - GRINDING POLISHING
Information Patent Application
Electropolishing method
- Publication number 20030066760
- Publication date Apr 10, 2003
- Yoshitaka Matsui
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of chemical/mechanical polishing of the surface of semicondu...
- Publication number 20020192962
- Publication date Dec 19, 2002
- Kabushiki Kaisha Toshiba
- Naoto Miyashita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method for dressing a polishing pad, polishing apparatus, and metho...
- Publication number 20010029156
- Publication date Oct 11, 2001
- KABUSHIKI KAISHA TOSHIBA
- Naoto Miyashita
- B24 - GRINDING POLISHING

Naoto Miyashita

Person

Patents Grantslast 30 patents

Method for manufacturing semiconductor device and polishing apparatus

Polishing method and apparatus

Aqueous dispersion for chemical mechanical polishing, chemical mech...

Method for manufacturing semiconductor device and polishing apparatus

Method of chemical/mechanical polishing of the surface of semicondu...

Electropolishing method

Method and apparatus for forming electrolytic water and apparatus f...

Method for dressing a polishing pad, polishing apparatus, and metho...

Polishing method and apparatus

Method of chemical/mechanical polishing of the surface of semicondu...

Abrasive and method for polishing semiconductor substrate

Method for dressing a polishing pad, polishing apparatus, and metho...

Double side cleaning apparatus for semiconductor substrate

Method of manufacturing a semiconductor device and an apparatus for...

Polishing method, semiconductor device fabrication method, and semi...

Abrasive material for polishing a semiconductor wafer, and methods...

Apparatus and method for manufacturing electrolytic ionic water and...

Method for purifying pure water and an apparatus for the same

Method for producing electrolytic ionic water and an apparatus for...

Polishing slurry

Semiconductor manufacturing apparatus including temperature control...

Method of manufacturing a semiconductor device having an element is...

Chemical-mechanical polishing (CMP) method for controlling polishin...

Method and apparatus for manufacturing a semiconductor device

Heat treatment apparatus for semiconductor wafers

Polishing slurry

Semiconductor device having a trench for device isolation fabricati...

Method of fabricating trench isolation structure having tapered ope...

Chemical-mechanical polishing (CMP) method for controlling polishin...

Polishing method and apparatus for detecting a polishing end point...

Patents Applicationslast 30 patents

FILM FORMING APPARATUS

SEMICONDUCTOR MANUFACTURING EQUIPMENT AND MANUFACTURING METHOD OF S...

Method for manufacturing semiconductor device and polishing apparatus

Aqueous dispersion for chemical mechanical polishing, chemical mech...

Polishing method and apparatus

Method for manufacturing semiconductor device and polishing apparatus

Electropolishing method

Method of chemical/mechanical polishing of the surface of semicondu...

Method for dressing a polishing pad, polishing apparatus, and metho...