Naoyuki Watanabe

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor device, and semiconductor su...
- Patent number 8,890,292
- Issue date Nov 18, 2014
- Fujitsu Semiconductor Limited
- Naoyuki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage body and reel
- Patent number 8,875,895
- Issue date Nov 4, 2014
- Fujitsu Limited
- Keiichi Sasamura
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Tray in combination with electronic component attaching tool attach...
- Patent number 8,671,557
- Issue date Mar 18, 2014
- Fujitsu Semiconductor Limited
- Daisuke Koizumi
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Method for manufacturing semiconductor device, and semiconductor su...
- Patent number 8,563,359
- Issue date Oct 22, 2013
- Fujitsu Semiconductor Limited
- Naoyuki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup device and production method thereof
- Patent number 8,411,197
- Issue date Apr 2, 2013
- Fujitsu Semiconductor Limited
- Naoyuki Watanabe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
IC socket with attached electronic component
- Patent number 8,051,554
- Issue date Nov 8, 2011
- Fujitsu Semiconductor Limited
- Daisuke Koizumi
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Image pickup apparatus and method of manufacturing the same
- Patent number 8,009,222
- Issue date Aug 30, 2011
- Fujitsu Semiconductor Limited
- Naoyuki Watanabe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Solid-state imaging device and method of fabricating solid-state im...
- Patent number 7,998,779
- Issue date Aug 16, 2011
- Fujitsu Semiconductor Limited
- Naoyuki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 7,932,121
- Issue date Apr 26, 2011
- Fujitsu Semiconductor Limited
- Naoyuki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of resin sealing electronic part
- Patent number 7,923,303
- Issue date Apr 12, 2011
- Fujitsu Semiconductor Limited
- Yoshito Akutagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having transparent member
- Patent number 7,719,097
- Issue date May 18, 2010
- Fujitsu Microelectronics Limited
- Naoyuki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of resin sealing electronic part
- Patent number 7,638,367
- Issue date Dec 29, 2009
- Fujitsu Microelectronics Limited
- Yoshito Akutagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image capturing device
- Patent number 7,616,250
- Issue date Nov 10, 2009
- Fujitsu Microelectronics Limited
- Naoyuki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component attaching tool
- Patent number 7,430,798
- Issue date Oct 7, 2008
- Fujitsu Limited
- Daisuke Koizumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contactor having contact electrodes of metal springs embedded in a...
- Patent number 7,403,024
- Issue date Jul 22, 2008
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Contactor having conductive particles in a hole as a contact electrode
- Patent number 7,202,679
- Issue date Apr 10, 2007
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Contactor having conductive particles in a hole as a contact electrode
- Patent number 7,038,477
- Issue date May 2, 2006
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Contactor having conductive particles in a hole as a contact electrode
- Patent number 6,937,038
- Issue date Aug 30, 2005
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Contactor for testing miniaturized devices and components
- Patent number 6,927,343
- Issue date Aug 9, 2005
- Fujitsu Limited
- Naoyuki Watanabe
- G01 - MEASURING TESTING
Information Patent Grant
Method of attaching electronic component and electronic component a...
- Patent number 6,924,174
- Issue date Aug 2, 2005
- Fujitsu Limited
- Daisuke Koizumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contactor having contact electrodes formed by laser processing
- Patent number 6,806,723
- Issue date Oct 19, 2004
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Contactor for testing semiconductor device and manufacturing method...
- Patent number 6,791,345
- Issue date Sep 14, 2004
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Probe card and method of testing wafer having a plurality of semico...
- Patent number 6,774,650
- Issue date Aug 10, 2004
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Contactor, method for manufacturing such contactor, and testing met...
- Patent number 6,767,219
- Issue date Jul 27, 2004
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Probe card and method of testing wafer having a plurality of semico...
- Patent number 6,563,330
- Issue date May 13, 2003
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Contactor having conductive particles in a hole as a contact electrode
- Patent number 6,545,363
- Issue date Apr 8, 2003
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor substrate test device and method
- Patent number 6,410,354
- Issue date Jun 25, 2002
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR SU...
- Publication number 20140015112
- Publication date Jan 16, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Naoyuki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STORAGE BODY AND REEL
- Publication number 20130193016
- Publication date Aug 1, 2013
- Fujitsu Limited
- Keiichi Sasamura
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
METHOD OF ATTACHING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT A...
- Publication number 20120005883
- Publication date Jan 12, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Daisuke Koizumi
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR SU...
- Publication number 20110304007
- Publication date Dec 15, 2011
- FUJITSU SEMICONDUCTOR LIMITED
- Naoyuki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20100248453
- Publication date Sep 30, 2010
- FUJITSU MICROELECTRONICS LIMITED
- Naoyuki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF RESIN SEALING ELECTRONIC PART
- Publication number 20100052212
- Publication date Mar 4, 2010
- FUJITSU MICROELECTRONICS LIMITED
- Yoshito AKUTAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND METHOD OF FABRICATING SOLID-STATE IM...
- Publication number 20090230493
- Publication date Sep 17, 2009
- Fujitsu Microelectronics Limited
- Naoyuki WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ATTACHING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT A...
- Publication number 20080299790
- Publication date Dec 4, 2008
- FUJITSU LIMITED
- Daisuke Koizumi
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
Method of resin sealing electronic part
- Publication number 20070196957
- Publication date Aug 23, 2007
- FUJITSU LIMITED
- Yoshito Akutagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of the same
- Publication number 20070108578
- Publication date May 17, 2007
- Fujitsu Limited
- Naoyuki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image pickup apparatus and method of manufacturing the same
- Publication number 20070091198
- Publication date Apr 26, 2007
- FUJITSU LIMITED
- Naoyuki Watanabe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Contactor having conductive particles in a hole as a contact electrode
- Publication number 20060119374
- Publication date Jun 8, 2006
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
Image capturing device
- Publication number 20060023108
- Publication date Feb 2, 2006
- FUJITSU LIMITED
- Naoyuki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image pickup device and production method thereof
- Publication number 20050275741
- Publication date Dec 15, 2005
- FUJITSU LIMITED
- Naoyuki Watanabe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method of attaching electronic component and electronic component a...
- Publication number 20050204551
- Publication date Sep 22, 2005
- FUJITSU LIMITED
- Daisuke Koizumi
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
Contactor having conductive particles in a hole as a contact electrode
- Publication number 20050110509
- Publication date May 26, 2005
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
Contactor for testing semiconductor device and manufacturing method...
- Publication number 20040266272
- Publication date Dec 30, 2004
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
Method of attaching electronic component and electronic component a...
- Publication number 20040055150
- Publication date Mar 25, 2004
- FUJITSU LIMITED
- Daisuke Koizumi
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
Contactor having contact electrodes formed by laser processing
- Publication number 20040032272
- Publication date Feb 19, 2004
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
Contactor, method for manufacturing such contactor, and testing met...
- Publication number 20030186566
- Publication date Oct 2, 2003
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
Probe card and method of testing wafer having a plurality of semico...
- Publication number 20030160626
- Publication date Aug 28, 2003
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
Contactor having conductive particles in a hole as a contact electrode
- Publication number 20030141884
- Publication date Jul 31, 2003
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
Contactor for testing miniaturized devices and components
- Publication number 20030127246
- Publication date Jul 10, 2003
- FUJITSU LIMITED
- Naoyuki Watanabe
- G01 - MEASURING TESTING
Information Patent Application
Contactor for testing semiconductor device and manufacturing method...
- Publication number 20020105347
- Publication date Aug 8, 2002
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor substrate test device and method
- Publication number 20020031849
- Publication date Mar 14, 2002
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
Contactor having conductive particles in a hole as a contact electrode
- Publication number 20020013010
- Publication date Jan 31, 2002
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING

Naoyuki Watanabe

Person

Patents Grantslast 30 patents

Method for manufacturing semiconductor device, and semiconductor su...

Storage body and reel

Tray in combination with electronic component attaching tool attach...

Method for manufacturing semiconductor device, and semiconductor su...

Image pickup device and production method thereof

IC socket with attached electronic component

Image pickup apparatus and method of manufacturing the same

Solid-state imaging device and method of fabricating solid-state im...

Semiconductor device and manufacturing method of the same

Method of resin sealing electronic part

Semiconductor device having transparent member

Method of resin sealing electronic part

Image capturing device

Electronic component attaching tool

Contactor having contact electrodes of metal springs embedded in a...

Contactor having conductive particles in a hole as a contact electrode

Contactor having conductive particles in a hole as a contact electrode

Contactor having conductive particles in a hole as a contact electrode

Contactor for testing miniaturized devices and components

Method of attaching electronic component and electronic component a...

Contactor having contact electrodes formed by laser processing

Contactor for testing semiconductor device and manufacturing method...

Probe card and method of testing wafer having a plurality of semico...

Contactor, method for manufacturing such contactor, and testing met...

Probe card and method of testing wafer having a plurality of semico...

Contactor having conductive particles in a hole as a contact electrode

Semiconductor substrate test device and method

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR SU...

STORAGE BODY AND REEL

METHOD OF ATTACHING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT A...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR SU...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

METHOD OF RESIN SEALING ELECTRONIC PART

SOLID-STATE IMAGING DEVICE AND METHOD OF FABRICATING SOLID-STATE IM...

METHOD OF ATTACHING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT A...

Method of resin sealing electronic part

Semiconductor device and manufacturing method of the same

Image pickup apparatus and method of manufacturing the same

Contactor having conductive particles in a hole as a contact electrode

Image capturing device

Image pickup device and production method thereof

Method of attaching electronic component and electronic component a...

Contactor having conductive particles in a hole as a contact electrode

Contactor for testing semiconductor device and manufacturing method...

Method of attaching electronic component and electronic component a...

Contactor having contact electrodes formed by laser processing

Contactor, method for manufacturing such contactor, and testing met...

Probe card and method of testing wafer having a plurality of semico...

Contactor having conductive particles in a hole as a contact electrode

Contactor for testing miniaturized devices and components

Contactor for testing semiconductor device and manufacturing method...

Semiconductor substrate test device and method

Contactor having conductive particles in a hole as a contact electrode