Natasha Healey

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Bedford, NH, US

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Patents Grantslast 30 patents

Information Patent Grant
Packaged current sensor integrated circuit
- Patent number 12,163,983
- Issue date Dec 10, 2024
- ALLEGRO MICROSYSTEMS, LLC
- Shixi Louis Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High isolation current sensor
- Patent number 11,800,813
- Issue date Oct 24, 2023
- ALLEGRO MICROSYSTEMS, LLC
- Alexander Latham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current sensor integrated circuits
- Patent number 11,644,485
- Issue date May 9, 2023
- ALLEGRO MICROSYSTEMS, LLC
- Shixi Louis Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current sensor integrated circuits
- Patent number 11,519,939
- Issue date Dec 6, 2022
- ALLEGRO MICROSYSTEMS, LLC
- Shixi Louis Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package and packaging techniques
- Patent number 11,183,436
- Issue date Nov 23, 2021
- ALLEGRO MICROSYSTEMS, LLC
- Shixi Louis Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current sensor integrated circuits
- Patent number 11,150,273
- Issue date Oct 19, 2021
- ALLEGRO MICROSYSTEMS, LLC
- Shixi Louis Liu
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
CURRENT SENSOR INTEGRATED CIRCUITS
- Publication number 20230110671
- Publication date Apr 13, 2023
- ALLEGRO MICROSYSTEMS, LLC
- Shixi Louis Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED CURRENT SENSOR INTEGRATED CIRCUIT
- Publication number 20230060219
- Publication date Mar 2, 2023
- ALLEGRO MICROSYSTEMS, LLC
- Shixi Louis Liu
- G01 - MEASURING TESTING
Information Patent Application
CURRENT SENSOR INTEGRATED CIRCUITS
- Publication number 20210405092
- Publication date Dec 30, 2021
- ALLEGRO MICROSYSTEMS, LLC
- Shixi Louis Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ISOLATION CURRENT SENSOR
- Publication number 20210376227
- Publication date Dec 2, 2021
- ALLEGRO MICROSYSTEMS, LLC
- Alexander Latham
- G01 - MEASURING TESTING
Information Patent Application
POWER MODULE PACKAGE AND PACKAGING TECHNIQUES
- Publication number 20210225721
- Publication date Jul 22, 2021
- ALLEGRO MICROSYSTEMS, LLC
- Shixi Louis Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURRENT SENSOR INTEGRATED CIRCUITS
- Publication number 20210223292
- Publication date Jul 22, 2021
- ALLEGRO MICROSYSTEMS, LLC
- Shixi Louis Liu
- H01 - BASIC ELECTRIC ELEMENTS