Nathaniel P. Wyckoff

Person

Marion, IA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Maskless etching of electronic substrates via precision dispense pr...
- Patent number 11,749,539
- Issue date Sep 5, 2023
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and device including memristor material
- Patent number 11,631,808
- Issue date Apr 18, 2023
- Rockwell Collins, Inc.
- Kyle B. Snyder
- G11 - INFORMATION STORAGE
Information Patent Grant
Custom photolithography masking via precision dispense process
- Patent number 11,626,286
- Issue date Apr 11, 2023
- Rockwell Collins, Inc.
- Jenny Calubayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additively manufactured shadow masks for material deposition control
- Patent number 11,613,802
- Issue date Mar 28, 2023
- Rockwell Collins, Inc.
- Richard Korneisel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Reconstituted wafer including integrated circuit die mechanically i...
- Patent number 11,605,570
- Issue date Mar 14, 2023
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted wafer including mold material with recessed conductiv...
- Patent number 11,515,225
- Issue date Nov 29, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale gyrometric apparatus
- Patent number 11,493,342
- Issue date Nov 8, 2022
- Rockwell Collins, Inc.
- Reginald D. Bean
- G01 - MEASURING TESTING
Information Patent Grant
System and device including memristor material
- Patent number 11,469,373
- Issue date Oct 11, 2022
- Rockwell Collins, Inc.
- Kyle B. Snyder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and device including memristor material
- Patent number 11,462,267
- Issue date Oct 4, 2022
- Rockwell Collins, Inc.
- Kyle B. Snyder
- G11 - INFORMATION STORAGE
Information Patent Grant
System and device including memristor materials in parallel
- Patent number 11,456,418
- Issue date Sep 27, 2022
- Rockwell Collins, Inc.
- Kyle B. Snyder
- G11 - INFORMATION STORAGE
Information Patent Grant
Controlled warping of shadow mask tooling for improved reliability...
- Patent number 11,326,246
- Issue date May 10, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conformal multi-plane material deposition
- Patent number 11,276,641
- Issue date Mar 15, 2022
- Rockwell Collins, Inc.
- Kyle B. Snyder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled induced warping of electronic substrates via electroplating
- Patent number 11,236,436
- Issue date Feb 1, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled induced warping of electronic substrates
- Patent number 11,239,182
- Issue date Feb 1, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for optically storing a binary state
- Patent number 9,355,544
- Issue date May 31, 2016
- Rockwell Collins, Inc.
- Reginald D. Bean
- G08 - SIGNALLING
Information Patent Grant
High performance deposited die attach
- Patent number 9,177,907
- Issue date Nov 3, 2015
- Rockwell Collins, Inc.
- Nathan P. Lower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass thick film embedded passive material
- Patent number 8,585,937
- Issue date Nov 19, 2013
- Rockwell Collins, Inc.
- Nathan P. Lower
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microfabricated RF capacitor
- Patent number 8,199,457
- Issue date Jun 12, 2012
- Rockwell Collins, Inc.
- Robert L. Palandech
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass thick film embedded passive material
- Patent number 8,119,040
- Issue date Feb 21, 2012
- Rockwell Collins, Inc.
- Nathan P. Lower
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PATTERNING USING MONOMER BASED SACRIFICIAL MATERIAL LIFTOFF
- Publication number 20240412973
- Publication date Dec 12, 2024
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Nathaniel P. Wyckoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE LINES FOR INTERCONNECTION IN STACKED DEVICE STRUCTURES
- Publication number 20240413105
- Publication date Dec 12, 2024
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Nathaniel P. Wyckoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INLINE RESISTOR INTEGRATED WITH CONDUCTIVE CONTACT PAD STRUCTURE
- Publication number 20240413111
- Publication date Dec 12, 2024
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Nathaniel P. Wyckoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESILIENT CONDUCTIVE BUMP FOR MICROELECTRONIC TESTING
- Publication number 20240339365
- Publication date Oct 10, 2024
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Nathaniel P. Wyckoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND DEVICE INCLUDING MEMRISTOR MATERIAL
- Publication number 20220181548
- Publication date Jun 9, 2022
- Rockwell Collins, Inc.
- Kyle B. Snyder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND DEVICE INCLUDING MEMRISTOR MATERIAL
- Publication number 20220180924
- Publication date Jun 9, 2022
- Rockwell Collins, Inc.
- Kyle B. Snyder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED WAFER INCLUDING INTEGRATED CIRCUIT DIE MECHANICALLY I...
- Publication number 20220077016
- Publication date Mar 10, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED WAFER INCLUDING MOLD MATERIAL WITH RECESSED CONDUCTIV...
- Publication number 20220077015
- Publication date Mar 10, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Device Including Memristor Material
- Publication number 20220077388
- Publication date Mar 10, 2022
- Rockwell Collins, Inc.
- Kyle B. Snyder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Device Including Memristor Material
- Publication number 20220077390
- Publication date Mar 10, 2022
- Kyle B. Snyder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Controlled Warping of Shadow Mask Tooling for Improved Reliability...
- Publication number 20220025506
- Publication date Jan 27, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ADDITIVELY MANUFACTURED SHADOW MASKS FOR MATERIAL DEPOSITION CONTROL
- Publication number 20210324508
- Publication date Oct 21, 2021
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Controlled Induced Warping of Electronic Substrates via Electroplating
- Publication number 20210230765
- Publication date Jul 29, 2021
- Rockwell Collins, Inc.
- Richard Korneisel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Controlled Induced Warping of Electronic Substrates
- Publication number 20210233866
- Publication date Jul 29, 2021
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-Scale Gyrometric Apparatus
- Publication number 20210223045
- Publication date Jul 22, 2021
- Rockwell Collins, Inc.
- Reginald D. Bean
- G01 - MEASURING TESTING
Information Patent Application
GLASS THICK FILM EMBEDDED PASSIVE MATERIAL
- Publication number 20120118623
- Publication date May 17, 2012
- Rockwell Collins, Inc.
- Nathan P. Lower
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Glass thick film embedded passive material
- Publication number 20100078605
- Publication date Apr 1, 2010
- Nathan P. Lower
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Nathaniel P. Wyckoff

Person

Patents Grantslast 30 patents

Maskless etching of electronic substrates via precision dispense pr...

System and device including memristor material

Custom photolithography masking via precision dispense process

Additively manufactured shadow masks for material deposition control

Reconstituted wafer including integrated circuit die mechanically i...

Reconstituted wafer including mold material with recessed conductiv...

Chip-scale gyrometric apparatus

System and device including memristor material

System and device including memristor material

System and device including memristor materials in parallel

Controlled warping of shadow mask tooling for improved reliability...

Conformal multi-plane material deposition

Controlled induced warping of electronic substrates via electroplating

Controlled induced warping of electronic substrates

Method and apparatus for optically storing a binary state

High performance deposited die attach

Glass thick film embedded passive material

Microfabricated RF capacitor

Glass thick film embedded passive material

Patents Applicationslast 30 patents

PATTERNING USING MONOMER BASED SACRIFICIAL MATERIAL LIFTOFF

CONDUCTIVE LINES FOR INTERCONNECTION IN STACKED DEVICE STRUCTURES

INLINE RESISTOR INTEGRATED WITH CONDUCTIVE CONTACT PAD STRUCTURE

RESILIENT CONDUCTIVE BUMP FOR MICROELECTRONIC TESTING

SYSTEM AND DEVICE INCLUDING MEMRISTOR MATERIAL

SYSTEM AND DEVICE INCLUDING MEMRISTOR MATERIAL

RECONSTITUTED WAFER INCLUDING INTEGRATED CIRCUIT DIE MECHANICALLY I...

RECONSTITUTED WAFER INCLUDING MOLD MATERIAL WITH RECESSED CONDUCTIV...

System and Device Including Memristor Material

System and Device Including Memristor Material

Controlled Warping of Shadow Mask Tooling for Improved Reliability...

ADDITIVELY MANUFACTURED SHADOW MASKS FOR MATERIAL DEPOSITION CONTROL

Controlled Induced Warping of Electronic Substrates via Electroplating

Controlled Induced Warping of Electronic Substrates

Chip-Scale Gyrometric Apparatus

GLASS THICK FILM EMBEDDED PASSIVE MATERIAL

Glass thick film embedded passive material