Navas Khan Oratti Kalandar

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a copper pillar interconnect structure
- Patent number 11,152,321
- Issue date Oct 19, 2021
- Infineon Technologies AG
- Carlo Marbella
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device Having a Copper Pillar Interconnect Structure
- Publication number 20200258855
- Publication date Aug 13, 2020
- Carlo Marbella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Package and a Method of Forming the Same
- Publication number 20130001795
- Publication date Jan 3, 2013
- Agency For Science, Technology and Research
- Teck Guan LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Arrangement and a Method of Manufacturing a Substrate Arr...
- Publication number 20120126419
- Publication date May 24, 2012
- Vaidyanathan Kripesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND A METHOD OF MANUFACTURING A SEMICONDUCT...
- Publication number 20120119390
- Publication date May 17, 2012
- Navas Khan Oratti Kalandar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE AND A METHOD FOR MANUFACTURING THE DIE PACKAGE
- Publication number 20110316117
- Publication date Dec 29, 2011
- Agency For Science, Technology and Research
- Vaidyanathan Kripesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF ASSEMBLING THE SAME
- Publication number 20100187682
- Publication date Jul 29, 2010
- Damaruganath Pinjala
- H01 - BASIC ELECTRIC ELEMENTS