Navinchandra Kalidas

Person

Houston, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Structure and method of high performance two layer ball grid array...
- Patent number 7,795,072
- Issue date Sep 14, 2010
- Texas Instruments Incorporated
- Michael A. Lamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile, chip-scale package and method of fabrication
- Patent number 7,309,648
- Issue date Dec 18, 2007
- Texas Instruments Incorporated
- Navinchandra Kalidas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile, chip-scale package and method of fabrication
- Patent number 7,135,781
- Issue date Nov 14, 2006
- Texas Instruments Incorporated
- Navinchandra Kalidas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of high performance two layer ball grid array...
- Patent number 6,995,037
- Issue date Feb 7, 2006
- Texas Instruments Incorporated
- Michael A. Lamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of high performance two layer ball grid array...
- Patent number 6,794,743
- Issue date Sep 21, 2004
- Texas Instruments Incorporated
- Michael A. Lamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid package with multiple power/ground planes
- Patent number 6,396,136
- Issue date May 28, 2002
- Texas Instruments Incorporated
- Navinchandra Kalidas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package
- Patent number 6,084,777
- Issue date Jul 4, 2000
- Texas Instruments Incorporated
- Navinchandra Kalidas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making plastic package for a surface mounted integrated c...
- Patent number 5,976,914
- Issue date Nov 2, 1999
- Texas Instruments Incorporated
- John H. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package having a deformable metal layer and method
- Patent number 5,895,967
- Issue date Apr 20, 1999
- Texas Instruments Incorporated
- William P. Stearns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic packaging for a surface mounted integrated circuit
- Patent number 5,777,382
- Issue date Jul 7, 1998
- Texas Instruments Incorporated
- John H. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intelligent electronic connection socket
- Patent number 4,540,226
- Issue date Sep 10, 1985
- Texas Instruments Incorporated
- Raymond W. Thompson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Structure and method of high performance two layer ball grid array...
- Publication number 20080195990
- Publication date Aug 14, 2008
- Michael A. Lamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Profile, Chip-Scale Package and Method of Fabrication
- Publication number 20070020808
- Publication date Jan 25, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Navinchandra Kalidas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Universal pattern of contact pads for semiconductor reflow intercon...
- Publication number 20060185895
- Publication date Aug 24, 2006
- Navinchandra Kalidas
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Structure and method of high performance two layer ball grid array...
- Publication number 20060063304
- Publication date Mar 23, 2006
- Michael A. Lamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low profile, chip-scale package and method of fabrication
- Publication number 20060033219
- Publication date Feb 16, 2006
- Navinchandra Kalidas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated interconnect package
- Publication number 20050093170
- Publication date May 5, 2005
- TEXAS INSTRUMENTS INCORPORATED
- Navinchandra Kalidas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method of high performance two layer ball grid array...
- Publication number 20040108586
- Publication date Jun 10, 2004
- Michael A. Lamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID PACKAGE WITH MULTIPLE POWER/ GROUND PLANES
- Publication number 20010013654
- Publication date Aug 16, 2001
- NAVINCHANDRA KALIDAS
- H01 - BASIC ELECTRIC ELEMENTS

Navinchandra Kalidas

Person

Patents Grantslast 30 patents

Structure and method of high performance two layer ball grid array...

Low profile, chip-scale package and method of fabrication

Low profile, chip-scale package and method of fabrication

Structure and method of high performance two layer ball grid array...

Structure and method of high performance two layer ball grid array...

Ball grid package with multiple power/ground planes

Ball grid array package

Method of making plastic package for a surface mounted integrated c...

Ball grid array package having a deformable metal layer and method

Plastic packaging for a surface mounted integrated circuit

Intelligent electronic connection socket

Patents Applicationslast 30 patents

Structure and method of high performance two layer ball grid array...

Low Profile, Chip-Scale Package and Method of Fabrication

Universal pattern of contact pads for semiconductor reflow intercon...

Structure and method of high performance two layer ball grid array...

Low profile, chip-scale package and method of fabrication

Integrated interconnect package

Structure and method of high performance two layer ball grid array...

BALL GRID PACKAGE WITH MULTIPLE POWER/ GROUND PLANES