Navneet Singh

Person

Bangalore, IN

People

Patents Grantslast 30 patents

Information Patent Grant
Socket interposer for system-in-package (SIP) module qualification...
- Patent number 12,025,971
- Issue date Jul 2, 2024
- Intel Corporation
- Navneet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for thermal management of electronic user dev...
- Patent number 11,966,268
- Issue date Apr 23, 2024
- Intel Corporation
- Columbia Mishra
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Grant
Shielding for circuit board
- Patent number D980842
- Issue date Mar 14, 2023
- Intel Corporation
- Prakash Kurma Raju
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
Thermal solutions for package on package (PoP) architectures
- Patent number 11,538,731
- Issue date Dec 27, 2022
- Intel Corporation
- Bijendra Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for thermal management of electronic user dev...
- Patent number 11,360,528
- Issue date Jun 14, 2022
- Intel Corporation
- Columbia Mishra
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of forming package structures for enhanced memory capacity...
- Patent number 10,734,393
- Issue date Aug 4, 2020
- Intel Corporation
- Navneet K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic interposer for a microelectronic package
- Patent number 10,720,407
- Issue date Jul 21, 2020
- Intel Corporation
- Navneet K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe connector for a probing pad structure around a thermal attach...
- Patent number 10,656,177
- Issue date May 19, 2020
- Intel Corporation
- Vikas Rao
- G01 - MEASURING TESTING
Information Patent Grant
Probe connector for a probing pad structure around a thermal attach...
- Patent number 10,317,428
- Issue date Jun 11, 2019
- Intel Corporation
- Vikas Rao
- G01 - MEASURING TESTING
Information Patent Grant
Microelectronic interposer for a microelectronic package
- Patent number 10,199,353
- Issue date Feb 5, 2019
- Intel Corporation
- Navneet K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming package structures for enhanced memory capacity...
- Patent number 10,177,161
- Issue date Jan 8, 2019
- Intel Corporation
- Navneet K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interactive text message advertisements
- Patent number 8,521,581
- Issue date Aug 27, 2013
- Google Inc.
- S. Srikanth Belwadi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS TO IMPROVE AUDIO QUALITY BASED ON LOAD IMPEDA...
- Publication number 20250008282
- Publication date Jan 2, 2025
- Intel Corporation
- Navneet Kumar Singh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Modular Printed Circuit Boards with Connectors
- Publication number 20240405459
- Publication date Dec 5, 2024
- Intel Corporation
- Navneet K. SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOR MEMORY ON PACKAGE WITH REDUCED THICKNESS
- Publication number 20240334715
- Publication date Oct 3, 2024
- Intel Corporation
- Navneet Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC USER DEV...
- Publication number 20240231454
- Publication date Jul 11, 2024
- Intel Corporation
- Columbia Mishra
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VARIABLE DIMENSION HEAT PIPE
- Publication number 20240175640
- Publication date May 30, 2024
- Intel Corporation
- Santosh Gangal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
AXIALLY ARRANGED COMMUNICATION AND THERMAL INTERCONNECTS FOR FOLDAB...
- Publication number 20240164063
- Publication date May 16, 2024
- Intel Corporation
- Samarth Alva
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE ARCHITECTURES WITH GLASS CORES FOR THICKNESS REDUCTION AND...
- Publication number 20240063203
- Publication date Feb 22, 2024
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGY TO RESOLVE CONNECTOR DAMAGE DUE TO ARCING
- Publication number 20240006873
- Publication date Jan 4, 2024
- Intel Corporation
- Navneet Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED ULTRA SLIM MODULE CONNECTOR
- Publication number 20230299516
- Publication date Sep 21, 2023
- Intel Corporation
- Amarjeet KUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PCB MLCC-INDUCED ACOUSTIC NOISE REDUCTION
- Publication number 20230269867
- Publication date Aug 24, 2023
- Intel Corporation
- Smit Kapila
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOCKET INTERPOSER FOR SYSTEM-IN-PACKAGE (SIP) MODULE QUALIFICATION...
- Publication number 20230251629
- Publication date Aug 10, 2023
- Intel Corporation
- Navneet SINGH
- G05 - CONTROLLING REGULATING
Information Patent Application
SEPARABLE ELECTRONICS DEVICE USING A MODULAR CONNECTION DEVICE
- Publication number 20220404862
- Publication date Dec 22, 2022
- Intel Corporation
- Prakash Kurma Raju
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC USER DEV...
- Publication number 20220350385
- Publication date Nov 3, 2022
- Intel Corporation
- Columbia Mishra
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS, SYSTEMS, AND RELATED METHODS FOR DISPLAY PANEL POWER SAV...
- Publication number 20220335910
- Publication date Oct 20, 2022
- Intel Corporation
- Praveen Kashyap Ananta Bhat
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COOLING SYSTEMS AND APPARATUS FOR ELECTRONIC DEVICES AND RELATED ME...
- Publication number 20220316692
- Publication date Oct 6, 2022
- Praveen Kashyap Ananta Bhat
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS AND METHOD FOR INTELLIGENT MEMORY PAGE MANAGEMENT
- Publication number 20220283951
- Publication date Sep 8, 2022
- Intel Corporation
- Neha PATHAPATI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrated Antenna Control Mechanism on LID with Lid Controller Hub
- Publication number 20220200127
- Publication date Jun 23, 2022
- Intel Corporation
- Jayprakash THAKUR
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TYPE-3 PRINTED CIRCUIT BOARDS (PCBS) WITH HYBRID LAYER COUNTS
- Publication number 20220095456
- Publication date Mar 24, 2022
- Intel Corporation
- Arumanayagam Rajasekar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMORY MODULE CONNECTOR FOR THIN COMPUTING SYSTEMS
- Publication number 20220077609
- Publication date Mar 10, 2022
- Intel Corporation
- Navneet Kumar SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERLESS OR GROUNDLESS ELECTROMAGNETIC SHIELDING IN ELECTRONIC DE...
- Publication number 20220015273
- Publication date Jan 13, 2022
- Intel Corporation
- Bala P. Subramanya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EXTERNAL COOLING SOLUTION FOR MOBILE COMPUTING DEVICES
- Publication number 20210350952
- Publication date Nov 11, 2021
- Navneet Kumar Singh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMAL SOLUTIONS FOR PACKAGE ON PACKAGE (POP) ARCHITECTURES
- Publication number 20200312736
- Publication date Oct 1, 2020
- Intel Corporation
- Bijendra SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC USER DEV...
- Publication number 20200133358
- Publication date Apr 30, 2020
- Intel Corporation
- Columbia Mishra
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PROBE CONNECTOR FOR A PROBING PAD STRUCTURE AROUND A THERMAL ATTACH...
- Publication number 20190271720
- Publication date Sep 5, 2019
- Intel Corporation
- Vikas Rao
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE PACKAGE
- Publication number 20190206839
- Publication date Jul 4, 2019
- Intel Corporation
- Ranjul Balakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC INTERPOSER FOR A MICROELECTRONIC PACKAGE
- Publication number 20190109115
- Publication date Apr 11, 2019
- Intel Corporation
- Navneet K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING PACKAGE STRUCTURES FOR ENHANCED MEMORY CAPACITY...
- Publication number 20190074281
- Publication date Mar 7, 2019
- Intel Corporation
- Navneet K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING PACKAGE STRUCTURES FOR ENHANCED MEMORY CAPACITY...
- Publication number 20180182734
- Publication date Jun 28, 2018
- Intel Corporation
- Navneet K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE CONNECTOR FOR A PROBING PAD STRUCTURE AROUND A THERMAL ATTACH...
- Publication number 20180120347
- Publication date May 3, 2018
- Intel Corporation
- Vikas Rao
- G01 - MEASURING TESTING
Information Patent Application
MICROELECTRONIC INTERPOSER FOR A MICROELECTRONIC PACKAGE
- Publication number 20180076171
- Publication date Mar 15, 2018
- Intel Corporation
- Navneet K. Singh
- H01 - BASIC ELECTRIC ELEMENTS

Navneet Singh

Person

Patents Grantslast 30 patents

Socket interposer for system-in-package (SIP) module qualification...

Apparatus and methods for thermal management of electronic user dev...

Shielding for circuit board

Thermal solutions for package on package (PoP) architectures

Apparatus and methods for thermal management of electronic user dev...

Methods of forming package structures for enhanced memory capacity...

Microelectronic interposer for a microelectronic package

Probe connector for a probing pad structure around a thermal attach...

Probe connector for a probing pad structure around a thermal attach...

Microelectronic interposer for a microelectronic package

Methods of forming package structures for enhanced memory capacity...

Interactive text message advertisements

Patents Applicationslast 30 patents

METHODS AND APPARATUS TO IMPROVE AUDIO QUALITY BASED ON LOAD IMPEDA...

Modular Printed Circuit Boards with Connectors

FOR MEMORY ON PACKAGE WITH REDUCED THICKNESS

APPARATUS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC USER DEV...

VARIABLE DIMENSION HEAT PIPE

AXIALLY ARRANGED COMMUNICATION AND THERMAL INTERCONNECTS FOR FOLDAB...

PACKAGE ARCHITECTURES WITH GLASS CORES FOR THICKNESS REDUCTION AND...

TECHNOLOGY TO RESOLVE CONNECTOR DAMAGE DUE TO ARCING

DOUBLE-SIDED ULTRA SLIM MODULE CONNECTOR

PCB MLCC-INDUCED ACOUSTIC NOISE REDUCTION

SOCKET INTERPOSER FOR SYSTEM-IN-PACKAGE (SIP) MODULE QUALIFICATION...

SEPARABLE ELECTRONICS DEVICE USING A MODULAR CONNECTION DEVICE

APPARATUS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC USER DEV...

APPARATUS, SYSTEMS, AND RELATED METHODS FOR DISPLAY PANEL POWER SAV...

COOLING SYSTEMS AND APPARATUS FOR ELECTRONIC DEVICES AND RELATED ME...

APPARATUS AND METHOD FOR INTELLIGENT MEMORY PAGE MANAGEMENT

Integrated Antenna Control Mechanism on LID with Lid Controller Hub

TYPE-3 PRINTED CIRCUIT BOARDS (PCBS) WITH HYBRID LAYER COUNTS

MEMORY MODULE CONNECTOR FOR THIN COMPUTING SYSTEMS

SOLDERLESS OR GROUNDLESS ELECTROMAGNETIC SHIELDING IN ELECTRONIC DE...

EXTERNAL COOLING SOLUTION FOR MOBILE COMPUTING DEVICES

THERMAL SOLUTIONS FOR PACKAGE ON PACKAGE (POP) ARCHITECTURES

APPARATUS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC USER DEV...

PROBE CONNECTOR FOR A PROBING PAD STRUCTURE AROUND A THERMAL ATTACH...

ELECTRONIC DEVICE PACKAGE

MICROELECTRONIC INTERPOSER FOR A MICROELECTRONIC PACKAGE

METHODS OF FORMING PACKAGE STRUCTURES FOR ENHANCED MEMORY CAPACITY...

METHODS OF FORMING PACKAGE STRUCTURES FOR ENHANCED MEMORY CAPACITY...

PROBE CONNECTOR FOR A PROBING PAD STRUCTURE AROUND A THERMAL ATTACH...

MICROELECTRONIC INTERPOSER FOR A MICROELECTRONIC PACKAGE