Nazila Dadvand

Person

Richardson, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Chemically anchored mold compounds in semiconductor packages
- Patent number 12,180,595
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor package with nickel-silver pre-plated leadframe
- Patent number 12,154,845
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filler particles for polymers
- Patent number 12,139,569
- Issue date Nov 12, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Die attach surface copper layer with protective layer for microelec...
- Patent number 12,074,096
- Issue date Aug 27, 2024
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating for thermal management
- Patent number 12,068,221
- Issue date Aug 20, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming brass-coated metals in flip-chip redistribution l...
- Patent number 11,984,418
- Issue date May 14, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SP2-bonded carbon structures
- Patent number 11,938,715
- Issue date Mar 26, 2024
- Texas Instruments Incorporated
- Luigi Colombo
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Quad flat no-lead package with wettable flanges
- Patent number 11,935,821
- Issue date Mar 19, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal die attach to substrate with multi-...
- Patent number 11,908,776
- Issue date Feb 20, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive wafer layer
- Patent number 11,854,933
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with nickel-silver pre-plated leadframe
- Patent number 11,848,258
- Issue date Dec 19, 2023
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pitch leads
- Patent number 11,694,947
- Issue date Jul 4, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nickel alloy for semiconductor packaging
- Patent number 11,594,504
- Issue date Feb 28, 2023
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zinc-cobalt barrier for interface in solder bond applications
- Patent number 11,587,858
- Issue date Feb 21, 2023
- Texas Instruments Incorporated
- Nazila Dadvand
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Zinc layer for a semiconductor die pillar
- Patent number 11,443,996
- Issue date Sep 13, 2022
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Brass-coated metals in flip-chip redistribution layers
- Patent number 11,410,947
- Issue date Aug 9, 2022
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered SP2-bonded carbon tubes
- Patent number 11,390,527
- Issue date Jul 19, 2022
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Hexagonal boron nitride structures
- Patent number 11,370,662
- Issue date Jun 28, 2022
- Texas Instruments Incorporated
- Luigi Colombo
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Nanoparticle matrix for backside heat spreading
- Patent number 11,355,414
- Issue date Jun 7, 2022
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-super lattice for switchable arrays
- Patent number 11,309,388
- Issue date Apr 19, 2022
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless packaged device with metal die attach
- Patent number 11,282,770
- Issue date Mar 22, 2022
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Filler particles for polymers
- Patent number 11,254,775
- Issue date Feb 22, 2022
- Texas Instruments Incorporated
- Nazila Dadvand
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Lattice bump interconnect
- Patent number 11,145,598
- Issue date Oct 12, 2021
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanostructure barrier for copper wire bonding
- Patent number 11,127,515
- Issue date Sep 21, 2021
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with conversion coating
- Patent number 11,121,076
- Issue date Sep 14, 2021
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pitch leads
- Patent number 11,094,616
- Issue date Aug 17, 2021
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nickel lanthanide alloys for MEMS packaging applications
- Patent number 11,091,366
- Issue date Aug 17, 2021
- Texas Instruments Incorporated
- Nazila Dadvand
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Metal-graphene structures forming a lattice of interconnected segments
- Patent number 11,063,120
- Issue date Jul 13, 2021
- Texas Instruments Incorporated
- Luigi Colombo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nickel alloy for semiconductor packaging
- Patent number 11,011,483
- Issue date May 18, 2021
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zinc-cobalt barrier for interface in solder bond applications
- Patent number 11,011,488
- Issue date May 18, 2021
- Texas Instruments Incorporated
- Nazila Dadvand
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...
- Publication number 20240421045
- Publication date Dec 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH POST MOLD PLATED NICKEL TUNGSTEN AND TIN BIL...
- Publication number 20240363504
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEUTRAL pH COPPER PLATING SOLUTION FOR UNDERCUT REDUCTION
- Publication number 20240279835
- Publication date Aug 22, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SP2-Bonded Carbon Structures
- Publication number 20240246317
- Publication date Jul 25, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Luigi COLOMBO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THERMALLY CONDUCTIVE WAFER LAYER
- Publication number 20240153841
- Publication date May 9, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME
- Publication number 20240153853
- Publication date May 9, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH IMPROVED BOARD LEVEL RELIABILITY
- Publication number 20230298982
- Publication date Sep 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILVER- AND GOLD-PLATED CONDUCTIVE MEMBERS
- Publication number 20230275050
- Publication date Aug 31, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Nazila DADVAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICALLY ANCHORED MOLD COMPOUNDS IN SEMICONDUCTOR PACKAGES
- Publication number 20230272536
- Publication date Aug 31, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Nazila DADVAND
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GAS SENSOR WITH SUPERLATTICE STRUCTURE
- Publication number 20230243770
- Publication date Aug 3, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Archana VENUGOPAL
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICE WITH WETTABLE FLANK LEAD
- Publication number 20230114872
- Publication date Apr 13, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Zinc Layer For A Semiconductor Die Pillar
- Publication number 20230005807
- Publication date Jan 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS
- Publication number 20220384375
- Publication date Dec 1, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEXAGONAL BORON NITRIDE STRUCTURES
- Publication number 20220250909
- Publication date Aug 11, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Luigi COLOMBO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THERMALLY CONDUCTIVE WAFER LAYER
- Publication number 20220208640
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME
- Publication number 20220208665
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLER PARTICLES FOR POLYMERS
- Publication number 20220169773
- Publication date Jun 2, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Nazila DADVAND
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MULTILAYERS OF NICKEL ALLOYS AS DIFFUSION BARRIER LAYERS
- Publication number 20220173062
- Publication date Jun 2, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH CONVERSION COATING
- Publication number 20220005760
- Publication date Jan 6, 2022
- TEXAS INSTRUMENTS INCORPORATED
- NAZILA DADVAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PITCH LEADS
- Publication number 20210375729
- Publication date Dec 2, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ZINC-COBALT BARRIER FOR INTERFACE IN SOLDER BOND APPLICATIONS
- Publication number 20210280547
- Publication date Sep 9, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NIckel Alloy for Semiconductor Packaging
- Publication number 20210242151
- Publication date Aug 5, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Quad Flat No-Lead Package with Wettable Flanges
- Publication number 20210210419
- Publication date Jul 8, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS
- Publication number 20210193600
- Publication date Jun 24, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH METAL DIE ATTACH TO SUBSTRATE WITH MULTI-...
- Publication number 20210125902
- Publication date Apr 29, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOPARTICLE MATRIX FOR BACKSIDE HEAT SPREADING
- Publication number 20210098331
- Publication date Apr 1, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PITCH LEADS
- Publication number 20210050287
- Publication date Feb 18, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTACT FABRICATION TO MITIGATE UNDERCUT
- Publication number 20210028060
- Publication date Jan 28, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS PACKAGED DEVICE WITH METAL DIE ATTACH
- Publication number 20210013133
- Publication date Jan 14, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MICROELECTRONIC DEVICE WITH SOLDER-FREE PLATED LEADS
- Publication number 20210013167
- Publication date Jan 14, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS

Nazila Dadvand

Person

Patents Grantslast 30 patents

Chemically anchored mold compounds in semiconductor packages

Semiconductor package with nickel-silver pre-plated leadframe

Filler particles for polymers

Die attach surface copper layer with protective layer for microelec...

Plating for thermal management

Method of forming brass-coated metals in flip-chip redistribution l...

SP2-bonded carbon structures

Quad flat no-lead package with wettable flanges

Semiconductor device with metal die attach to substrate with multi-...

Thermally conductive wafer layer

Semiconductor package with nickel-silver pre-plated leadframe

Multi-pitch leads

Nickel alloy for semiconductor packaging

Zinc-cobalt barrier for interface in solder bond applications

Zinc layer for a semiconductor die pillar

Brass-coated metals in flip-chip redistribution layers

Multi-layered SP2-bonded carbon tubes

Hexagonal boron nitride structures

Nanoparticle matrix for backside heat spreading

Multi-super lattice for switchable arrays

Leadless packaged device with metal die attach

Filler particles for polymers

Lattice bump interconnect

Nanostructure barrier for copper wire bonding

Semiconductor die with conversion coating

Multi-pitch leads

Nickel lanthanide alloys for MEMS packaging applications

Metal-graphene structures forming a lattice of interconnected segments

Nickel alloy for semiconductor packaging

Zinc-cobalt barrier for interface in solder bond applications

Patents Applicationslast 30 patents

DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...

ELECTRONIC DEVICE WITH POST MOLD PLATED NICKEL TUNGSTEN AND TIN BIL...

NEUTRAL pH COPPER PLATING SOLUTION FOR UNDERCUT REDUCTION

SP2-Bonded Carbon Structures

THERMALLY CONDUCTIVE WAFER LAYER

SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME

ELECTRONIC DEVICE WITH IMPROVED BOARD LEVEL RELIABILITY

SILVER- AND GOLD-PLATED CONDUCTIVE MEMBERS

CHEMICALLY ANCHORED MOLD COMPOUNDS IN SEMICONDUCTOR PACKAGES

GAS SENSOR WITH SUPERLATTICE STRUCTURE

ELECTRONIC DEVICE WITH WETTABLE FLANK LEAD

Zinc Layer For A Semiconductor Die Pillar

BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS

HEXAGONAL BORON NITRIDE STRUCTURES

THERMALLY CONDUCTIVE WAFER LAYER

SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME

FILLER PARTICLES FOR POLYMERS

MULTILAYERS OF NICKEL ALLOYS AS DIFFUSION BARRIER LAYERS

SEMICONDUCTOR DIE WITH CONVERSION COATING

MULTI-PITCH LEADS

ZINC-COBALT BARRIER FOR INTERFACE IN SOLDER BOND APPLICATIONS

NIckel Alloy for Semiconductor Packaging

Quad Flat No-Lead Package with Wettable Flanges

BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS

SEMICONDUCTOR DEVICE WITH METAL DIE ATTACH TO SUBSTRATE WITH MULTI-...

NANOPARTICLE MATRIX FOR BACKSIDE HEAT SPREADING

MULTI-PITCH LEADS

CONTACT FABRICATION TO MITIGATE UNDERCUT

LEADLESS PACKAGED DEVICE WITH METAL DIE ATTACH

MICROELECTRONIC DEVICE WITH SOLDER-FREE PLATED LEADS