Neal W. Meyer

Person

Corvallis, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
In-plane optical wave guide with area based splitter
- Patent number 8,526,771
- Issue date Sep 3, 2013
- Hewlett-Packard Development Company, L.P.
- Neal Meyer
- G02 - OPTICS
Information Patent Grant
Printhead and method of fabricating the same
- Patent number 8,388,112
- Issue date Mar 5, 2013
- Hewlett-Packard Development Company, L.P.
- Peter Mardilovich
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
3D interconnect with protruding contacts
- Patent number 7,833,830
- Issue date Nov 16, 2010
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuel cell with film having nanowires therein
- Patent number 7,790,331
- Issue date Sep 7, 2010
- Hewlett-Packard Development Company, L.P.
- David Champion
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Bonding an interconnect to a circuit device and related devices
- Patent number 7,716,823
- Issue date May 18, 2010
- Hewlett-Packard Development Company, L.P.
- Neal Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanowire Filament
- Patent number 7,294,899
- Issue date Nov 13, 2007
- Hewlett-Packard Development Company, L.P.
- Neal W. Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D interconnect with protruding contacts
- Patent number 7,262,495
- Issue date Aug 28, 2007
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Displacement sensing by comparing matrices of pointwise measurements
- Patent number 7,082,378
- Issue date Jul 25, 2006
- Hewlett-Packard Development Company, L.P.
- Carl E. Picciotto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Storage structure with cleaved layer
- Patent number 6,967,149
- Issue date Nov 22, 2005
- Hewlett-Packard Development Company, L.P.
- Neal W. Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanowire filament
- Patent number 6,936,496
- Issue date Aug 30, 2005
- Hewlett-Packard Development Company, L.P.
- Neal W. Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tunnel-junction structures and methods
- Patent number 6,821,848
- Issue date Nov 23, 2004
- Hewlett-Packard Development Company, L.P.
- Dennis Lazaroff
- G11 - INFORMATION STORAGE
Information Patent Grant
Phase change material electronic memory structure and method for fo...
- Patent number 6,605,821
- Issue date Aug 12, 2003
- Hewlett-Packard Development Company, L.P.
- Heon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inkjet printhead assembly
- Patent number 6,471,340
- Issue date Oct 29, 2002
- Hewlett-Packard Company
- Neal W. Meyer
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Ink-jet printhead
- Patent number 6,315,393
- Issue date Nov 13, 2001
- Hewlett-Packard Company
- Harold Lee Van Nice
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
High efficiency orifice plate structure and printhead using the same
- Patent number 6,290,331
- Issue date Sep 18, 2001
- Hewlett-Packard Company
- Arun K. Agarwal
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Printhead structure and method for producing the same
- Patent number 6,155,675
- Issue date Dec 5, 2000
- Hewlett-Packard Company
- Lee Van Nice
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
High efficiency orifice plate structure and printhead using the same
- Patent number 6,130,688
- Issue date Oct 10, 2000
- Hewlett-Packard Company
- Arun K Agarwal
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Printhead for an inkjet cartridge and method for producing the same
- Patent number 6,062,679
- Issue date May 16, 2000
- Hewlett-Packard Company
- Neal W. Meyer
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method for assembling an ink-jet pen having a double-sided electric...
- Patent number 5,937,494
- Issue date Aug 17, 1999
- Hewlett-Packard Company
- Neal Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printhead with unpassivated heater resistors having increased resis...
- Patent number 5,682,188
- Issue date Oct 28, 1997
- Hewlett-Packard Company
- Neal W. Meyer
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of forming a heating element for a printhead
- Patent number 5,636,441
- Issue date Jun 10, 1997
- Hewlett-Packard Company
- Neal W. Meyer
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Double-sided electrical interconnect flexible circuit for ink-jet h...
- Patent number 5,612,511
- Issue date Mar 18, 1997
- Hewlett-Packard Company
- Neal Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient conductor routing for inkjet printhead
- Patent number 5,300,959
- Issue date Apr 5, 1994
- Hewlett-Packard Company
- Paul H. McClelland
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

Information Patent Application
PRINTHEAD AND METHOD OF FABRICATING THE SAME
- Publication number 20110310182
- Publication date Dec 22, 2011
- Hewlett-Packard Development Company, L.P.
- Peter Mardilovich
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
IN-PLANE OPTICAL WAVE GUIDE WITH AREA BASED SPLITTER
- Publication number 20110150390
- Publication date Jun 23, 2011
- Neal Meyer
- G02 - OPTICS
Information Patent Application
Methods For Fabrication Of Large Core Hollow Waveguides
- Publication number 20110084047
- Publication date Apr 14, 2011
- Jong-Souk Yeo
- G02 - OPTICS
Information Patent Application
3D Interconnect with Protruding Contacts
- Publication number 20070254405
- Publication date Nov 1, 2007
- Chien-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Displacement sensing by comparing matrices of pointwise measurements
- Publication number 20060106567
- Publication date May 18, 2006
- Carl E. Picciotto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Nanowire filament
- Publication number 20060076644
- Publication date Apr 13, 2006
- Neal W. Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D interconnect with protruding contacts
- Publication number 20060076664
- Publication date Apr 13, 2006
- Chien-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding an interconnect to a circuit device and related devices
- Publication number 20050223552
- Publication date Oct 13, 2005
- Neal Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Storage structure with cleaved layer
- Publication number 20050112846
- Publication date May 26, 2005
- Neal W. Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for applying electrodes or electrolytes to a substrate
- Publication number 20040265483
- Publication date Dec 30, 2004
- Neal W. Meyer
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Nanowire filament
- Publication number 20040121509
- Publication date Jun 24, 2004
- Neal W. Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tunnel-junction structures and methods
- Publication number 20030186468
- Publication date Oct 2, 2003
- Dennis Lazaroff
- G11 - INFORMATION STORAGE
Information Patent Application
INKJET PRINTHEAD ASSEMBLY
- Publication number 20020109755
- Publication date Aug 15, 2002
- Neal W. Meyer
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Neal W. Meyer

Person

Patents Grantslast 30 patents

In-plane optical wave guide with area based splitter

Printhead and method of fabricating the same

3D interconnect with protruding contacts

Fuel cell with film having nanowires therein

Bonding an interconnect to a circuit device and related devices

Nanowire Filament

3D interconnect with protruding contacts

Displacement sensing by comparing matrices of pointwise measurements

Storage structure with cleaved layer

Nanowire filament

Tunnel-junction structures and methods

Phase change material electronic memory structure and method for fo...

Inkjet printhead assembly

Ink-jet printhead

High efficiency orifice plate structure and printhead using the same

Printhead structure and method for producing the same

High efficiency orifice plate structure and printhead using the same

Printhead for an inkjet cartridge and method for producing the same

Method for assembling an ink-jet pen having a double-sided electric...

Printhead with unpassivated heater resistors having increased resis...

Method of forming a heating element for a printhead

Double-sided electrical interconnect flexible circuit for ink-jet h...

Efficient conductor routing for inkjet printhead

Patents Applicationslast 30 patents

PRINTHEAD AND METHOD OF FABRICATING THE SAME

IN-PLANE OPTICAL WAVE GUIDE WITH AREA BASED SPLITTER

Methods For Fabrication Of Large Core Hollow Waveguides

3D Interconnect with Protruding Contacts

Displacement sensing by comparing matrices of pointwise measurements

Nanowire filament

3D interconnect with protruding contacts

Bonding an interconnect to a circuit device and related devices

Storage structure with cleaved layer

Methods for applying electrodes or electrolytes to a substrate

Nanowire filament

Tunnel-junction structures and methods

INKJET PRINTHEAD ASSEMBLY