Neil McLellan

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit board with corner hollows
- Patent number 9,867,282
- Issue date Jan 9, 2018
- ATI Technologies ULC
- Suming Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating semiconductor chip solder structures
- Patent number 9,318,457
- Issue date Apr 19, 2016
- ATI Technologies ULC
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating semiconductor chip solder structures
- Patent number 9,142,520
- Issue date Sep 22, 2015
- ATI Technologies ULC
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management of stacked semiconductor chips with electrically...
- Patent number 8,704,353
- Issue date Apr 22, 2014
- Advanced Micro Devices, Inc.
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with underfill anchors
- Patent number 8,633,599
- Issue date Jan 21, 2014
- ATI Technologies ULC
- Roden Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board component shim structure
- Patent number 8,564,122
- Issue date Oct 22, 2013
- Advanced Micro Devices, Inc.
- Neil R. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor bump method and apparatus
- Patent number 8,294,266
- Issue date Oct 23, 2012
- Advanced Micro Devices, Inc.
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR CHIP SOLDER STRUCTURES
- Publication number 20150340334
- Publication date Nov 26, 2015
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD WITH CORNER HOLLOWS
- Publication number 20150049441
- Publication date Feb 19, 2015
- Suming Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE WITH ONBOARD TEST STRUCTURE
- Publication number 20130342231
- Publication date Dec 26, 2013
- Michael Alfano
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR CHIP DEVICE WITH VENTED LID
- Publication number 20130258610
- Publication date Oct 3, 2013
- Jianguo Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT OF STACKED SEMICONDUCTOR CHIPS WITH ELECTRICALLY...
- Publication number 20130256872
- Publication date Oct 3, 2013
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT
- Publication number 20130256895
- Publication date Oct 3, 2013
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP DEVICE WITH FRAGMENTED SOLDER STRUCTURE PADS
- Publication number 20130256871
- Publication date Oct 3, 2013
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACKING WITH COUPLED ELECTRICAL INTERCONNECTS TO ALIGN PROXIMI...
- Publication number 20130256913
- Publication date Oct 3, 2013
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH UNDERFILL ANCHORS
- Publication number 20130154122
- Publication date Jun 20, 2013
- Roden Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD COMPONENT SHIM STRUCTURE
- Publication number 20130147012
- Publication date Jun 13, 2013
- Neil R. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE WITH MOLDED SUPPORT LAYER
- Publication number 20130113084
- Publication date May 9, 2013
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR CHIP SOLDER STRUCTURES
- Publication number 20130049190
- Publication date Feb 28, 2013
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS

Neil McLellan

Person

Patents Grantslast 30 patents

Circuit board with corner hollows

Methods of fabricating semiconductor chip solder structures

Methods of fabricating semiconductor chip solder structures

Thermal management of stacked semiconductor chips with electrically...

Semiconductor chip with underfill anchors

Circuit board component shim structure

Conductor bump method and apparatus

Patents Applicationslast 30 patents

METHODS OF FABRICATING SEMICONDUCTOR CHIP SOLDER STRUCTURES

CIRCUIT BOARD WITH CORNER HOLLOWS

SEMICONDUCTOR SUBSTRATE WITH ONBOARD TEST STRUCTURE

SEMICONDUCTOR CHIP DEVICE WITH VENTED LID

THERMAL MANAGEMENT OF STACKED SEMICONDUCTOR CHIPS WITH ELECTRICALLY...

STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT

SEMICONDUCTOR CHIP DEVICE WITH FRAGMENTED SOLDER STRUCTURE PADS

DIE STACKING WITH COUPLED ELECTRICAL INTERCONNECTS TO ALIGN PROXIMI...

SEMICONDUCTOR CHIP WITH UNDERFILL ANCHORS

CIRCUIT BOARD COMPONENT SHIM STRUCTURE

SEMICONDUCTOR SUBSTRATE WITH MOLDED SUPPORT LAYER

METHODS OF FABRICATING SEMICONDUCTOR CHIP SOLDER STRUCTURES