TREA

Neil R. McLellan

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  • Dallas, TX, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Replaceable power module
    • Patent number 6,020,634
    • Issue date Feb 1, 2000
    • Dallas Semiconductor Corporation
    • Mark A. Gerber
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Thermal protection of electrical elements systems
    • Patent number 6,021,046
    • Issue date Feb 1, 2000
    • Dallas Semiconductor Corporation
    • Neil McLellan
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of providing thermal protection of electrical elements
    • Patent number 5,913,552
    • Issue date Jun 22, 1999
    • Dallas Semiconductor Corporation
    • Neil McLellan
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Power cap
    • Patent number 5,892,304
    • Issue date Apr 6, 1999
    • Dallas Semiconductor
    • Neil McLellan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Replaceable power module
    • Patent number 5,821,619
    • Issue date Oct 13, 1998
    • Dallas Semiconductor Corp.
    • Mark A. Gerber
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Power cap
    • Patent number 5,682,068
    • Issue date Oct 28, 1997
    • Dallas Semiconductor Corp.
    • Neil McLellan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Power cap cover
    • Patent number D384336
    • Issue date Sep 30, 1997
    • Dallas Semiconductor Corporation
    • Mark A. Gerber
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Method of assembling electronic component
    • Patent number 5,647,121
    • Issue date Jul 15, 1997
    • Dallas Semiconductor Corporation
    • Neil McLellan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Enhanced low profile sockets and module systems
    • Patent number 5,579,206
    • Issue date Nov 26, 1996
    • Dallas Semiconductor Corporation
    • Neil McLellan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Low profile sockets and modules for surface mountable applications
    • Patent number 5,528,463
    • Issue date Jun 18, 1996
    • Dallas Semiconductor Corp.
    • Neil McLellan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Flexible film semiconductor package
    • Patent number 5,130,783
    • Issue date Jul 14, 1992
    • Texas Instruments Incorporated
    • Neil R. McLellan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Delayed reflow alloy mix solder paste
    • Patent number 4,921,550
    • Issue date May 1, 1990
    • Texas Instruments Incorporated
    • Neil R. McLellan
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Delayed reflow alloy mix solder paste
    • Patent number 4,865,654
    • Issue date Sep 12, 1989
    • Texas Instruments Incorporated
    • Neil R. McLellan
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Delayed reflow alloy mix solder paste
    • Patent number 4,767,471
    • Issue date Aug 30, 1988
    • Texas Instruments Incorporated
    • Neil R. McLellan
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR