Neil T. Tracht

Person

Mesa, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interface between a semiconductor die and a waveguide, where the in...
- Patent number 9,666,930
- Issue date May 30, 2017
- NXP USA, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistributed chip packaging with thermal contact to device backside
- Patent number 8,217,511
- Issue date Jul 10, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Neil T. Tracht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with back side metallization and method fo...
- Patent number 7,723,224
- Issue date May 25, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Darrell G. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-gate enhancement mode RF switch and bias arrangement
- Patent number 7,504,677
- Issue date Mar 17, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Elizabeth C. Glass
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Enhancement mode transceiver and switched gain amplifier integrated...
- Patent number 7,345,545
- Issue date Mar 18, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Elizabeth C. Glass
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Integrated circuit capacitor having a conductive trench
- Patent number 5,574,621
- Issue date Nov 12, 1996
- Motorola, Inc.
- Kurt K. Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a vertical trench inductor
- Patent number 5,372,967
- Issue date Dec 13, 1994
- Motorola, Inc.
- Lalgudi M. G. Sundaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical trench inductor
- Patent number 5,336,921
- Issue date Aug 9, 1994
- Motorola, Inc.
- Lalgudi M. G. Sundaram
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20250062217
- Publication date Feb 20, 2025
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CAVITY CARRIER AND METHOD THEREFOR
- Publication number 20240234222
- Publication date Jul 11, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CAVITY CARRIER AND METHOD THEREFOR
- Publication number 20240136238
- Publication date Apr 25, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT WAVEGUIDE INTERFACE AND METHODS THEREOF
- Publication number 20160118705
- Publication date Apr 28, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTED CHIP PACKAGING WITH THERMAL CONTACT TO DEVICE BACKSIDE
- Publication number 20120252169
- Publication date Oct 4, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Neil T. Tracht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTED CHIP PACKAGING WITH THERMAL CONTACT TO DEVICE BACKSIDE
- Publication number 20090032933
- Publication date Feb 5, 2009
- Neil T. Tracht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic assembly with back side metallization and method fo...
- Publication number 20070293033
- Publication date Dec 20, 2007
- Darrell G. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhancement mode transceiver and switched gain amplifier integrated...
- Publication number 20060217078
- Publication date Sep 28, 2006
- Elizabeth C. Glass
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Multi-gate enhancement mode RF switch and bias arrangement
- Publication number 20060214238
- Publication date Sep 28, 2006
- Elizabeth C. Glass
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Neil T. Tracht

Person

Patents Grantslast 30 patents

Interface between a semiconductor die and a waveguide, where the in...

Redistributed chip packaging with thermal contact to device backside

Microelectronic assembly with back side metallization and method fo...

Multi-gate enhancement mode RF switch and bias arrangement

Enhancement mode transceiver and switched gain amplifier integrated...

Integrated circuit capacitor having a conductive trench

Method for fabricating a vertical trench inductor

Vertical trench inductor

Patents Applicationslast 30 patents

PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING

SEMICONDUCTOR DEVICE WITH CAVITY CARRIER AND METHOD THEREFOR

SEMICONDUCTOR DEVICE WITH CAVITY CARRIER AND METHOD THEREFOR

PACKAGED INTEGRATED CIRCUIT WAVEGUIDE INTERFACE AND METHODS THEREOF

REDISTRIBUTED CHIP PACKAGING WITH THERMAL CONTACT TO DEVICE BACKSIDE

REDISTRIBUTED CHIP PACKAGING WITH THERMAL CONTACT TO DEVICE BACKSIDE

Microelectronic assembly with back side metallization and method fo...

Enhancement mode transceiver and switched gain amplifier integrated...

Multi-gate enhancement mode RF switch and bias arrangement