Neo Chee Peng

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit devices with stacked package interposers
- Patent number 8,058,716
- Issue date Nov 15, 2011
- Micron Technology, Inc.
- Chew Beng Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices with stacked package interposers
- Patent number 7,622,798
- Issue date Nov 24, 2009
- Micron Technology, Inc.
- Chew Beng Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic component assemblies employing lead frames having r...
- Patent number 7,425,470
- Issue date Sep 16, 2008
- Micron Technology, Inc.
- Neo Chee Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic component assemblies employing lead frames having r...
- Patent number 7,057,281
- Issue date Jun 6, 2006
- Micron Technology Inc.
- Neo Chee Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for cutting semiconductor wafers
- Patent number 7,018,270
- Issue date Mar 28, 2006
- Micron Technology, Inc.
- Neo Chee Peng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
In-process tape bur monitoring
- Patent number 7,004,054
- Issue date Feb 28, 2006
- Micron Technology, Inc.
- Neo Chee Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for cutting semiconductor wafers
- Patent number 6,939,199
- Issue date Sep 6, 2005
- Micron Technology, Inc.
- Neo Chee Peng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
In-process tape bur monitoring
- Patent number 6,845,695
- Issue date Jan 25, 2005
- Micron Technology, Inc.
- Neo Chee Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dicing device and method
- Patent number 6,737,606
- Issue date May 18, 2004
- Micron Technology, Inc.
- Neo Chee Peng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for cutting semiconductor wafers
- Patent number 6,576,531
- Issue date Jun 10, 2003
- Micron Technology, Inc.
- Neo Chee Peng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Integrated Circuit Devices with Stacked Package Interposers
- Publication number 20100065955
- Publication date Mar 18, 2010
- Micron Technology, Inc.
- Chew Beng Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method And System For Removing Tape From Substrates
- Publication number 20080308221
- Publication date Dec 18, 2008
- Tan Kian Shing Michael
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Integrated circuit devices with stacked package interposers
- Publication number 20070246840
- Publication date Oct 25, 2007
- Micron Technology, Inc.
- Chew Beng Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for cutting semiconductor wafers
- Publication number 20050268763
- Publication date Dec 8, 2005
- Neo Chee Peng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microelectronic component assemblies employing lead frames having r...
- Publication number 20050012185
- Publication date Jan 20, 2005
- Neo Chee Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer dicing device and method
- Publication number 20040188400
- Publication date Sep 30, 2004
- Micron Technology, Inc.
- Neo Chee Peng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microelectronic component assemblies employing lead frames having r...
- Publication number 20040173899
- Publication date Sep 9, 2004
- Neo Chee Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In-process tape bur monitoring
- Publication number 20030209117
- Publication date Nov 13, 2003
- Neo Chee Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for cutting semiconductor wafers
- Publication number 20030203538
- Publication date Oct 30, 2003
- Neo Chee Peng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR CUTTING SEMICONDUCTOR WAFERS
- Publication number 20030060022
- Publication date Mar 27, 2003
- Neo Chee Peng
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Wafer dicing device and method
- Publication number 20030047543
- Publication date Mar 13, 2003
- Micron Technology, Inc.
- Neo Chee Peng
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
In-process tape bur monitoring
- Publication number 20020083810
- Publication date Jul 4, 2002
- Neo Chee Peng
- H01 - BASIC ELECTRIC ELEMENTS

Neo Chee Peng

Person

Patents Grantslast 30 patents

Integrated circuit devices with stacked package interposers

Integrated circuit devices with stacked package interposers

Microelectronic component assemblies employing lead frames having r...

Microelectronic component assemblies employing lead frames having r...

Method and apparatus for cutting semiconductor wafers

In-process tape bur monitoring

Method and apparatus for cutting semiconductor wafers

In-process tape bur monitoring

Wafer dicing device and method

Method for cutting semiconductor wafers

Patents Applicationslast 30 patents

Integrated Circuit Devices with Stacked Package Interposers

Method And System For Removing Tape From Substrates

Integrated circuit devices with stacked package interposers

Method and apparatus for cutting semiconductor wafers

Microelectronic component assemblies employing lead frames having r...

Wafer dicing device and method

Microelectronic component assemblies employing lead frames having r...

In-process tape bur monitoring

Method and apparatus for cutting semiconductor wafers

METHOD FOR CUTTING SEMICONDUCTOR WAFERS

Wafer dicing device and method

In-process tape bur monitoring