Nghia Thuc TU

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thin foil semiconductor package
- Patent number 8,857,047
- Issue date Oct 14, 2014
- Texas Instruments Incorporated
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Foil plating for semiconductor packaging
- Patent number 8,747,640
- Issue date Jun 10, 2014
- Texas Instruments Incorporated
- Jaime Bayan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Foil-based method for packaging intergrated circuits
- Patent number 8,389,334
- Issue date Mar 5, 2013
- National Semiconductor Corporation
- Aninyda Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Foil plating for semiconductor packaging
- Patent number 8,377,267
- Issue date Feb 19, 2013
- National Semiconductor Corporation
- Jaime A. Bayan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of making foil based semiconductor package
- Patent number 8,375,577
- Issue date Feb 19, 2013
- National Semiconductor Corporation
- Will Wong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Thin foil semiconductor package
- Patent number 8,341,828
- Issue date Jan 1, 2013
- National Semiconductor Corporation
- Jaime A. Bayan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and leadframe for packaging integrated circuits
- Patent number 8,298,871
- Issue date Oct 30, 2012
- National Semiconductor Corporation
- Will K. Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microarray package with plated contact pedestals
- Patent number 8,293,573
- Issue date Oct 23, 2012
- Texas Instruments Incorporated
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Foil based semiconductor package
- Patent number 8,101,470
- Issue date Jan 24, 2012
- National Semiconductor Corporation
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microarray package with plated contact pedestals
- Patent number 7,893,523
- Issue date Feb 22, 2011
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach method and leadframe structure
- Patent number 7,859,090
- Issue date Dec 28, 2010
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal lead frame for micro-array packages
- Patent number 7,846,775
- Issue date Dec 7, 2010
- National Semiconductor Corporation
- Shaw Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin foil semiconductor package
- Patent number 7,836,586
- Issue date Nov 23, 2010
- National Semiconductor Corporation
- Jaime A. Bayan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Microarray package with plated contact pedestals
- Patent number 7,671,452
- Issue date Mar 2, 2010
- National Semiconductor Corporation
- Jaime Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach method and microarray leadframe structure
- Patent number 7,598,122
- Issue date Oct 6, 2009
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gang flipping for IC packaging
- Patent number 7,491,625
- Issue date Feb 17, 2009
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for miniature semiconductor packages
- Patent number 7,419,855
- Issue date Sep 2, 2008
- National Semiconductor Corporation
- Shaw Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for miniature semiconductor packages
- Patent number 7,161,232
- Issue date Jan 9, 2007
- National Semiconductor Corporation
- Shaw Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for dicing semiconductor wafers
- Patent number 6,933,212
- Issue date Aug 23, 2005
- National Semiconductor Corporation
- Shaw Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless package
- Patent number 6,723,585
- Issue date Apr 20, 2004
- National Semiconductor Corporation
- Nghia Tu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Foil Plating for Semiconductor Packaging
- Publication number 20130026043
- Publication date Jan 31, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Jaime Bayan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
BACKMETAL REPLACEMENT FOR USE IN THE PACKAGING OF INTEGRATED CIRCUITS
- Publication number 20120074561
- Publication date Mar 29, 2012
- National Semiconductor Corporation
- Nghia T. TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FOIL SEMICONDUCTOR PACKAGE
- Publication number 20120043660
- Publication date Feb 23, 2012
- National Semiconductor Corporation
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ABLATION ALTERNATIVE TO LOW COST LEADFRAME PROCESS
- Publication number 20110269269
- Publication date Nov 3, 2011
- National Semiconductor Corporation
- Nghia T. TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND LEADFRAME FOR PACKAGING INTEGRATED CIRCUITS
- Publication number 20110104854
- Publication date May 5, 2011
- National Semiconductor Corporation
- Will K. Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOIL BASED SEMICONDUCTOR PACKAGE
- Publication number 20110074003
- Publication date Mar 31, 2011
- National Semiconductor Corporation
- Anindya PODDAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOIL PLATING FOR SEMICONDUCTOR PACKAGING
- Publication number 20110073481
- Publication date Mar 31, 2011
- National Semiconductor Corporation
- Jaime A. BAYAN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
THIN FOIL SEMICONDUCTOR PACKAGE
- Publication number 20110023293
- Publication date Feb 3, 2011
- National Semiconductor Corporation
- Jaime A. BAYAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROARRAY PACKAGE WITH PLATED CONTACT PEDESTALS
- Publication number 20100136749
- Publication date Jun 3, 2010
- National Semiconductor Corporation
- Jaime BAYAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROARRAY PACKAGE WITH PLATED CONTACT PEDESTALS
- Publication number 20100117206
- Publication date May 13, 2010
- National Semiconductor Corporation
- Jaime BAYAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FOIL FOR USE IN PACKAGING INTEGRATED CIRCUITS
- Publication number 20100084748
- Publication date Apr 8, 2010
- National Semiconductor Corporation
- Anindya PODDAR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN FOIL SEMICONDUCTOR PACKAGE
- Publication number 20100046188
- Publication date Feb 25, 2010
- National Semiconductor Corporation
- Jaime A. BAYAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH METHOD AND LEADFRAME STRUCTURE
- Publication number 20090315161
- Publication date Dec 24, 2009
- National Semiconductor Corporation
- Jaime A. BAYAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOIL BASED SEMICONDUCTOR PACKAGE
- Publication number 20090305076
- Publication date Dec 10, 2009
- National Semiconductor Corporation
- Will Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND LEADFRAME FOR PACKAGING INTEGRATED CIRCUITS
- Publication number 20090160039
- Publication date Jun 25, 2009
- National Semiconductor Corporation
- Will K. WONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING INTEGRATED CIRCUITS
- Publication number 20080290482
- Publication date Nov 27, 2008
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GANG FLIPPING FOR IC PACKAGING
- Publication number 20080241993
- Publication date Oct 2, 2008
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS

Nghia Thuc TU

Person

Patents Grantslast 30 patents

Thin foil semiconductor package

Foil plating for semiconductor packaging

Foil-based method for packaging intergrated circuits

Foil plating for semiconductor packaging

Method of making foil based semiconductor package

Thin foil semiconductor package

Method and leadframe for packaging integrated circuits

Microarray package with plated contact pedestals

Foil based semiconductor package

Microarray package with plated contact pedestals

Die attach method and leadframe structure

Universal lead frame for micro-array packages

Thin foil semiconductor package

Microarray package with plated contact pedestals

Die attach method and microarray leadframe structure

Gang flipping for IC packaging

Apparatus and method for miniature semiconductor packages

Apparatus and method for miniature semiconductor packages

Apparatus and method for dicing semiconductor wafers

Leadless package

Patents Applicationslast 30 patents

Foil Plating for Semiconductor Packaging

BACKMETAL REPLACEMENT FOR USE IN THE PACKAGING OF INTEGRATED CIRCUITS

THIN FOIL SEMICONDUCTOR PACKAGE

LASER ABLATION ALTERNATIVE TO LOW COST LEADFRAME PROCESS

METHOD AND LEADFRAME FOR PACKAGING INTEGRATED CIRCUITS

FOIL BASED SEMICONDUCTOR PACKAGE

FOIL PLATING FOR SEMICONDUCTOR PACKAGING

THIN FOIL SEMICONDUCTOR PACKAGE

MICROARRAY PACKAGE WITH PLATED CONTACT PEDESTALS

MICROARRAY PACKAGE WITH PLATED CONTACT PEDESTALS

THIN FOIL FOR USE IN PACKAGING INTEGRATED CIRCUITS

THIN FOIL SEMICONDUCTOR PACKAGE

DIE ATTACH METHOD AND LEADFRAME STRUCTURE

FOIL BASED SEMICONDUCTOR PACKAGE

METHOD AND LEADFRAME FOR PACKAGING INTEGRATED CIRCUITS

METHOD OF PACKAGING INTEGRATED CIRCUITS

GANG FLIPPING FOR IC PACKAGING