Nicholas THOMSON

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Gate-all-around integrated circuit structures having devices with s...
- Patent number 11,908,856
- Issue date Feb 20, 2024
- Intel Corporation
- Biswajeet Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around integrated circuit structures having adjacent deep...
- Patent number 11,837,641
- Issue date Dec 5, 2023
- Intel Corporation
- Biswajeet Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around integrated circuit structures having devices with c...
- Patent number 11,824,116
- Issue date Nov 21, 2023
- Intel Corporation
- Biswajeet Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structures including backside vias
- Patent number 11,791,331
- Issue date Oct 17, 2023
- Intel Corporation
- Nicholas A. Thomson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate-less FinFET diode architectures with backside metal conta...
- Patent number 11,652,107
- Issue date May 16, 2023
- Intel Corporation
- Nicholas Thomson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field-effect transistors with dual thickness gate dielectrics
- Patent number 11,145,732
- Issue date Oct 12, 2021
- Intel Corporation
- Ayan Kar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BACKSIDE CONDUCTIVE STRUCTURES EXTENDING THROUGH INTEGRATED CIRCUIT...
- Publication number 20240355915
- Publication date Oct 24, 2024
- Intel Corporation
- Leonard P. Guler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACTED SUB-FIN DIODES
- Publication number 20240170581
- Publication date May 23, 2024
- Intel Corporation
- Cheng-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DEVICES WITH S...
- Publication number 20240145471
- Publication date May 2, 2024
- Intel Corporation
- Biswajeet GUHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIODES WITH BACKSIDE CONTACT
- Publication number 20240088131
- Publication date Mar 14, 2024
- Intel Corporation
- Nicholas A. Thomson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR DEVICES WITH INTEGRATED DIODES
- Publication number 20240088133
- Publication date Mar 14, 2024
- Intel Corporation
- Nicholas A. Thomson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TARGETED SUB-FIN ETCH DEPTH
- Publication number 20240088134
- Publication date Mar 14, 2024
- Intel Corporation
- Nicholas A. Thomson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDE CHANNEL DIODE STRUCTURE INCLUDING SUB-FIN
- Publication number 20240088132
- Publication date Mar 14, 2024
- Intel Corporation
- Nicholas A. Thomson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR DEVICES WITH EXTENDED DRAIN
- Publication number 20240088136
- Publication date Mar 14, 2024
- Intel Corporation
- Ayan Kar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING ADJACENT DEEP...
- Publication number 20240055497
- Publication date Feb 15, 2024
- Intel Corporation
- Biswajeet GUHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DEVICES WITH C...
- Publication number 20240038889
- Publication date Feb 1, 2024
- Intel Corporation
- Biswajeet GUHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARACTOR DEVICE WITH BACKSIDE ELECTRICAL CONTACT
- Publication number 20230420578
- Publication date Dec 28, 2023
- Intel Corporation
- Ayan Kar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH DIODES INTEGRATED IN SUBFINS
- Publication number 20230420443
- Publication date Dec 28, 2023
- Nicholas A. Thomson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES INCLUDING BACKSIDE VIAS
- Publication number 20230402449
- Publication date Dec 14, 2023
- Intel Corporation
- Nicholas A. Thomson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERAL DIODES IN STACKED TRANSISTOR TECHNOLOGIES
- Publication number 20230087444
- Publication date Mar 23, 2023
- Intel Corporation
- Nicholas A. Thomson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL DIODES IN STACKED TRANSISTOR TECHNOLOGIES
- Publication number 20230089395
- Publication date Mar 23, 2023
- Intel Corporation
- Benjamin Orr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERAL DIODES IN STACKED TRANSISTOR TECHNOLOGIES
- Publication number 20230088578
- Publication date Mar 23, 2023
- Intel Corporation
- Nicholas A. Thomson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-LESS SILICON CONTROLLED RECTIFIER (SCR) INTEGRATED CIRCUI...
- Publication number 20220415881
- Publication date Dec 29, 2022
- Intel Corporation
- Rui MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-LESS LATERAL DIODE INTEGRATED CIRCUIT STRUCTURES
- Publication number 20220415925
- Publication date Dec 29, 2022
- Intel Corporation
- Nicholas THOMSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-LESS NANOWIRE-BASED LATERAL DIODE INTEGRATED CIRCUIT STRU...
- Publication number 20220416022
- Publication date Dec 29, 2022
- Intel Corporation
- Nicholas THOMSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE PROTECTION DIODE FOR BACK-SIDE POWER DELIVE...
- Publication number 20220415877
- Publication date Dec 29, 2022
- Intel Corporation
- Benjamin Orr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-LESS DIODE, BIPOLAR AND FEEDTHROUGH INTEGRATED CIRCUIT ST...
- Publication number 20220415880
- Publication date Dec 29, 2022
- Intel Corporation
- Ayan KAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL ESD PROTECTION DECOUPLED FROM DIFFUSION
- Publication number 20220199609
- Publication date Jun 23, 2022
- Intel Corporation
- Urusa ALAAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-FREE INTEGRATED CIRCUIT STRUCTURES
- Publication number 20220102385
- Publication date Mar 31, 2022
- Intel Corporation
- Biswajeet GUHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES INCLUDING BACKSIDE VIAS
- Publication number 20220077140
- Publication date Mar 10, 2022
- Intel Corporation
- Nicholas A. Thomson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES INCLUDING BACKSIDE VIAS
- Publication number 20210202472
- Publication date Jul 1, 2021
- Intel Corporation
- Nicholas A. Thomson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DEVICES WITH S...
- Publication number 20210193652
- Publication date Jun 24, 2021
- Intel Corporation
- Biswajeet GUHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING ADJACENT DEEP...
- Publication number 20210193807
- Publication date Jun 24, 2021
- Intel Corporation
- Biswajeet GUHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DEVICES WITH C...
- Publication number 20210193836
- Publication date Jun 24, 2021
- Intel Corporation
- Biswajeet GUHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD-EFFECT TRANSISTORS WITH DUAL THICKNESS GATE DIELECTRICS
- Publication number 20210167180
- Publication date Jun 3, 2021
- Intel Corporation
- Ayan Kar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-LESS FINFET DIODE ARCHITECTURES WITH BACKSIDE METAL CONTA...
- Publication number 20200403007
- Publication date Dec 24, 2020
- Intel Corporation
- Nicholas THOMSON
- H01 - BASIC ELECTRIC ELEMENTS

Nicholas THOMSON

Person

Patents Grantslast 30 patents

Gate-all-around integrated circuit structures having devices with s...

Gate-all-around integrated circuit structures having adjacent deep...

Gate-all-around integrated circuit structures having devices with c...

Integrated circuit structures including backside vias

Substrate-less FinFET diode architectures with backside metal conta...

Field-effect transistors with dual thickness gate dielectrics

Patents Applicationslast 30 patents

BACKSIDE CONDUCTIVE STRUCTURES EXTENDING THROUGH INTEGRATED CIRCUIT...

BACKSIDE CONTACTED SUB-FIN DIODES

GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DEVICES WITH S...

DIODES WITH BACKSIDE CONTACT

TRANSISTOR DEVICES WITH INTEGRATED DIODES

TARGETED SUB-FIN ETCH DEPTH

WIDE CHANNEL DIODE STRUCTURE INCLUDING SUB-FIN

TRANSISTOR DEVICES WITH EXTENDED DRAIN

GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING ADJACENT DEEP...

GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DEVICES WITH C...

VARACTOR DEVICE WITH BACKSIDE ELECTRICAL CONTACT

INTEGRATED CIRCUIT DEVICES WITH DIODES INTEGRATED IN SUBFINS

INTEGRATED CIRCUIT STRUCTURES INCLUDING BACKSIDE VIAS

LATERAL DIODES IN STACKED TRANSISTOR TECHNOLOGIES

VERTICAL DIODES IN STACKED TRANSISTOR TECHNOLOGIES

LATERAL DIODES IN STACKED TRANSISTOR TECHNOLOGIES

SUBSTRATE-LESS SILICON CONTROLLED RECTIFIER (SCR) INTEGRATED CIRCUI...

SUBSTRATE-LESS LATERAL DIODE INTEGRATED CIRCUIT STRUCTURES

SUBSTRATE-LESS NANOWIRE-BASED LATERAL DIODE INTEGRATED CIRCUIT STRU...

ELECTROSTATIC DISCHARGE PROTECTION DIODE FOR BACK-SIDE POWER DELIVE...

SUBSTRATE-LESS DIODE, BIPOLAR AND FEEDTHROUGH INTEGRATED CIRCUIT ST...

NOVEL ESD PROTECTION DECOUPLED FROM DIFFUSION

SUBSTRATE-FREE INTEGRATED CIRCUIT STRUCTURES

INTEGRATED CIRCUIT STRUCTURES INCLUDING BACKSIDE VIAS

INTEGRATED CIRCUIT STRUCTURES INCLUDING BACKSIDE VIAS

GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DEVICES WITH S...

GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING ADJACENT DEEP...

GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DEVICES WITH C...

FIELD-EFFECT TRANSISTORS WITH DUAL THICKNESS GATE DIELECTRICS

SUBSTRATE-LESS FINFET DIODE ARCHITECTURES WITH BACKSIDE METAL CONTA...