Nien-Tsung Tsai

Person

Hsin-Chu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Antenna cover adapted to modify antenna pattern
- Patent number 11,600,917
- Issue date Mar 7, 2023
- Alpha Networks Inc.
- Yi Ju Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-electro-mechanical system and manufacturing method thereof
- Patent number 10,273,148
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor devices and methods of manufacture thereof
- Patent number 10,269,743
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structure and process
- Patent number 9,502,370
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structure and process
- Patent number 9,281,287
- Issue date Mar 8, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor hole structure
- Patent number 8,895,447
- Issue date Nov 25, 2014
- Macronix International Co., Ltd.
- Nien-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structure and process
- Patent number 8,878,355
- Issue date Nov 4, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of planarizing spin-on material layer and manufacturing phot...
- Patent number 6,998,277
- Issue date Feb 14, 2006
- ProMos Technologies, Inc.
- Jefferson Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for etching a trench through an anti-reflective coating
- Patent number 6,743,726
- Issue date Jun 1, 2004
- ProMos Technologies, Inc.
- Jefferson Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming shallow trench
- Patent number 6,514,817
- Issue date Feb 4, 2003
- ProMos Technologies Inc.
- Nien-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming tungsten interconnect and vias without tungsten l...
- Patent number 6,410,417
- Issue date Jun 25, 2002
- ProMos Technologies, Inc.
- Nien-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method for reducing bit line coupling in a DRAM
- Patent number 6,312,983
- Issue date Nov 6, 2001
- ProMos Technologies, Inc.
- Joseph Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench bottle-shaped etching using Cl2 gas
- Patent number 6,306,772
- Issue date Oct 23, 2001
- ProMos Technology, Inc
- Ming-Horng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming tungsten interconnect with tungsten oxidation to...
- Patent number 6,143,653
- Issue date Nov 7, 2000
- ProMOS Technologies, Inc.
- Nien-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench bottle-shaped etch in centura mark II NG
- Patent number 6,071,823
- Issue date Jun 6, 2000
- ProMos Technology, Inc
- Lin Ming Hung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ANTENNA COVER ADAPTED TO MODIFY ANTENNA PATTERN
- Publication number 20220294110
- Publication date Sep 15, 2022
- Alpha Networks Inc.
- YI JU LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture Thereof
- Publication number 20190244919
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture Thereof
- Publication number 20170221843
- Publication date Aug 3, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20170044004
- Publication date Feb 16, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEN CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Bonding Structure and Process
- Publication number 20160163670
- Publication date Jun 9, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Bonding Structure and Process
- Publication number 20150054161
- Publication date Feb 26, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Bonding Structure and Process
- Publication number 20140117510
- Publication date May 1, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR HOLE STRUCTURE
- Publication number 20140070373
- Publication date Mar 13, 2014
- Macronix International Co., Ltd.
- Nien-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND MANUFACTURING METHOD FOR REDUCING STRESS OF CHIP
- Publication number 20130214424
- Publication date Aug 22, 2013
- Nien-Yu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PLANARIZING SPIN-ON MATERIAL LAYER AND MANUFACTURING PHOT...
- Publication number 20050196879
- Publication date Sep 8, 2005
- Jefferson Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of reducing wafer etching defect
- Publication number 20040067654
- Publication date Apr 8, 2004
- ProMOS Technologies, Inc.
- Chun-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for etching a trench through an anti-reflective coating
- Publication number 20040009672
- Publication date Jan 15, 2004
- ProMOS Technologies, Inc.
- Jefferson Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming gate structure
- Publication number 20030059996
- Publication date Mar 27, 2003
- ProMos Technologies Inc.
- Nien-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for controlling etching depth
- Publication number 20020142613
- Publication date Oct 3, 2002
- Ching-Hung Fu
- G01 - MEASURING TESTING
Information Patent Application
ETCHING GAS FOR SILICON ETCH BACK
- Publication number 20020066884
- Publication date Jun 6, 2002
- NIEN-YU TSAI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Nien-Tsung Tsai

Person

Patents Grantslast 30 patents

Antenna cover adapted to modify antenna pattern

Micro-electro-mechanical system and manufacturing method thereof

Semiconductor devices and methods of manufacture thereof

Semiconductor bonding structure and process

Semiconductor bonding structure and process

Semiconductor hole structure

Semiconductor bonding structure and process

Method of planarizing spin-on material layer and manufacturing phot...

Method for etching a trench through an anti-reflective coating

Method of forming shallow trench

Method of forming tungsten interconnect and vias without tungsten l...

Etching method for reducing bit line coupling in a DRAM

Deep trench bottle-shaped etching using Cl2 gas

Method of forming tungsten interconnect with tungsten oxidation to...

Deep trench bottle-shaped etch in centura mark II NG

Patents Applicationslast 30 patents

ANTENNA COVER ADAPTED TO MODIFY ANTENNA PATTERN

Semiconductor Devices and Methods of Manufacture Thereof

Semiconductor Devices and Methods of Manufacture Thereof

MICRO-ELECTRO-MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

Semiconductor Bonding Structure and Process

Semiconductor Bonding Structure and Process

Semiconductor Bonding Structure and Process

SEMICONDUCTOR HOLE STRUCTURE

STRUCTURE AND MANUFACTURING METHOD FOR REDUCING STRESS OF CHIP

METHOD OF PLANARIZING SPIN-ON MATERIAL LAYER AND MANUFACTURING PHOT...

Method of reducing wafer etching defect

Method for etching a trench through an anti-reflective coating

Method for forming gate structure

Method for controlling etching depth

ETCHING GAS FOR SILICON ETCH BACK