Nils Magnus Lundberg

Person

Hollviken, SE

People

Patents Grantslast 30 patents

Information Patent Grant
Fingerprint sensing module and method for manufacturing the fingerp...
- Patent number 11,610,429
- Issue date Mar 21, 2023
- Fingerprint Cards Anacatum IP AB
- Nils Lundberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fingerprint sensing module and method for manufacturing the fingerp...
- Patent number 11,023,702
- Issue date Jun 1, 2021
- Fingerprint Cards AB
- Nils Lundberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fingerprint sensing module and method for manufacturing the fingerp...
- Patent number 10,395,164
- Issue date Aug 27, 2019
- FINGERPRINT CARDS AB
- Nils Lundberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermal package with heat slug for die stacks
- Patent number 9,129,929
- Issue date Sep 8, 2015
- Sony Corporation
- Nils Lundberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical signaling for a package-on-package stack
- Patent number 9,099,339
- Issue date Aug 4, 2015
- Sony Corporation
- Nils Magnus Lundberg
- G02 - OPTICS
Information Patent Grant
Optical signaling for a package-on-package stack
- Patent number 7,885,494
- Issue date Feb 8, 2011
- Sony Ericsson Mobile Communications AB
- Nils Magnus Lundberg
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
FINGERPRINT SENSING MODULE AND METHOD FOR MANUFACTURING THE FINGERP...
- Publication number 20210150175
- Publication date May 20, 2021
- Fingerprint Cards AB
- Nils LUNDBERG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FINGERPRINT SENSING MODULE AND METHOD FOR MANUFACTURING THE FINGERP...
- Publication number 20190340406
- Publication date Nov 7, 2019
- Fingerprint Cards AB
- Nils LUNDBERG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FINGERPRINT SENSING MODULE AND METHOD FOR MANUFACTURING THE FINGERP...
- Publication number 20180174018
- Publication date Jun 21, 2018
- Fingerprint Cards AB
- Nils LUNDBERG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR ASSEMBLY
- Publication number 20140159231
- Publication date Jun 12, 2014
- SONY MOBILE COMMUNICATIONS AB
- Nils Magnus Lundberg
- B82 - NANO-TECHNOLOGY
Information Patent Application
THERMAL PACKAGE WTH HEAT SLUG FOR DIE STACKS
- Publication number 20130277821
- Publication date Oct 24, 2013
- SONY MOBILE COMMUNICATIONS AB
- Nils LUNDBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SIGNALING FOR A PACKAGE-ON-PACKAGE STACK
- Publication number 20100002990
- Publication date Jan 7, 2010
- Sony Ericsson Mobile Communications AB
- Nils Magnus Lundberg
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR CHIP
- Publication number 20090218682
- Publication date Sep 3, 2009
- Nils LUNDBERG
- H01 - BASIC ELECTRIC ELEMENTS

Nils Magnus Lundberg

Person

Patents Grantslast 30 patents

Fingerprint sensing module and method for manufacturing the fingerp...

Fingerprint sensing module and method for manufacturing the fingerp...

Fingerprint sensing module and method for manufacturing the fingerp...

Thermal package with heat slug for die stacks

Optical signaling for a package-on-package stack

Optical signaling for a package-on-package stack

Patents Applicationslast 30 patents

FINGERPRINT SENSING MODULE AND METHOD FOR MANUFACTURING THE FINGERP...

FINGERPRINT SENSING MODULE AND METHOD FOR MANUFACTURING THE FINGERP...

FINGERPRINT SENSING MODULE AND METHOD FOR MANUFACTURING THE FINGERP...

SEMICONDUCTOR ASSEMBLY

THERMAL PACKAGE WTH HEAT SLUG FOR DIE STACKS

OPTICAL SIGNALING FOR A PACKAGE-ON-PACKAGE STACK

SEMICONDUCTOR CHIP