Ninao Sato

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Camera module
- Patent number 9,380,195
- Issue date Jun 28, 2016
- Kabushiki Kaisha Toshiba
- Kazuhiro Nagata
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Solid state imaging device and method for manufacturing solid state...
- Patent number 9,257,466
- Issue date Feb 9, 2016
- Kabushiki Kaisha Toshiba
- Kazuhiro Nagata
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Solid-state imaging apparatus and imaging system
- Patent number 9,231,004
- Issue date Jan 5, 2016
- Kabushiki Kaisha Toshiba
- Kazuhiro Nagata
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Camera module
- Patent number 9,100,560
- Issue date Aug 4, 2015
- Kabushiki Kaisha Toshiba
- Katsuo Iwata
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and producing method of the same
- Patent number 7,888,778
- Issue date Feb 15, 2011
- Kabushiki Kaisha Toshiba
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dividing a semiconductor wafer utilizing a laser dicing t...
- Patent number 7,138,297
- Issue date Nov 21, 2006
- Kabushiki Kaisha Toshiba
- Toshitsune Iijima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor wafer dividing method and apparatus
- Patent number 7,135,384
- Issue date Nov 14, 2006
- Kabushiki Kaisha Toshiba
- Shinya Takyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device obtained by dividing semiconductor wafer by us...
- Patent number 7,091,624
- Issue date Aug 15, 2006
- Kabushiki Kaisha Toshiba
- Toshitsune Iijima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor wafer dividing apparatus and semiconductor device man...
- Patent number 6,756,562
- Issue date Jun 29, 2004
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLID STATE IMAGING DEVICE AND CAMERA SYSTEM
- Publication number 20150264330
- Publication date Sep 17, 2015
- KABUSHIKI KAISHA TOSHIBA
- Takayuki OGASAHARA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CAMERA MODULE
- Publication number 20150264265
- Publication date Sep 17, 2015
- KABUSHIKI KAISHA TOSHIBA
- Katsuo Iwata
- G02 - OPTICS
Information Patent Application
IMAGE STABILIZER, CAMERA SYSTEM, AND IMAGING METHOD
- Publication number 20150168739
- Publication date Jun 18, 2015
- KABUSHIKI KAISHA TOSHIBA
- Takayuki Ogasahara
- G02 - OPTICS
Information Patent Application
SOLID-STATE IMAGING APPARATUS AND IMAGING SYSTEM
- Publication number 20150156431
- Publication date Jun 4, 2015
- KABUSHIKI KAISHA TOSHIBA
- Kazuhiro NAGATA
- G02 - OPTICS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND DIGITAL CAMERA
- Publication number 20150146034
- Publication date May 28, 2015
- KABUSHIKI KAISHA TOSHIBA
- Takayuki OGASAHARA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SOLID-STATE IMAGING DEVICE, DIGITAL CAMERA, AND IMAGE PROCESSING ME...
- Publication number 20150146046
- Publication date May 28, 2015
- KABUSHIKI KAISHA TOSHIBA
- Takayuki OGASAHARA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CAMERA MODULE
- Publication number 20150029369
- Publication date Jan 29, 2015
- Kabushiki Kaisha Toshiba
- Kazuhiro NAGATA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
OPTICAL SYSTEM OF ELECTRICAL EQUIPMENT, ELECTRICAL EQUIPMENT, AND O...
- Publication number 20140285688
- Publication date Sep 25, 2014
- KABUSHIKI KAISHA TOSHIBA
- Takayuki OGASAHARA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CAMERA MODULE
- Publication number 20140267844
- Publication date Sep 18, 2014
- KABUSHIKI KAISHA TOSHIBA
- Katsuo Iwata
- G02 - OPTICS
Information Patent Application
SOLID STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING SOLID STATE...
- Publication number 20140264690
- Publication date Sep 18, 2014
- KABUSHIKI KAISHA TOSHIBA
- Kazuhiro NAGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCING METHOD OF THE SAME
- Publication number 20090065906
- Publication date Mar 12, 2009
- Kabushiki Kaisha Toshiba
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20070235882
- Publication date Oct 11, 2007
- Kabushiki Kaisha Toshiba
- Masahiro Sekiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer dividing apparatus and semiconductor device man...
- Publication number 20050023260
- Publication date Feb 3, 2005
- Shinya Takyu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device obtained by dividing semiconductor wafer by us...
- Publication number 20050017326
- Publication date Jan 27, 2005
- Kabushiki Kaisha Toshiba
- Toshitsune Iijima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor wafer dividing method and apparatus
- Publication number 20040224483
- Publication date Nov 11, 2004
- Shinya Takyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device obtained by dividing semiconductor wafer by us...
- Publication number 20040137702
- Publication date Jul 15, 2004
- Toshitsune Iijima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Camera module

Solid state imaging device and method for manufacturing solid state...

Solid-state imaging apparatus and imaging system

Camera module

Semiconductor device and producing method of the same

Method of dividing a semiconductor wafer utilizing a laser dicing t...

Semiconductor wafer dividing method and apparatus

Semiconductor device obtained by dividing semiconductor wafer by us...

Semiconductor wafer dividing apparatus and semiconductor device man...

Patents Applicationslast 30 patents

SOLID STATE IMAGING DEVICE AND CAMERA SYSTEM

CAMERA MODULE

IMAGE STABILIZER, CAMERA SYSTEM, AND IMAGING METHOD

SOLID-STATE IMAGING APPARATUS AND IMAGING SYSTEM

SOLID-STATE IMAGING DEVICE AND DIGITAL CAMERA

SOLID-STATE IMAGING DEVICE, DIGITAL CAMERA, AND IMAGE PROCESSING ME...

CAMERA MODULE

OPTICAL SYSTEM OF ELECTRICAL EQUIPMENT, ELECTRICAL EQUIPMENT, AND O...

CAMERA MODULE

SOLID STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING SOLID STATE...

SEMICONDUCTOR DEVICE AND PRODUCING METHOD OF THE SAME

Semiconductor device and method for fabricating the same

Semiconductor wafer dividing apparatus and semiconductor device man...

Semiconductor device obtained by dividing semiconductor wafer by us...

Semiconductor wafer dividing method and apparatus

Semiconductor device obtained by dividing semiconductor wafer by us...