Ning Ye

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Beam manipulation of advanced charge controller module in a charged...
- Patent number 12,217,927
- Issue date Feb 4, 2025
- ASML Netherlands B.V.
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device including vertical contact...
- Patent number 12,154,860
- Issue date Nov 26, 2024
- SanDisk Technologies, Inc.
- Zhongli Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal-aided inspection by advanced charge controller module in a...
- Patent number 12,125,669
- Issue date Oct 22, 2024
- ASML Netherlands B.V.
- Ning Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for monitoring beam profile and power
- Patent number 12,105,036
- Issue date Oct 1, 2024
- ASML Netherlands B.V.
- Jian Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power reallocation for memory device
- Patent number 12,068,041
- Issue date Aug 20, 2024
- SanDisk Technologies, Inc.
- Shrikar Bhagath
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device including a suspended reinforcing layer and me...
- Patent number 12,033,958
- Issue date Jul 9, 2024
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective enclosure for an electronic device
- Patent number 12,016,111
- Issue date Jun 18, 2024
- Western Digital Technologies, Inc.
- Chun Sean Lau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Failed temperature sensor detection and mitigation within data stor...
- Patent number 12,013,749
- Issue date Jun 18, 2024
- Western Digital Technologies, Inc.
- Hedan Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Enclosure fitting for electronic device
- Patent number 11,985,782
- Issue date May 14, 2024
- Western Digital Technologies, Inc.
- Bo Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip bump with multi-PI opening
- Patent number 11,978,713
- Issue date May 7, 2024
- Western Digital Technologies, Inc.
- Shenghua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having multi-layer molding compound an...
- Patent number 11,961,778
- Issue date Apr 16, 2024
- Western Digital Technologies, Inc.
- Shenghua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with heat transfer pedestal having optimized inte...
- Patent number 11,908,495
- Issue date Feb 20, 2024
- Western Digital Technologies, Inc.
- Bo Yang
- G11 - INFORMATION STORAGE
Information Patent Grant
Thermal-aided inspection by advanced charge controller module in a...
- Patent number 11,728,131
- Issue date Aug 15, 2023
- ASML Netherlands B.V.
- Ning Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having cover portion with curved surfa...
- Patent number 11,551,991
- Issue date Jan 10, 2023
- Western Digital Technologies, Inc.
- Bo Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including reinforced corner supports
- Patent number 11,393,735
- Issue date Jul 19, 2022
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including magnetic hold-down layer
- Patent number 11,177,242
- Issue date Nov 16, 2021
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die singulation using a sacrificial bonding material...
- Patent number 10,854,573
- Issue date Dec 1, 2020
- SanDisk Technologies LLC
- Zhongli Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor device having a stacked die block
- Patent number 10,325,881
- Issue date Jun 18, 2019
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Suresh Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonded wide I/O semiconductor device
- Patent number 10,249,592
- Issue date Apr 2, 2019
- SanDisk Technologies LLC
- Michael Mostovoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including support pillars on solder mask
- Patent number 10,177,128
- Issue date Jan 8, 2019
- SanDisk Technologies LLC
- Chih Chin Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat assisted magnetic recording with an anisotropic heat sink
- Patent number 10,090,014
- Issue date Oct 2, 2018
- Western Digital Technologies, Inc.
- Antony Ajan
- G11 - INFORMATION STORAGE
Information Patent Grant
Wire bonded wide I/O semiconductor device
- Patent number 9,899,347
- Issue date Feb 20, 2018
- SanDisk Technologies LLC
- Michael Mostovoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including independent film layer for embedding...
- Patent number 9,773,766
- Issue date Sep 26, 2017
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Ning Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overheat prevention for annealing non-volatile memory
- Patent number 9,761,290
- Issue date Sep 12, 2017
- SanDisk Technologies LLC
- Navneeth Kankani
- G11 - INFORMATION STORAGE
Information Patent Grant
PCB circuit modification from multiple to individual chip enable si...
- Patent number 8,817,511
- Issue date Aug 26, 2014
- SanDisk Technologies Inc.
- Michael McCarthy
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of fabricating a memory card using SIP/SMT hybrid technology
- Patent number 8,728,864
- Issue date May 20, 2014
- SanDisk Technologies Inc.
- Ning Ye
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Two-sided substrate lead connection for minimizing kerf width on a...
- Patent number 8,637,972
- Issue date Jan 28, 2014
- SanDisk Technologies Inc.
- Chih-Chin Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a memory card using SiP/SMT hybrid technology
- Patent number 8,318,535
- Issue date Nov 27, 2012
- SanDisk Technologies Inc.
- Ning Ye
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of reducing memory card edge roughness by edge coating
- Patent number 7,994,647
- Issue date Aug 9, 2011
- SanDisk Technologies Inc.
- Ong King Hoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having through holes for molding back side of...
- Patent number 7,952,179
- Issue date May 31, 2011
- SanDisk Corporation
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VERTICALLY MOUNTABLE SNAP FIT BRACKET FOR ELECTROLYTIC CAPACITORS
- Publication number 20240413573
- Publication date Dec 12, 2024
- Western Digital Technologies, Inc.
- Shiqiang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SNAP FIT BRACKET FOR ELECTROLYTIC CAPACITORS
- Publication number 20240412922
- Publication date Dec 12, 2024
- Western Digital Technologies, Inc.
- Shiqiang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER REALLOCATION FOR MEMORY DEVICE
- Publication number 20240371447
- Publication date Nov 7, 2024
- SANDISK TECHNOLOGIES, INC.
- Shrikar Bhagath
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR CHIP HAVING A HIGH THERMAL LIQUID COOLANT
- Publication number 20240304518
- Publication date Sep 12, 2024
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH VARYING THICKNESS PROFILE
- Publication number 20240249950
- Publication date Jul 25, 2024
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAILED TEMPERATURE SENSOR DETECTION AND MITIGATION WITHIN DATA STOR...
- Publication number 20240004749
- Publication date Jan 4, 2024
- Western Digital Technologies, Inc.
- Hedan Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING REINFORCING BLOCKS
- Publication number 20230402361
- Publication date Dec 14, 2023
- Western Digital Technologies, Inc.
- Shenghua Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MECHANICAL SUPPORT FOR A TALL OFFSET DIE STACK
- Publication number 20230395446
- Publication date Dec 7, 2023
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL-AIDED INSPECTION BY ADVANCED CHARGE CONTROLLER MODULE IN A...
- Publication number 20230395352
- Publication date Dec 7, 2023
- ASML NETHERLANDS B.V.
- Ning YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip Chip Bump With Multi-PI Opening
- Publication number 20230378112
- Publication date Nov 23, 2023
- Western Digital Technologies, Inc.
- Shenghua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH HEAT TRANSFER PEDESTAL HAVING OPTIMIZED INTE...
- Publication number 20230343370
- Publication date Oct 26, 2023
- Western Digital Technologies, Inc.
- Bo Yang
- G11 - INFORMATION STORAGE
Information Patent Application
PROTECTIVE ENCLOSURE FOR AN ELECTRONIC DEVICE
- Publication number 20230345614
- Publication date Oct 26, 2023
- Western Digital Technologies, Inc.
- Chun Sean Lau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Enclosure fitting for electronic device
- Publication number 20230328910
- Publication date Oct 12, 2023
- Western Digital Technologies, Inc.
- Bo Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A SUSPENDED REINFORCING LAYER AND ME...
- Publication number 20230170312
- Publication date Jun 1, 2023
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package Having Multi-Layer Molding Compound an...
- Publication number 20230101826
- Publication date Mar 30, 2023
- Western Digital Technologies, Inc.
- Shenghua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICAL CONTACT FINGERS
- Publication number 20220406724
- Publication date Dec 22, 2022
- Western Digital Technologies, Inc.
- Zhongli Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHARGED PARTICLE INSPECTION SYSTEM AND METHOD USING MULTI-WAVELENGT...
- Publication number 20220375715
- Publication date Nov 24, 2022
- ASML NETHERLANDS B.V.
- Jian ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEAM MANIPULATION OF ADVANCED CHARGE CONTROLLER MODULE IN A CHARGED...
- Publication number 20220351932
- Publication date Nov 3, 2022
- ASML NETHERLANDS B.V.
- Jian ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER REALLOCATION FOR MEMORY DEVICE
- Publication number 20220293195
- Publication date Sep 15, 2022
- Western Digital Technologies, Inc.
- Shrikar Bhagath
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PHOTO-ELECTRICAL EVOLUTION DEFECT INSPECTION
- Publication number 20220270849
- Publication date Aug 25, 2022
- ASML NETHERLANDS B.V.
- Jun JIANG
- G01 - MEASURING TESTING
Information Patent Application
THERMAL-AIDED INSPECTION BY ADVANCED CHARGE CONTROLLER MODULE IN A...
- Publication number 20220189733
- Publication date Jun 16, 2022
- ASML NETHERLANDS B.V.
- Ning YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MONITORING BEAM PROFILE AND POWER
- Publication number 20220042935
- Publication date Feb 10, 2022
- ASML NETHERLANDS B.V.
- Jian ZHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING COVER PORTION WITH CURVED SURFA...
- Publication number 20210384099
- Publication date Dec 9, 2021
- Western Digital Technologies, Inc.
- Bo Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING MAGNETIC HOLD-DOWN LAYER
- Publication number 20200411477
- Publication date Dec 31, 2020
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE SINGULATION USING A SACRIFICIAL BONDING MATERIAL...
- Publication number 20200219842
- Publication date Jul 9, 2020
- SANDISK TECHNOLOGIES LLC
- Zhongli Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING REINFORCED CORNER SUPPORTS
- Publication number 20200006184
- Publication date Jan 2, 2020
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDED WIDE I/O SEMICONDUCTOR DEVICE
- Publication number 20180174996
- Publication date Jun 21, 2018
- SanDisk Technologies LLC
- Michael Mostovoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR DEVICE
- Publication number 20180047706
- Publication date Feb 15, 2018
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Suresh Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SUPPORT PILLARS ON SOLDER MASK
- Publication number 20160293560
- Publication date Oct 6, 2016
- SANDISK TECHNOLOGIES INC.
- Chih Chin Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING INDEPENDENT FILM LAYER FOR EMBEDDING...
- Publication number 20150221624
- Publication date Aug 6, 2015
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Ning Ye
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Beam manipulation of advanced charge controller module in a charged...

Method of forming a semiconductor device including vertical contact...

Thermal-aided inspection by advanced charge controller module in a...

Method and apparatus for monitoring beam profile and power

Power reallocation for memory device

Semiconductor device including a suspended reinforcing layer and me...

Protective enclosure for an electronic device

Failed temperature sensor detection and mitigation within data stor...

Enclosure fitting for electronic device

Flip chip bump with multi-PI opening

Semiconductor device package having multi-layer molding compound an...

Electronic device with heat transfer pedestal having optimized inte...

Thermal-aided inspection by advanced charge controller module in a...

Semiconductor device package having cover portion with curved surfa...

Semiconductor device including reinforced corner supports

Semiconductor device including magnetic hold-down layer

Semiconductor die singulation using a sacrificial bonding material...

Vertical semiconductor device having a stacked die block

Wire bonded wide I/O semiconductor device

Semiconductor device including support pillars on solder mask

Heat assisted magnetic recording with an anisotropic heat sink

Wire bonded wide I/O semiconductor device

Semiconductor device including independent film layer for embedding...

Overheat prevention for annealing non-volatile memory

PCB circuit modification from multiple to individual chip enable si...

Method of fabricating a memory card using SIP/SMT hybrid technology

Two-sided substrate lead connection for minimizing kerf width on a...

Method of fabricating a memory card using SiP/SMT hybrid technology

Method of reducing memory card edge roughness by edge coating

Semiconductor package having through holes for molding back side of...

Patents Applicationslast 30 patents

VERTICALLY MOUNTABLE SNAP FIT BRACKET FOR ELECTROLYTIC CAPACITORS

SNAP FIT BRACKET FOR ELECTROLYTIC CAPACITORS

POWER REALLOCATION FOR MEMORY DEVICE

SEMICONDUCTOR CHIP HAVING A HIGH THERMAL LIQUID COOLANT

SEMICONDUCTOR CHIP WITH VARYING THICKNESS PROFILE

FAILED TEMPERATURE SENSOR DETECTION AND MITIGATION WITHIN DATA STOR...

SEMICONDUCTOR DEVICE INCLUDING REINFORCING BLOCKS

MECHANICAL SUPPORT FOR A TALL OFFSET DIE STACK

THERMAL-AIDED INSPECTION BY ADVANCED CHARGE CONTROLLER MODULE IN A...

Flip Chip Bump With Multi-PI Opening

ELECTRONIC DEVICE WITH HEAT TRANSFER PEDESTAL HAVING OPTIMIZED INTE...

PROTECTIVE ENCLOSURE FOR AN ELECTRONIC DEVICE

Enclosure fitting for electronic device

SEMICONDUCTOR DEVICE INCLUDING A SUSPENDED REINFORCING LAYER AND ME...

Semiconductor Device Package Having Multi-Layer Molding Compound an...

SEMICONDUCTOR DEVICE INCLUDING VERTICAL CONTACT FINGERS

CHARGED PARTICLE INSPECTION SYSTEM AND METHOD USING MULTI-WAVELENGT...

BEAM MANIPULATION OF ADVANCED CHARGE CONTROLLER MODULE IN A CHARGED...

POWER REALLOCATION FOR MEMORY DEVICE

PHOTO-ELECTRICAL EVOLUTION DEFECT INSPECTION

THERMAL-AIDED INSPECTION BY ADVANCED CHARGE CONTROLLER MODULE IN A...

METHOD AND APPARATUS FOR MONITORING BEAM PROFILE AND POWER

SEMICONDUCTOR DEVICE PACKAGE HAVING COVER PORTION WITH CURVED SURFA...

SEMICONDUCTOR DEVICE INCLUDING MAGNETIC HOLD-DOWN LAYER

SEMICONDUCTOR DIE SINGULATION USING A SACRIFICIAL BONDING MATERIAL...

SEMICONDUCTOR DEVICE INCLUDING REINFORCED CORNER SUPPORTS

WIRE BONDED WIDE I/O SEMICONDUCTOR DEVICE

VERTICAL SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING SUPPORT PILLARS ON SOLDER MASK

SEMICONDUCTOR DEVICE INCLUDING INDEPENDENT FILM LAYER FOR EMBEDDING...