Nishihata Hideki

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing semiconductor substrate
- Patent number 8,183,133
- Issue date May 22, 2012
- Sumco Corporation
- Satoshi Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a bonded wafer
- Patent number 8,003,494
- Issue date Aug 23, 2011
- SUMCO Corporation
- Hideki Nishihata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling film thinning of semiconductor wafer for soli...
- Patent number 7,960,225
- Issue date Jun 14, 2011
- Sumco Corporation
- Etsurou Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing semiconductor substrate having an SOI structure
- Patent number 7,951,692
- Issue date May 31, 2011
- Sumco Corporation
- Satoshi Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing bonded silicon wafer
- Patent number 7,927,957
- Issue date Apr 19, 2011
- SUMCO Corporation
- Tatsumi Kusaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated substrate manufacturing method and laminated substrate ma...
- Patent number 7,858,494
- Issue date Dec 28, 2010
- Sumco Corporation
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor substrate
- Patent number 7,851,337
- Issue date Dec 14, 2010
- Sumco Corporation
- Satoshi Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing semiconductor substrate having an SOI structure
- Patent number 7,795,117
- Issue date Sep 14, 2010
- Sumco Corporation
- Satoshi Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing bonded wafer
- Patent number 7,713,842
- Issue date May 11, 2010
- Sumco Corporation
- Hideki Nishihata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded wafer
- Patent number 7,625,808
- Issue date Dec 1, 2009
- Sumco Corporation
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing SOI wafer
- Patent number 7,563,697
- Issue date Jul 21, 2009
- Sumco Corporation
- Nobuyuki Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for cleaning silicon substrate
- Patent number 7,534,728
- Issue date May 19, 2009
- Sumco Corporation
- Hideki Nishihata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing SOI wafer
- Patent number 7,510,948
- Issue date Mar 31, 2009
- Sumco Corporation
- Nobuyuki Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing bonded wafer
- Patent number 7,507,641
- Issue date Mar 24, 2009
- Sumco Corporation
- Nobuyuki Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacturing semiconductor substrates
- Patent number 7,485,874
- Issue date Feb 3, 2009
- Sumco Corporation
- Seiichi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SIMOX wafer and SIMOX wafer
- Patent number 7,410,877
- Issue date Aug 12, 2008
- Sumco Corporation
- Yoshiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing SOI wafer
- Patent number 7,358,147
- Issue date Apr 15, 2008
- Sumco Corporation
- Nobuyuki Morimoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF CONTROLLING FILM THINNING OF SEMICONDUCTOR WAFER FOR SOLI...
- Publication number 20110136267
- Publication date Jun 9, 2011
- SUMCO CORPORATION
- Etsurou MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL WAFER AND METHOD OF PRODUCING THE SAME
- Publication number 20110084367
- Publication date Apr 14, 2011
- SUMCO CORPORATION
- Hideki NISHIHATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE
- Publication number 20110027969
- Publication date Feb 3, 2011
- SUMCO CORPORATION
- Satoshi Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A BONDED WAFER
- Publication number 20100248447
- Publication date Sep 30, 2010
- SUMCO CORPORATION
- Hideki Nishihata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING BONDED WAFER
- Publication number 20100178750
- Publication date Jul 15, 2010
- SUMCO CORPORATION
- Satoshi Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING BONDED SILICON WAFER
- Publication number 20100068867
- Publication date Mar 18, 2010
- SUMCO CORPORATION
- Tatsumi Kusaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Producing Bonded Wafer
- Publication number 20090280621
- Publication date Nov 12, 2009
- SUMCO CORPORATION
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing bonded wafer
- Publication number 20090186464
- Publication date Jul 23, 2009
- SUMCO CORPORATION
- Nobuyuki Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SOI SUBSTRATE
- Publication number 20090117708
- Publication date May 7, 2009
- SUMCO CORPORATION
- Hideki Nishihata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing bonded wafer
- Publication number 20090098707
- Publication date Apr 16, 2009
- SUMCO CORPORATION
- Hideki Nishihata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE
- Publication number 20090075453
- Publication date Mar 19, 2009
- SUMCO CORPORATION
- Satoshi Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing soi wafer
- Publication number 20090023269
- Publication date Jan 22, 2009
- Nobuyuki Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING BONDED WAFER
- Publication number 20090023272
- Publication date Jan 22, 2009
- SUMCO CORPORATION
- Hideki Nishihata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Bonded Wafer
- Publication number 20080200010
- Publication date Aug 21, 2008
- SUMCO CORPORATION
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of producing bonded wafer
- Publication number 20080124897
- Publication date May 29, 2008
- SUMCO CORPORATION
- Nobuyuki Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded wafer and method of manufacturing the same
- Publication number 20080061452
- Publication date Mar 13, 2008
- SUMCO CORPORATION
- Hideki NISHIHATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of producing bonded wafer
- Publication number 20070298589
- Publication date Dec 27, 2007
- SUMCO CORPORATION
- Hideki Nishihata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of producing semiconductor substrate
- Publication number 20070275566
- Publication date Nov 29, 2007
- SUMCO CORPORATION
- Satoshi Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing semiconductor substrate
- Publication number 20070264797
- Publication date Nov 15, 2007
- SUMCO CORPORATION
- Satoshi Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for producing soi wafer
- Publication number 20070190737
- Publication date Aug 16, 2007
- SUMCO CORPORATION
- Nobuyuki Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for manufacturing semiconductor substrates
- Publication number 20070114458
- Publication date May 24, 2007
- Seiichi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded wafer and its manufacturing method
- Publication number 20070069335
- Publication date Mar 29, 2007
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laminated Substrate Manufacturing Method and Laminated Substrate Ma...
- Publication number 20070048971
- Publication date Mar 1, 2007
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing SIMOX wafer and SIMOX wafer
- Publication number 20070020949
- Publication date Jan 25, 2007
- Yoshiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing soi wafer
- Publication number 20060266437
- Publication date Nov 30, 2006
- Nobuyuki Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for cleaning silicon substrate
- Publication number 20060234461
- Publication date Oct 19, 2006
- SUMCO CORPORATION
- Hideki Nishihata
- H01 - BASIC ELECTRIC ELEMENTS

Nishihata Hideki

Person

Patents Grantslast 30 patents

Method for producing semiconductor substrate

Method for producing a bonded wafer

Method of controlling film thinning of semiconductor wafer for soli...

Method of producing semiconductor substrate having an SOI structure

Method for producing bonded silicon wafer

Laminated substrate manufacturing method and laminated substrate ma...

Method for producing semiconductor substrate

Method of producing semiconductor substrate having an SOI structure

Method for producing bonded wafer

Method for manufacturing bonded wafer

Method for producing SOI wafer

Process for cleaning silicon substrate

Method for producing SOI wafer

Method of producing bonded wafer

Apparatus for manufacturing semiconductor substrates

Method for manufacturing SIMOX wafer and SIMOX wafer

Process for producing SOI wafer

Patents Applicationslast 30 patents

METHOD OF CONTROLLING FILM THINNING OF SEMICONDUCTOR WAFER FOR SOLI...

EPITAXIAL WAFER AND METHOD OF PRODUCING THE SAME

METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE

METHOD FOR PRODUCING A BONDED WAFER

METHOD FOR PRODUCING BONDED WAFER

METHOD FOR PRODUCING BONDED SILICON WAFER

Method Of Producing Bonded Wafer

Method for producing bonded wafer

METHOD FOR MANUFACTURING SOI SUBSTRATE

Method for producing bonded wafer

METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE

Method for producing soi wafer

METHOD OF PRODUCING BONDED WAFER

Method for Manufacturing Bonded Wafer

Method of producing bonded wafer

Bonded wafer and method of manufacturing the same

Method of producing bonded wafer

Method of producing semiconductor substrate

Method for producing semiconductor substrate

Process for producing soi wafer

Apparatus for manufacturing semiconductor substrates

Bonded wafer and its manufacturing method

Laminated Substrate Manufacturing Method and Laminated Substrate Ma...

Method for manufacturing SIMOX wafer and SIMOX wafer

Method for producing soi wafer

Process for cleaning silicon substrate