Noboru Okubo

Person

Saitama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Solder bump formation using wafer with ring
- Patent number 11,264,264
- Issue date Mar 1, 2022
- Semiconductor Components Industries, LLC
- Takashi Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,766,408
- Issue date Jul 1, 2014
- Semiconductor Components Industries, LLC
- Takashi Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,102,039
- Issue date Jan 24, 2012
- Sanyo Semiconductor Co., Ltd.
- Takashi Noma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 7,986,021
- Issue date Jul 26, 2011
- Sanyo Electric Co., Ltd.
- Kazuo Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,969,007
- Issue date Jun 28, 2011
- Sanyo Electric Co., Ltd.
- Takashi Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 7,633,133
- Issue date Dec 15, 2009
- Sanyo Electric Co., LTD
- Takashi Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,589,388
- Issue date Sep 15, 2009
- Sanyo Electric Co., LTD
- Yuichi Morita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER BUMP FORMATION USING WAFER WITH RING
- Publication number 20220181192
- Publication date Jun 9, 2022
- Semiconductor Components Industries, LLC
- Takashi NOMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP FORMATION USING WAFER WITH RING
- Publication number 20210028051
- Publication date Jan 28, 2021
- Semiconductor Components Industries, LLC
- Takashi NOMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20100164086
- Publication date Jul 1, 2010
- SANYO ELECTRIC CO., LTD.
- Takashi Noma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Manufacturing Method Thereof
- Publication number 20080277793
- Publication date Nov 13, 2008
- SANYO ELECTRIC CO., LTD.
- Takashi Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20080128914
- Publication date Jun 5, 2008
- SANYO ELECTRIC CO., LTD.
- Yuichi MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20070210437
- Publication date Sep 13, 2007
- Sanyo Electric Co., Ltd.
- Takashi Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of the same
- Publication number 20070145590
- Publication date Jun 28, 2007
- SANYO ELECTRIC CO., LTD.
- Takashi Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20070145420
- Publication date Jun 28, 2007
- Sanyo Electric Co., Ltd.
- Kazuo Okada
- H01 - BASIC ELECTRIC ELEMENTS

Noboru Okubo

Person

Patents Grantslast 30 patents

Solder bump formation using wafer with ring

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method of the same

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

SOLDER BUMP FORMATION USING WAFER WITH RING

SOLDER BUMP FORMATION USING WAFER WITH RING

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Manufacturing Method Thereof

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method of the same

Semiconductor device