Nobuaki Miyamoto

Person

Hitachi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making an electronic device and electronic device substrate
- Patent number 8,230,588
- Issue date Jul 31, 2012
- Hitachi Cable, Ltd.
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating an electronic device substrate
- Patent number 8,230,591
- Issue date Jul 31, 2012
- Hitachi Cable, Ltd.
- Akira Chinda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic device substrate and its fabrication method, and electro...
- Patent number 8,101,864
- Issue date Jan 24, 2012
- Hitachi Cable, Ltd.
- Akira Chinda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic device substrate, electronic device and methods for fabr...
- Patent number 7,939,935
- Issue date May 10, 2011
- Hitachi Cable Ltd.
- Akira Chinda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device substrate, electronic device and methods for maki...
- Patent number 7,880,091
- Issue date Feb 1, 2011
- Hitachi Cable, Ltd.
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating a multilayer wiring board, multilayer wiring...
- Patent number 7,780,836
- Issue date Aug 24, 2010
- Hitachi Cable, Ltd.
- Akira Chinda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device substrate and its fabrication method, and electro...
- Patent number 7,705,245
- Issue date Apr 27, 2010
- Hitachi Cable, Ltd.
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating double-sided wiring board
- Patent number 7,681,310
- Issue date Mar 23, 2010
- Hitachi Cable, Ltd.
- Akira Chinda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE SUBSTRATE, ELECTRONIC DEVICE AND METHODS FOR MAKI...
- Publication number 20090323299
- Publication date Dec 31, 2009
- Hitachi Cable, Ltd.
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE SUBSTRATE AND ITS FABRICATION METHOD, AND ELECTRO...
- Publication number 20090211796
- Publication date Aug 27, 2009
- HITACHI CABLE, LTD.
- Akira Chinda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device substrate and its fabrication method, and electro...
- Publication number 20080201943
- Publication date Aug 28, 2008
- HITACHI CABLE, LTD.
- Akira Chinda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device substrate, electronic device and methods for maki...
- Publication number 20070269590
- Publication date Nov 22, 2007
- Hitachi Cable, Ltd.
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device substrate, electronic device and methods for fabr...
- Publication number 20070268675
- Publication date Nov 22, 2007
- Hitachi Cable Ltd.
- Akira Chinda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE SUBSTRATE AND ITS FABRICATION METHOD, AND ELECTRO...
- Publication number 20070235218
- Publication date Oct 11, 2007
- HITACHI CABLE, LTD.
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for fabricating a multilayer wiring board, multilayer wiring...
- Publication number 20070034519
- Publication date Feb 15, 2007
- Hitachi Cable, Ltd.
- Akira Chinda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device substrate and its fabrication method, and electro...
- Publication number 20060225918
- Publication date Oct 12, 2006
- HITACHI CABLE, LTD.
- Akira Chinda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double-sided wiring board fabrication method, double-sided wiring b...
- Publication number 20060219428
- Publication date Oct 5, 2006
- Hitachi Cable, Ltd.
- AKira Chinda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Nobuaki Miyamoto

Person

Patents Grantslast 30 patents

Method of making an electronic device and electronic device substrate

Method for fabricating an electronic device substrate

Electronic device substrate and its fabrication method, and electro...

Electronic device substrate, electronic device and methods for fabr...

Electronic device substrate, electronic device and methods for maki...

Method for fabricating a multilayer wiring board, multilayer wiring...

Electronic device substrate and its fabrication method, and electro...

Method for fabricating double-sided wiring board

Patents Applicationslast 30 patents

ELECTRONIC DEVICE SUBSTRATE, ELECTRONIC DEVICE AND METHODS FOR MAKI...

ELECTRONIC DEVICE SUBSTRATE AND ITS FABRICATION METHOD, AND ELECTRO...

Electronic device substrate and its fabrication method, and electro...

Electronic device substrate, electronic device and methods for maki...

Electronic device substrate, electronic device and methods for fabr...

ELECTRONIC DEVICE SUBSTRATE AND ITS FABRICATION METHOD, AND ELECTRO...

Method for fabricating a multilayer wiring board, multilayer wiring...

Electronic device substrate and its fabrication method, and electro...

Double-sided wiring board fabrication method, double-sided wiring b...