Nobuhiro Ichiroku

Person

Usui-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Heat-conductive silicone grease composition
- Patent number 10,704,008
- Issue date Jul 7, 2020
- Shin-Etsu Chemical Co., Ltd.
- Nobuhiro Ichiroku
- C10 - PETROLEUM, GAS OR COKE INDUSTRIES TECHNICAL GASES CONTAINING CARBON MON...
Information Patent Grant
Adhesive composition and sheet for forming semiconductor wafer-prot...
- Patent number 8,617,705
- Issue date Dec 31, 2013
- Shin-Etsu Chemical Co., Ltd.
- Nobuhiro Ichiroku
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive exhibiting maximum melt viscosity of 10,000 Pa s at 40 to...
- Patent number 7,820,742
- Issue date Oct 26, 2010
- Shin-Etsu Chemical Co., Ltd.
- Nobuhiro Ichiroku
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive composition and adhesive film therefrom
- Patent number 7,722,949
- Issue date May 25, 2010
- Shin-Etsu Chemical Co., Ltd.
- Nobuhiro Ichiroku
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Partial block polyimide-polysiloxane copolymer, making method, and...
- Patent number 7,683,152
- Issue date Mar 23, 2010
- Shin-Etsu Chemical Co., Ltd.
- Hideki Akiba
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive composition and sheet having an adhesive layer of the comp...
- Patent number 7,488,539
- Issue date Feb 10, 2009
- Shin-Etsu Chemical Co., Ltd.
- Shouhei Kozakai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive composition and adhesive film
- Patent number 7,364,797
- Issue date Apr 29, 2008
- Shin-Etsu Chemical Co., Ltd.
- Shouhei Kozakai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Dicing/die bonding adhesion tape
- Patent number 7,244,495
- Issue date Jul 17, 2007
- Shin-Etsu Chemical Co., Ltd.
- Shouhei Kozakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dicing/die bonding sheet
- Patent number 7,147,920
- Issue date Dec 12, 2006
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Heat resistant resin composition and adhesive film
- Patent number 7,060,786
- Issue date Jun 13, 2006
- Shin-Etsu Chemical Co., Ltd.
- Nobuhiro Ichiroku
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Conductive resin composition
- Patent number 7,026,382
- Issue date Apr 11, 2006
- Shin-Etsu Chemical Co., Ltd.
- Hideki Akiba
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Phenolic hydroxyl-bearing polyimide resin, making method and polyim...
- Patent number 6,949,619
- Issue date Sep 27, 2005
- Shin-Etsu Chemical Co., Ltd.
- Nobuhiro Ichiroku
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Heat resistant resin composition and adhesive film
- Patent number 6,808,819
- Issue date Oct 26, 2004
- Shin-Etsu Chemical Co., Ltd.
- Nobuhiro Ichiroku
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Film-type adhesive for electronic components, and electronic compon...
- Patent number 6,645,632
- Issue date Nov 11, 2003
- Shin-Etsu Chemical Co., Ltd.
- Tsuyoshi Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin composition
- Patent number 6,506,822
- Issue date Jan 14, 2003
- Shin-Etsu Chemical Co., Ltd.
- Nobuhiro Ichiroku
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Liquid epoxy resin composition for ball grid array package
- Patent number 6,117,953
- Issue date Sep 12, 2000
- Shin-Etsu Chemical Co., Ltd.
- Nobuhiro Ichiroku
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Quaternary phosphorus compounds and their preparation
- Patent number 5,473,091
- Issue date Dec 5, 1995
- Shin-Etsu Chemical Co., Ltd.
- Nobuhiro Ichiroku
- C07 - ORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE COMPOSITION AND FILM-SHAPED SEALING MATERIAL
- Publication number 20240117226
- Publication date Apr 11, 2024
- Shin-Etsu Chemical Co., Ltd.
- Takayuki KUSUNOKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMALLY CONDUCTIVE SILICONE COMPOSITION AND METHOD FOR PRODUCING...
- Publication number 20210253927
- Publication date Aug 19, 2021
- Shin-Etsu Chemical Co., Ltd.
- Nobuhiro ICHIROKU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HEAT-CONDUCTIVE SILICONE GREASE COMPOSITION
- Publication number 20180094207
- Publication date Apr 5, 2018
- Shin-Etsu Chemical Co., Ltd.
- Nobuhiro ICHIROKU
- C10 - PETROLEUM, GAS OR COKE INDUSTRIES TECHNICAL GASES CONTAINING CARBON MON...
Information Patent Application
ADHESIVE COMPOSITION AND SHEET FOR FORMING SEMICONDUCTOR WAFER-PROT...
- Publication number 20110223420
- Publication date Sep 15, 2011
- Shin-Etsu Chemical Co., Ltd.
- Nobuhiro ICHIROKU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive composition and adhesive film therefrom
- Publication number 20070282081
- Publication date Dec 6, 2007
- Shin-Etsu Chemical Co., Ltd.
- Nobuhiro Ichiroku
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive composition, adhesive film, and method of producing semico...
- Publication number 20070191552
- Publication date Aug 16, 2007
- Shin-Etsu Chemical Co., Ltd.
- Nobuhiro Ichiroku
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Dicing and die bonding adhesive tape
- Publication number 20070120271
- Publication date May 31, 2007
- Shin-Etsu Chemical Co., Ltd.
- Shouhei Kozakai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Adhesive composition and sheet having an adhesive layer of the comp...
- Publication number 20070090299
- Publication date Apr 26, 2007
- Shin-Etsu Chemical Co., Ltd.
- Shouhei Kozakai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Partial block polyimide-polysiloxane copolymer, making method , and...
- Publication number 20050261456
- Publication date Nov 24, 2005
- Shin-Etsu Chemical Co., Ltd.
- Hideki Akiba
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive composition and adhesive film
- Publication number 20050065296
- Publication date Mar 24, 2005
- Shouhei Kozakai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Dicing/die bonding adhesion tape
- Publication number 20040213994
- Publication date Oct 28, 2004
- Shouhei Kozakai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Wafer dicing/die bonding sheet
- Publication number 20040105990
- Publication date Jun 3, 2004
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Phenolic hydroxyl-bearing polyimide resin, making method and polyim...
- Publication number 20040019174
- Publication date Jan 29, 2004
- Nobuhiro Ichiroku
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Heat resistant resin composition and adhesive film
- Publication number 20030220455
- Publication date Nov 27, 2003
- Nobuhiro Ichiroku
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Conductive resin composition
- Publication number 20030216505
- Publication date Nov 20, 2003
- Hideki Akiba
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Heat resistant resin composition and adhesive film
- Publication number 20030158350
- Publication date Aug 21, 2003
- Nobuhiro Ichiroku
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Epoxy resin composition
- Publication number 20020022681
- Publication date Feb 21, 2002
- Nobuhiro Ichiroku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Film-type adhesive for electronic components, and electronic compon...
- Publication number 20010031828
- Publication date Oct 18, 2001
- Tsuyoshi Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Nobuhiro Ichiroku

Person

Patents Grantslast 30 patents

Heat-conductive silicone grease composition

Adhesive composition and sheet for forming semiconductor wafer-prot...

Adhesive exhibiting maximum melt viscosity of 10,000 Pa s at 40 to...

Adhesive composition and adhesive film therefrom

Partial block polyimide-polysiloxane copolymer, making method, and...

Adhesive composition and sheet having an adhesive layer of the comp...

Adhesive composition and adhesive film

Dicing/die bonding adhesion tape

Wafer dicing/die bonding sheet

Heat resistant resin composition and adhesive film

Conductive resin composition

Phenolic hydroxyl-bearing polyimide resin, making method and polyim...

Heat resistant resin composition and adhesive film

Film-type adhesive for electronic components, and electronic compon...

Epoxy resin composition

Liquid epoxy resin composition for ball grid array package

Quaternary phosphorus compounds and their preparation

Patents Applicationslast 30 patents

ADHESIVE COMPOSITION AND FILM-SHAPED SEALING MATERIAL

THERMALLY CONDUCTIVE SILICONE COMPOSITION AND METHOD FOR PRODUCING...

HEAT-CONDUCTIVE SILICONE GREASE COMPOSITION

ADHESIVE COMPOSITION AND SHEET FOR FORMING SEMICONDUCTOR WAFER-PROT...

Adhesive composition and adhesive film therefrom

Adhesive composition, adhesive film, and method of producing semico...

Dicing and die bonding adhesive tape

Adhesive composition and sheet having an adhesive layer of the comp...

Partial block polyimide-polysiloxane copolymer, making method , and...

Adhesive composition and adhesive film

Dicing/die bonding adhesion tape

Wafer dicing/die bonding sheet

Phenolic hydroxyl-bearing polyimide resin, making method and polyim...

Heat resistant resin composition and adhesive film

Conductive resin composition

Heat resistant resin composition and adhesive film

Epoxy resin composition

Film-type adhesive for electronic components, and electronic compon...