Nobuo Ichimura

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Hitachi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Epoxy resin and adhesive composition containing the same
- Patent number 5,350,811
- Issue date Sep 27, 1994
- Hitachi Chemical Co. Ltd.
- Nobuo Ichimura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin and adhesive composition containing the same
- Patent number 5,258,139
- Issue date Nov 2, 1993
- Hitachi Chemical Company, Ltd.
- Nobuo Ichimura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electroconductive resin paste containing mixed epoxy resin and elec...
- Patent number 5,188,767
- Issue date Feb 23, 1993
- Hitachi Chemical Co., Ltd.
- Mitsuo Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroconductive adhesive comprising an epoxy novolak resin and ph...
- Patent number 5,183,592
- Issue date Feb 2, 1993
- Hitachi Chemical Company Ltd.
- Nobuo Ichimura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device and process for producing the same
- Patent number 4,803,543
- Issue date Feb 7, 1989
- Hitachi, Ltd.
- Hideo Inayoshi
- H01 - BASIC ELECTRIC ELEMENTS