Nobuteru Oh

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Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Multichip semiconductor package
- Patent number 7,501,707
- Issue date Mar 10, 2009
- NEC Electronics Corporation
- Yoshiaki Morishita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with multiple chips in one package
- Patent number 7,400,134
- Issue date Jul 15, 2008
- NEC Electronics Corporation
- Yoshiaki Morishita
- G11 - INFORMATION STORAGE
Information Patent Grant
Flip-chip semiconductor device having I/O modules in an internal ci...
- Patent number 6,858,924
- Issue date Feb 22, 2005
- NEC Electronics Corporation
- Yoshihiro Masumura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor apparatus and method for manufacturing semiconductor...
- Publication number 20050199994
- Publication date Sep 15, 2005
- NEC Electronics Corporation
- Yoshiaki Morishita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit device
- Publication number 20050156616
- Publication date Jul 21, 2005
- NEC Electronics Corporation
- Yoshiaki Morishita
- G01 - MEASURING TESTING
Information Patent Application
Flip-chip semiconductor device having I/O modules in an internal ci...
- Publication number 20030222355
- Publication date Dec 4, 2003
- NEC Electronics Corporation
- Yoshihiro Masumura
- H01 - BASIC ELECTRIC ELEMENTS