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Nobuyuki Morimoto
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Ventilation fan and ventilation system
Patent number
11,739,957
Issue date
Aug 29, 2023
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Hirosato Sakai
F24 - HEATING RANGES VENTILATING
Information
Patent Grant
Ventilation fan and ventilation system
Patent number
11,609,002
Issue date
Mar 21, 2023
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Hirosato Sakai
F24 - HEATING RANGES VENTILATING
Information
Patent Grant
Ventilation fan and ventilation system
Patent number
11,054,158
Issue date
Jul 6, 2021
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Hirosato Sakai
F24 - HEATING RANGES VENTILATING
Information
Patent Grant
Ventilation fan and ventilation system
Patent number
10,302,321
Issue date
May 28, 2019
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Hirosato Sakai
F24 - HEATING RANGES VENTILATING
Information
Patent Grant
Hybrid gel comprising chemically crosslinked hyaluronic acid deriva...
Patent number
8,987,230
Issue date
Mar 24, 2015
National University Corporation Tokyo Medical and Dental University
Kazunari Akiyoshi
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Grant
Method of manufacturing bonded wafer
Patent number
8,802,540
Issue date
Aug 12, 2014
Sumco Corporation
Nobuyuki Morimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fastening tool
Patent number
8,671,803
Issue date
Mar 18, 2014
Toyota Jidosha Kabushiki Kaisha
Toshinari Katsunuma
B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information
Patent Grant
Method for producing semiconductor substrate
Patent number
8,183,133
Issue date
May 22, 2012
Sumco Corporation
Satoshi Murakami
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded wafer and method for producing bonded wafer
Patent number
8,048,767
Issue date
Nov 1, 2011
Sumco Corporation
Nobuyuki Morimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing bonded wafer
Patent number
8,048,769
Issue date
Nov 1, 2011
Sumco Corporation
Nobuyuki Morimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing a bonded wafer
Patent number
8,003,494
Issue date
Aug 23, 2011
SUMCO Corporation
Hideki Nishihata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of producing semiconductor substrate having an SOI structure
Patent number
7,951,692
Issue date
May 31, 2011
Sumco Corporation
Satoshi Murakami
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing bonded silicon wafer
Patent number
7,927,957
Issue date
Apr 19, 2011
SUMCO Corporation
Tatsumi Kusaba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of producing bonded wafer
Patent number
7,902,043
Issue date
Mar 8, 2011
Sumco Corporation
Nobuyuki Morimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laminated substrate manufacturing method and laminated substrate ma...
Patent number
7,858,494
Issue date
Dec 28, 2010
Sumco Corporation
Akihiko Endo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing bonded wafer
Patent number
7,855,132
Issue date
Dec 21, 2010
Sumco Corporation
Akihiko Endo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing semiconductor substrate
Patent number
7,851,337
Issue date
Dec 14, 2010
Sumco Corporation
Satoshi Murakami
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for evaluation of bonded wafer
Patent number
7,799,655
Issue date
Sep 21, 2010
Sumco Corporation
Satoshi Murakami
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of producing semiconductor substrate having an SOI structure
Patent number
7,795,117
Issue date
Sep 14, 2010
Sumco Corporation
Satoshi Murakami
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
SOI wafer and its manufacturing method
Patent number
7,713,838
Issue date
May 11, 2010
Sumco Corporation
Akihiko Endo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing SOI wafer
Patent number
7,563,697
Issue date
Jul 21, 2009
Sumco Corporation
Nobuyuki Morimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
SOI wafer and its manufacturing method
Patent number
7,544,583
Issue date
Jun 9, 2009
Sumco Corporation
Akihiko Endo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for cleaning silicon substrate
Patent number
7,534,728
Issue date
May 19, 2009
Sumco Corporation
Hideki Nishihata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing SOI wafer
Patent number
7,510,948
Issue date
Mar 31, 2009
Sumco Corporation
Nobuyuki Morimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of producing bonded wafer
Patent number
7,507,641
Issue date
Mar 24, 2009
Sumco Corporation
Nobuyuki Morimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor substrate
Patent number
7,494,899
Issue date
Feb 24, 2009
Sumco Corporation
Akihiko Endo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing bonded wafer
Patent number
7,446,016
Issue date
Nov 4, 2008
Sumco Corporation
Akihiko Endo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for producing SOI wafer
Patent number
7,358,147
Issue date
Apr 15, 2008
Sumco Corporation
Nobuyuki Morimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Range hood
Patent number
6,401,709
Issue date
Jun 11, 2002
Matsushita Seiko Co., Ltd.
Toshinobu Okamoto
F24 - HEATING RANGES VENTILATING
Information
Patent Grant
Hydrocarbon synthesis process utilizing crystalline aluminosilicate...
Patent number
4,766,263
Issue date
Aug 23, 1988
Research Association for Petroleum Alternatives Development
Nobuyuki Morimoto
C07 - ORGANIC CHEMISTRY
Patents Applications
last 30 patents
Information
Patent Application
VENTILATION FAN AND VENTILATION SYSTEM
Publication number
20230194110
Publication date
Jun 22, 2023
Panasonic Intellectual Property Management Co., Ltd.
Hirosato SAKAI
F24 - HEATING RANGES VENTILATING
Information
Patent Application
VENTILATION FAN AND VENTILATION SYSTEM
Publication number
20210293426
Publication date
Sep 23, 2021
Panasonic Intellectual Property Management Co., Ltd.
Hirosato SAKAI
F24 - HEATING RANGES VENTILATING
Information
Patent Application
VENTILATION FAN AND VENTILATION SYSTEM
Publication number
20190242599
Publication date
Aug 8, 2019
Panasonic Intellectual Property Management Co.,Ltd
Hirosato SAKAI
F24 - HEATING RANGES VENTILATING
Information
Patent Application
VENTILATION FAN AND VENTILATION SYSTEM
Publication number
20150050876
Publication date
Feb 19, 2015
PANASONIC CORPORATION
Hirosato Sakai
F24 - HEATING RANGES VENTILATING
Information
Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE
Publication number
20110027969
Publication date
Feb 3, 2011
SUMCO CORPORATION
Satoshi Murakami
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING A BONDED WAFER
Publication number
20100248447
Publication date
Sep 30, 2010
SUMCO CORPORATION
Hideki Nishihata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FASTENING TOOL
Publication number
20100199810
Publication date
Aug 12, 2010
Toyota Jidosha Kabushiki Kaisha
Toshinari Katsunuma
B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information
Patent Application
HYBRID GEL COMPRISING CHEMICALLY CROSSLINKED HYALURONIC ACID DERIVA...
Publication number
20100204102
Publication date
Aug 12, 2010
Kazunari Akiyoshi
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Application
METHOD FOR PRODUCING BONDED WAFER
Publication number
20100178750
Publication date
Jul 15, 2010
SUMCO CORPORATION
Satoshi Murakami
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING BONDED SILICON WAFER
Publication number
20100068867
Publication date
Mar 18, 2010
SUMCO CORPORATION
Tatsumi Kusaba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING BONDED WAFER
Publication number
20100015779
Publication date
Jan 21, 2010
SUMCO CORPORATION
Nobuyuki Morimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for producing bonded wafer
Publication number
20090186464
Publication date
Jul 23, 2009
SUMCO CORPORATION
Nobuyuki Morimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SOI SUBSTRATE
Publication number
20090117708
Publication date
May 7, 2009
SUMCO CORPORATION
Hideki Nishihata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE
Publication number
20090075453
Publication date
Mar 19, 2009
SUMCO CORPORATION
Satoshi Murakami
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for producing soi wafer
Publication number
20090023269
Publication date
Jan 22, 2009
Nobuyuki Morimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF PRODUCING BONDED WAFER
Publication number
20090023272
Publication date
Jan 22, 2009
SUMCO CORPORATION
Hideki Nishihata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING BONDED WAFER
Publication number
20080248630
Publication date
Oct 9, 2008
SUMCO CORPORATION
Akihiko ENDO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of manufacturing bonded wafer
Publication number
20080227271
Publication date
Sep 18, 2008
SUMCO CORPORATION
Nobuyuki MORIMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR EVALUATION OF BONDED WAFER
Publication number
20080220589
Publication date
Sep 11, 2008
SUMCO CORPORATION
Satoshi Murakami
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of producing bonded wafer
Publication number
20080124897
Publication date
May 29, 2008
SUMCO CORPORATION
Nobuyuki Morimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF PRODUCING BONDED WAFER
Publication number
20080070377
Publication date
Mar 20, 2008
SUMCO CORPORATION
Nobuyuki Morimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bonded wafer and method of manufacturing the same
Publication number
20080061452
Publication date
Mar 13, 2008
SUMCO CORPORATION
Hideki NISHIHATA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED WAFER AND METHOD FOR PRODUCING BONDED WAFER
Publication number
20080057676
Publication date
Mar 6, 2008
SUMCO CORPORATION
Nobuyuki Morimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of producing bonded wafer
Publication number
20070298589
Publication date
Dec 27, 2007
SUMCO CORPORATION
Hideki Nishihata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of producing semiconductor substrate
Publication number
20070275566
Publication date
Nov 29, 2007
SUMCO CORPORATION
Satoshi Murakami
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for producing semiconductor substrate
Publication number
20070264797
Publication date
Nov 15, 2007
SUMCO CORPORATION
Satoshi Murakami
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Process for producing soi wafer
Publication number
20070190737
Publication date
Aug 16, 2007
SUMCO CORPORATION
Nobuyuki Morimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING BONDED WAFER
Publication number
20070184631
Publication date
Aug 9, 2007
SUMCO CORPORATION
Shinya Nakamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Laminated Substrate Manufacturing Method and Laminated Substrate Ma...
Publication number
20070048971
Publication date
Mar 1, 2007
Akihiko Endo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Soi wafer and its manufacturing method
Publication number
20070032043
Publication date
Feb 8, 2007
Akihiko Endo
H01 - BASIC ELECTRIC ELEMENTS