Nobuyuki Ogawa

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing optical semiconductor device
- Patent number 11,929,590
- Issue date Mar 12, 2024
- Mitsubishi Electric Corporation
- Nobuyuki Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin for energy device electrode, composition for forming energy d...
- Patent number 11,482,706
- Issue date Oct 25, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Shunsuke Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlayer insulating film and method for producing same
- Patent number 11,432,400
- Issue date Aug 30, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Masaharu Matsuura
- B32 - LAYERED PRODUCTS
Information Patent Grant
Adhesive film, multilayer printed wiring board using adhesive film,...
- Patent number 10,645,804
- Issue date May 5, 2020
- Hitachi Chemical Company, Ltd.
- Masaharu Matsuura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Binder resin composition, electrode for lithium ion secondary batte...
- Patent number 10,513,604
- Issue date Dec 24, 2019
- Hitachi Chemical Company, Ltd.
- Shunsuke Nagai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Primer, conductor foil with resin, laminated sheet and method of ma...
- Patent number 8,507,100
- Issue date Aug 13, 2013
- Hitachi Chemical Company, Ltd.
- Kenji Tanaka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Adhesion assisting agent fitted metal foil, and printed wiring boar...
- Patent number 7,740,936
- Issue date Jun 22, 2010
- Hitachi Chemical Co., Ltd.
- Nobuyuki Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Primer, conductor foil with resin, laminated sheet and method of ma...
- Patent number 7,648,770
- Issue date Jan 19, 2010
- Hitachi Chemical Company, Ltd.
- Kenji Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for producing multilayer printed circuit boards
- Patent number 6,153,359
- Issue date Nov 28, 2000
- Hitachi Chemical Company, Ltd.
- Hiroshi Shimizu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for producing multilayer printed circuit boards
- Patent number 5,945,258
- Issue date Aug 31, 1999
- Hitachi Chemical Co., Ltd.
- Hiroshi Shimizu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for producing multilayer printed circuit board for wire bon...
- Patent number 5,879,568
- Issue date Mar 9, 1999
- Hitachi, Ltd.
- Naoyuki Urasaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR LASER DEVICE
- Publication number 20230246412
- Publication date Aug 3, 2023
- Mitsubishi Electric Corporation
- Nobuyuki OGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING OPTICAL SEMICONDUCTOR DEVICE
- Publication number 20210313765
- Publication date Oct 7, 2021
- Mitsubishi Electric Corporation
- Nobuyuki OGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTE COMPOSITION, SECONDARY CELL, AND METHOD FOR MANUFACTURI...
- Publication number 20210075054
- Publication date Mar 11, 2021
- Katsunori NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN FOR ENERGY DEVICE ELECTRODE, COMPOSITION FOR FORMING ENERGY D...
- Publication number 20190379051
- Publication date Dec 12, 2019
- Hitachi Chemical Company, Ltd.
- Shunsuke NAGAI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN FOR ENERGY DEVICE ELECTRODE, COMPOSITION FOR FORMING ENERGY D...
- Publication number 20190379052
- Publication date Dec 12, 2019
- Hitachi Chemical Company, Ltd.
- Shunsuke NAGAI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
INTERLAYER INSULATING FILM AND METHOD FOR PRODUCING SAME
- Publication number 20190182953
- Publication date Jun 13, 2019
- Hitachi Chemical Company, Ltd.
- Masaharu MATSUURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BINDER RESIN COMPOSITION, ELECTRODE FOR LITHIUM ION SECONDARY BATTE...
- Publication number 20180057678
- Publication date Mar 1, 2018
- Hitachi Chemical Company, Ltd.
- Shunsuke NAGAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM, MULTILAYER PRINTED WIRING BOARD USING ADHESIVE FILM,...
- Publication number 20140199533
- Publication date Jul 17, 2014
- Masaharu Matsuura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR CIRCUIT BOARD AND PR...
- Publication number 20140151091
- Publication date Jun 5, 2014
- Daisuke FUJIMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRIMER, CONDUCTOR FOIL WITH RESIN, LAMINATED SHEET AND METHOD OF MA...
- Publication number 20120315438
- Publication date Dec 13, 2012
- Kenji Tanaka
- B32 - LAYERED PRODUCTS
Information Patent Application
PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR WIRING BOARD AND MET...
- Publication number 20120305291
- Publication date Dec 6, 2012
- Daisuke FUJIMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRIMER, CONDUCTOR FOIL WITH RESIN, LAMINATED SHEET AND METHOD OF MA...
- Publication number 20100119853
- Publication date May 13, 2010
- Kenji Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesion Assisting Agent Fitted Metal Foil, and Printed Wiring Boar...
- Publication number 20080145689
- Publication date Jun 19, 2008
- Nobuyuki Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Primer, conductor foil with resin, laminated sheet and method of ma...
- Publication number 20070185297
- Publication date Aug 9, 2007
- Kenji Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Heterojunction bipolar transistor and amplifier including the same
- Publication number 20060237747
- Publication date Oct 26, 2006
- Mitsubishi Denki Kabushiki Kaisha
- Satoshi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS

Nobuyuki Ogawa

Person

Patents Grantslast 30 patents

Method for producing optical semiconductor device

Resin for energy device electrode, composition for forming energy d...

Interlayer insulating film and method for producing same

Adhesive film, multilayer printed wiring board using adhesive film,...

Binder resin composition, electrode for lithium ion secondary batte...

Primer, conductor foil with resin, laminated sheet and method of ma...

Adhesion assisting agent fitted metal foil, and printed wiring boar...

Primer, conductor foil with resin, laminated sheet and method of ma...

Process for producing multilayer printed circuit boards

Process for producing multilayer printed circuit boards

Process for producing multilayer printed circuit board for wire bon...

Patents Applicationslast 30 patents

SEMICONDUCTOR LASER DEVICE

METHOD FOR PRODUCING OPTICAL SEMICONDUCTOR DEVICE

ELECTROLYTE COMPOSITION, SECONDARY CELL, AND METHOD FOR MANUFACTURI...

RESIN FOR ENERGY DEVICE ELECTRODE, COMPOSITION FOR FORMING ENERGY D...

RESIN FOR ENERGY DEVICE ELECTRODE, COMPOSITION FOR FORMING ENERGY D...

INTERLAYER INSULATING FILM AND METHOD FOR PRODUCING SAME

BINDER RESIN COMPOSITION, ELECTRODE FOR LITHIUM ION SECONDARY BATTE...

ADHESIVE FILM, MULTILAYER PRINTED WIRING BOARD USING ADHESIVE FILM,...

PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR CIRCUIT BOARD AND PR...

PRIMER, CONDUCTOR FOIL WITH RESIN, LAMINATED SHEET AND METHOD OF MA...

PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR WIRING BOARD AND MET...

PRIMER, CONDUCTOR FOIL WITH RESIN, LAMINATED SHEET AND METHOD OF MA...

Adhesion Assisting Agent Fitted Metal Foil, and Printed Wiring Boar...

Primer, conductor foil with resin, laminated sheet and method of ma...

Heterojunction bipolar transistor and amplifier including the same