Nobuyuki Ohtsuka

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,559,058
- Issue date Jan 31, 2017
- Fujitsu Semiconductor Limited
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 8,889,505
- Issue date Nov 18, 2014
- Fujitsu Semiconductor Limited
- Shinichi Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 8,551,832
- Issue date Oct 8, 2013
- Fujitsu Semiconductor Limited
- Shinichi Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a conductor buried in an opening
- Patent number 8,415,798
- Issue date Apr 9, 2013
- Fujitsu Semiconductor Limited
- Nobuyuki Ohtsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a multilayer interconnection structure in a...
- Patent number 8,168,532
- Issue date May 1, 2012
- Fujitsu Limited
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacture method for semiconductor device using damascene method
- Patent number 8,101,513
- Issue date Jan 24, 2012
- Fujitsu Limited
- Tsuyoshi Kanki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device suitable for forming w...
- Patent number 8,071,474
- Issue date Dec 6, 2011
- Fujitsu Semiconductor Limited
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with reduced increase in copper film resistance
- Patent number 8,067,836
- Issue date Nov 29, 2011
- Fujitsu Semiconductor Limited
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor device having a barrier layer c...
- Patent number 7,935,624
- Issue date May 3, 2011
- Fujitsu Semiconductor Limited
- Nobuyuki Ohtsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,928,476
- Issue date Apr 19, 2011
- Fujitsu Semiconductor Limited
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacture method for semiconductor device suitable for forming wi...
- Patent number 7,846,833
- Issue date Dec 7, 2010
- Fujitsu Limited
- Hideki Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device suitable for forming w...
- Patent number 7,795,141
- Issue date Sep 14, 2010
- Fujitsu Semiconductor Limited
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacture method for semiconductor device suitable for forming wi...
- Patent number 7,713,869
- Issue date May 11, 2010
- Fujitsu Limited
- Hideki Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process of a semiconductor device
- Patent number 7,507,659
- Issue date Mar 24, 2009
- Fujitsu Microelectronics Limited
- Nobuyuki Ohtsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacture method for semiconductor device having concave portions...
- Patent number 7,507,666
- Issue date Mar 24, 2009
- Fujitsu Microelectronics Limited
- Yoshiyuki Nakao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device suitable for forming w...
- Patent number 7,413,977
- Issue date Aug 19, 2008
- Fujitsu Limited
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 7,279,790
- Issue date Oct 9, 2007
- Fujitsu Limited
- Hideki Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 7,199,044
- Issue date Apr 3, 2007
- Fujitsu Limited
- Nobuyuki Ohtsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,992,005
- Issue date Jan 31, 2006
- Fujitsu Limited
- Nobuyuki Ohtsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having increased adhesion between a barrier la...
- Patent number 6,900,542
- Issue date May 31, 2005
- Fujitsu Limited
- Hisaya Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,750,541
- Issue date Jun 15, 2004
- Fujitsu Limited
- Nobuyuki Ohtsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacture of semiconductor device with copper wiring
- Patent number 6,746,957
- Issue date Jun 8, 2004
- Fujitsu Limited
- Nobuyuki Ohtsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with copper wiring and semiconductor device ma...
- Patent number 6,242,808
- Issue date Jun 5, 2001
- Fujitsu Limited
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of growing conductive layer from gas phase
- Patent number 6,159,854
- Issue date Dec 12, 2000
- Fujitsu Limited
- Nobuyuki Ohtsuka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of making quantum box semiconductor device
- Patent number 5,817,538
- Issue date Oct 6, 1998
- Fujitsu Limited
- Kohki Mukai
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Quantum box semiconductor device
- Patent number 5,608,229
- Issue date Mar 4, 1997
- Fujitsu Limited
- Kohki Mukai
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Hetero-epitaxially grown compound semiconductor substrate
- Patent number 5,484,664
- Issue date Jan 16, 1996
- Fujitsu Limited
- Kuninori Kitahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hetero-epitaxially grown compound semiconductor substrate and a met...
- Patent number 5,300,186
- Issue date Apr 5, 1994
- Fujitsu Limited
- Kuninori Kitahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compound semiconductor crystal growing method
- Patent number 5,296,088
- Issue date Mar 22, 1994
- Fujitsu Limited
- Kunihiko Kodama
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method of growing compound semiconductor epitaxial layer by atomic...
- Patent number 5,166,092
- Issue date Nov 24, 1992
- Fujitsu Limited
- Kouji Mochizuki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140004711
- Publication date Jan 2, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Shinichi Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20130196503
- Publication date Aug 1, 2013
- FUJITSU SEMICONDUCTOR LIMITED
- Nobuyuki Ohtsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120181695
- Publication date Jul 19, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Masaki HANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110183515
- Publication date Jul 28, 2011
- FUJITSU SEMICONDUCTOR LIMITED
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20100330812
- Publication date Dec 30, 2010
- FUJITSU SEMICONDUCTOR LIMITED
- Shinichi Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE SUITABLE FOR FORMING W...
- Publication number 20100323519
- Publication date Dec 23, 2010
- FUJITSU SEMICONDUCTOR LIMITED
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20100252928
- Publication date Oct 7, 2010
- FUJITSU SEMICONDUCTOR LIMITED
- Nobuyuki Ohtsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURE METHOD FOR SEMICONDUCTOR DEVICE SUITABLE FOR FORMING WI...
- Publication number 20100178762
- Publication date Jul 15, 2010
- Fujitsu Limited
- Hideki Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20090321937
- Publication date Dec 31, 2009
- Fujitsu Limited
- Masaki HANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090146309
- Publication date Jun 11, 2009
- Fujitsu Microelectronics Limited
- Hiroshi KUDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090121355
- Publication date May 14, 2009
- Fujitsu Microelectronics Limited
- Masaki HANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device suitable for forming w...
- Publication number 20080286960
- Publication date Nov 20, 2008
- Fujitsu Limited
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION PROCESS OF A SEMICONDUCTOR DEVICE
- Publication number 20080113506
- Publication date May 15, 2008
- Fujitsu Limited
- Nobuyuki OHTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication method of semiconductor device
- Publication number 20070173055
- Publication date Jul 26, 2007
- FUJITSU LIMITED
- Nobuyuki Ohtsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacture method for semiconductor device using damascene method
- Publication number 20070134899
- Publication date Jun 14, 2007
- FUJITSU LIMITED
- Tsuyoshi Kanki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its manufacture method
- Publication number 20070048931
- Publication date Mar 1, 2007
- FUJITSU LIMITED
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacture method for semiconductor device having concave portions...
- Publication number 20070049024
- Publication date Mar 1, 2007
- FUJITSU LIMITED
- Yoshiyuki Nakao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacture method for semiconductor device suitable for forming wi...
- Publication number 20070045851
- Publication date Mar 1, 2007
- FUJITSU LIMITED
- Hideki Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20050121786
- Publication date Jun 9, 2005
- Semiconductor Leading Edge Technologies, Inc.
- Akira Furuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing semiconductor device
- Publication number 20040259381
- Publication date Dec 23, 2004
- Semiconductor Leading Edge Technologies, Inc.
- Nobuyuki Ohtsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20040188839
- Publication date Sep 30, 2004
- FUJITSU LIMITED
- Nobuyuki Ohtsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20040000716
- Publication date Jan 1, 2004
- FUJITSU LIMITED
- Hisaya Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a manufacturing method thereof
- Publication number 20030042610
- Publication date Mar 6, 2003
- Fujitsu Limited,
- Hideki Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20020158338
- Publication date Oct 31, 2002
- FUJITSU LIMITED
- Nobuyuki Ohtsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacture of semiconductor device with copper wiring
- Publication number 20020019131
- Publication date Feb 14, 2002
- FUJITSU LIMITED
- Nobuyuki Ohtsuka
- H01 - BASIC ELECTRIC ELEMENTS

Nobuyuki Ohtsuka

Person

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing the same

Method for manufacturing semiconductor device

Method for manufacturing semiconductor device

Semiconductor device having a conductor buried in an opening

Method of manufacturing a multilayer interconnection structure in a...

Manufacture method for semiconductor device using damascene method

Method of manufacturing semiconductor device suitable for forming w...

Semiconductor device with reduced increase in copper film resistance

Fabrication method of semiconductor device having a barrier layer c...

Semiconductor device and method of manufacturing the same

Manufacture method for semiconductor device suitable for forming wi...

Method of manufacturing semiconductor device suitable for forming w...

Manufacture method for semiconductor device suitable for forming wi...

Fabrication process of a semiconductor device

Manufacture method for semiconductor device having concave portions...

Method of manufacturing semiconductor device suitable for forming w...

Semiconductor device and a manufacturing method thereof

Method for manufacturing semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device having increased adhesion between a barrier la...

Semiconductor device

Manufacture of semiconductor device with copper wiring

Semiconductor device with copper wiring and semiconductor device ma...

Process of growing conductive layer from gas phase

Method of making quantum box semiconductor device

Quantum box semiconductor device

Hetero-epitaxially grown compound semiconductor substrate

Hetero-epitaxially grown compound semiconductor substrate and a met...

Compound semiconductor crystal growing method

Method of growing compound semiconductor epitaxial layer by atomic...

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE SUITABLE FOR FORMING W...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

MANUFACTURE METHOD FOR SEMICONDUCTOR DEVICE SUITABLE FOR FORMING WI...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Method of manufacturing semiconductor device suitable for forming w...

FABRICATION PROCESS OF A SEMICONDUCTOR DEVICE

Fabrication method of semiconductor device

Manufacture method for semiconductor device using damascene method

Semiconductor device and its manufacture method

Manufacture method for semiconductor device having concave portions...

Manufacture method for semiconductor device suitable for forming wi...

Semiconductor device and its manufacturing method

Method for manufacturing semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device and a manufacturing method thereof

Semiconductor device and method of manufacturing the same

Manufacture of semiconductor device with copper wiring