Nobuyuki Okuzawa

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Coil component and manufacturing method therefor
- Patent number 12,170,163
- Issue date Dec 17, 2024
- TDK Corporation
- Nobuyuki Okuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric composition and electronic component
- Patent number 11,508,494
- Issue date Nov 22, 2022
- TDK Corporation
- Shota Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric composition and electronic component
- Patent number 11,380,482
- Issue date Jul 5, 2022
- TDK Corporation
- Shota Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing layered chip package
- Patent number 8,513,034
- Issue date Aug 20, 2013
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Layered chip package with wiring on the side surfaces
- Patent number 8,324,741
- Issue date Dec 4, 2012
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layered chip package with heat sink
- Patent number 8,154,116
- Issue date Apr 10, 2012
- HeadwayTechnologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layered chip package
- Patent number 8,134,229
- Issue date Mar 13, 2012
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method of manufacturing the same
- Patent number 8,050,045
- Issue date Nov 1, 2011
- TDK Corporation
- Nobuyuki Okuzawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layered chip package with wiring on the side surfaces
- Patent number 7,968,374
- Issue date Jun 28, 2011
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layered chip package and method of manufacturing same
- Patent number 7,964,976
- Issue date Jun 21, 2011
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of manufacturing a coil component
- Patent number 7,905,008
- Issue date Mar 15, 2011
- TDK Corporation
- Makoto Yoshida
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Layered chip package and method of manufacturing same
- Patent number 7,868,442
- Issue date Jan 11, 2011
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing layered chip package
- Patent number 7,863,095
- Issue date Jan 4, 2011
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layered chip package and method of manufacturing same
- Patent number 7,846,772
- Issue date Dec 7, 2010
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing layered chip package
- Patent number 7,767,494
- Issue date Aug 3, 2010
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layered chip package and method of manufacturing same
- Patent number 7,745,259
- Issue date Jun 29, 2010
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film device and method for manufacturing the same
- Patent number 7,683,269
- Issue date Mar 23, 2010
- TDK Corporation
- Toshiyuki Yoshizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layered chip package that implements memory device
- Patent number 7,557,439
- Issue date Jul 7, 2009
- TDK Corporation
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Common mode choke coil and method of manufacturing the same
- Patent number 7,414,508
- Issue date Aug 19, 2008
- TDK Corporation
- Nobuyuki Okuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component and method of manufacturing the same
- Patent number 7,397,334
- Issue date Jul 8, 2008
- TDK Corporation
- Makoto Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing coil component
- Patent number 7,318,269
- Issue date Jan 15, 2008
- TDK Corporation
- Makoto Yoshida
- G11 - INFORMATION STORAGE
Information Patent Grant
Coil component
- Patent number 7,283,028
- Issue date Oct 16, 2007
- TDK Corporation
- Makoto Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component and method of manufacturing the same
- Patent number 7,221,250
- Issue date May 22, 2007
- TDK Corporation
- Makoto Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component and method of manufacturing the same
- Patent number 7,145,427
- Issue date Dec 5, 2006
- TDK Corporation
- Makoto Yoshida
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240312695
- Publication date Sep 19, 2024
- TDK Corporation
- Nobuyuki OKUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT
- Publication number 20240312684
- Publication date Sep 19, 2024
- TDK Corporation
- Ryuji Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240312696
- Publication date Sep 19, 2024
- TDK Corporation
- Nobuyuki OKUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT AND METHOD OF MANUFACTURING COIL COMPONENT
- Publication number 20240153696
- Publication date May 9, 2024
- TDK Corporation
- Takuya TAKEUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER COIL COMPONENT
- Publication number 20230307164
- Publication date Sep 28, 2023
- TDK Corporation
- Munehiro TAKAKU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER COIL COMPONENT
- Publication number 20230307167
- Publication date Sep 28, 2023
- TDK Corporation
- Munehiro TAKAKU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER COIL COMPONENT AND METHOD FOR ADJUSTING CHARACTERISTICS...
- Publication number 20230307163
- Publication date Sep 28, 2023
- TDK Corporation
- Munehiro TAKAKU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED COIL COMPONENT
- Publication number 20230230756
- Publication date Jul 20, 2023
- TDK Corporation
- Nobuyuki OKUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED COIL COMPONENT
- Publication number 20230230757
- Publication date Jul 20, 2023
- TDK Corporation
- Nobuyuki OKUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER COIL COMPONENT
- Publication number 20230207182
- Publication date Jun 29, 2023
- TDK Corporation
- Nobuyuki OKUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT AND MANUFACTURING METHOD THEREFOR
- Publication number 20220130596
- Publication date Apr 28, 2022
- TDK Corporation
- Nobuyuki OKUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT
- Publication number 20220130601
- Publication date Apr 28, 2022
- TDK Corporation
- Nobuyuki OKUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT AND MANUFACTURING METHOD THEREFOR
- Publication number 20220130595
- Publication date Apr 28, 2022
- TDK Corporation
- Nobuyuki OKUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC COMPOSITION AND ELECTRONIC COMPONENT
- Publication number 20210012961
- Publication date Jan 14, 2021
- TDK Corporation
- Shota SUZUKI
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
DIELECTRIC COMPOSITION AND ELECTRONIC COMPONENT
- Publication number 20200294687
- Publication date Sep 17, 2020
- TDK Corporation
- Shota SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layered chip package with wiring on the side surfaces
- Publication number 20110221073
- Publication date Sep 15, 2011
- HEADWAY TECHNOLOGIES, INC.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing layered chip package
- Publication number 20110201137
- Publication date Aug 18, 2011
- HEADWAY TECHNOLOGIES, INC.
- Yoshitaka Sasaki
- G11 - INFORMATION STORAGE
Information Patent Application
Layered chip package
- Publication number 20100327464
- Publication date Dec 30, 2010
- HEADWAY TECHNOLOGIES, INC.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing layered chip package
- Publication number 20100304531
- Publication date Dec 2, 2010
- HEADWAY TECHNOLOGIES, INC.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layered chip package and method of manufacturing same
- Publication number 20100200977
- Publication date Aug 12, 2010
- HEADWAY TECHNOLOGIES, INC.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layered chip package with heat sink
- Publication number 20100109137
- Publication date May 6, 2010
- HEADWAY TECHNOLOGIES, INC.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layered chip package and method of manufacturing same
- Publication number 20100044879
- Publication date Feb 25, 2010
- HEADWAY TECHNOLOGIES, INC.
- Yoshitaka Sasaki
- G11 - INFORMATION STORAGE
Information Patent Application
Method of manufacturing layered chip package
- Publication number 20090325345
- Publication date Dec 31, 2009
- HEADWAY TECHNOLOGIES, INC.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layered chip package and method of manufacturing same
- Publication number 20090321956
- Publication date Dec 31, 2009
- TDK Corporation
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layered chip package and method of manufacturing same
- Publication number 20090321957
- Publication date Dec 31, 2009
- HEADWAY TECHNOLOGIES, INC.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layered chip package and method of manufacturing same
- Publication number 20090315189
- Publication date Dec 24, 2009
- HEADWAY TECHNOLOGIES, INC.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM CAPACITOR
- Publication number 20090244808
- Publication date Oct 1, 2009
- TDK Corporation
- Takashi OHTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20080236885
- Publication date Oct 2, 2008
- TDK Corporation
- Toshiyuki YOSHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Common mode choke coil and method of manufacturing the same
- Publication number 20070075819
- Publication date Apr 5, 2007
- TDK Corporation
- Nobuyuki Okuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component and method of manufacturing the same
- Publication number 20070040163
- Publication date Feb 22, 2007
- TDK Corporation
- Nobuyuki Okuzawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Nobuyuki Okuzawa

Person

Patents Grantslast 30 patents

Coil component and manufacturing method therefor

Dielectric composition and electronic component

Dielectric composition and electronic component

Method of manufacturing layered chip package

Layered chip package with wiring on the side surfaces

Layered chip package with heat sink

Layered chip package

Electronic component and method of manufacturing the same

Layered chip package with wiring on the side surfaces

Layered chip package and method of manufacturing same

Method of manufacturing a coil component

Layered chip package and method of manufacturing same

Method of manufacturing layered chip package

Layered chip package and method of manufacturing same

Method of manufacturing layered chip package

Layered chip package and method of manufacturing same

Thin film device and method for manufacturing the same

Layered chip package that implements memory device

Common mode choke coil and method of manufacturing the same

Coil component and method of manufacturing the same

Method of manufacturing coil component

Coil component

Coil component and method of manufacturing the same

Coil component and method of manufacturing the same

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT

COIL COMPONENT

ELECTRONIC COMPONENT

COIL COMPONENT AND METHOD OF MANUFACTURING COIL COMPONENT

MULTILAYER COIL COMPONENT

MULTILAYER COIL COMPONENT

MULTILAYER COIL COMPONENT AND METHOD FOR ADJUSTING CHARACTERISTICS...

LAMINATED COIL COMPONENT

LAMINATED COIL COMPONENT

MULTILAYER COIL COMPONENT

COIL COMPONENT AND MANUFACTURING METHOD THEREFOR

COIL COMPONENT

COIL COMPONENT AND MANUFACTURING METHOD THEREFOR

DIELECTRIC COMPOSITION AND ELECTRONIC COMPONENT

DIELECTRIC COMPOSITION AND ELECTRONIC COMPONENT

Layered chip package with wiring on the side surfaces

Method of manufacturing layered chip package

Layered chip package

Method of manufacturing layered chip package

Layered chip package and method of manufacturing same

Layered chip package with heat sink

Layered chip package and method of manufacturing same

Method of manufacturing layered chip package

Layered chip package and method of manufacturing same

Layered chip package and method of manufacturing same

Layered chip package and method of manufacturing same

THIN-FILM CAPACITOR

THIN FILM DEVICE AND METHOD FOR MANUFACTURING THE SAME

Common mode choke coil and method of manufacturing the same

Electronic component and method of manufacturing the same