Norihito Tsukahara

Person

Kyoto-fu, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Device and method for manufacturing fiber assembly
- Patent number 11,773,513
- Issue date Oct 3, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Taichi Nakamura
- D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information Patent Grant
Ion-sensitive substance, ion-sensitive membrane using the same, and...
- Patent number 11,745,145
- Issue date Sep 5, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kei Toyota
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Field asymmetric ion mobility spectrometer and method for separatin...
- Patent number 9,927,400
- Issue date Mar 27, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Masahiko Tsukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Paste dispenser for applying paste containing fillers using nozzle...
- Patent number 9,162,249
- Issue date Oct 20, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Masayoshi Koyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,076,752
- Issue date Jul 7, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Toshiyuki Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressed-contact type semiconductor device and method for manufactur...
- Patent number 9,018,035
- Issue date Apr 28, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Norihito Tsukahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a porous nickel plating part
- Patent number 8,816,481
- Issue date Aug 26, 2014
- Panasonic Corporation
- Keiko Ikuta
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of joining electronic component and the electronic component
- Patent number 8,304,338
- Issue date Nov 6, 2012
- Panasonic Corporation
- Norihito Tsukahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and wiring board manufacturing method
- Patent number 8,237,057
- Issue date Aug 7, 2012
- Panasonic Corporation
- Takayuki Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for jointing circuit board
- Patent number 8,115,109
- Issue date Feb 14, 2012
- Panasonic Corporation
- Masayoshi Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming artificial lipid membrane
- Patent number 8,062,489
- Issue date Nov 22, 2011
- Panasonic Corporation
- Akio Oki
- G01 - MEASURING TESTING
Information Patent Grant
Antenna built-in module, card type information device, and methods...
- Patent number 8,025,237
- Issue date Sep 27, 2011
- Panasonic Corporation
- Shozo Ochi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic circuit device and method for manufacturing same
- Patent number 7,935,892
- Issue date May 3, 2011
- Panasonic Corporation
- Kazuhiro Nishikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Storage medium with built-in antenna
- Patent number 7,924,228
- Issue date Apr 12, 2011
- Panasonic Corporation
- Shozo Ochi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor memory module having built-in antenna
- Patent number 7,471,260
- Issue date Dec 30, 2008
- Panasonic Corporation
- Shozo Ochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 7,381,902
- Issue date Jun 3, 2008
- Matsushita Electric Industrial Co., Ltd.
- Norihito Tsukahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density multilayer circuit module
- Patent number 7,375,421
- Issue date May 20, 2008
- Matsushita Electric Industrial Co., Ltd.
- Daisuke Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and its manufacturing method
- Patent number 7,376,318
- Issue date May 20, 2008
- Matsushita Electric Industrial Co., Ltd.
- Norihito Tsukahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board fabrication method and circuit board
- Patent number 7,353,600
- Issue date Apr 8, 2008
- Matsushita Electric Industrial Co., Ltd.
- Norihito Tsukahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacturing the same
- Patent number 7,297,876
- Issue date Nov 20, 2007
- Matsushita Electric Industrial Co., Ltd.
- Daisuke Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnection substrate and fabrication method thereof
- Patent number 7,233,069
- Issue date Jun 19, 2007
- Matsushita Electric Industrial Co., Ltd.
- Norihito Tsukahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting structure of circuit board and method for manufacturing...
- Patent number 7,229,293
- Issue date Jun 12, 2007
- Matsushita Electric Industrial Co., Ltd.
- Daisuke Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic circuit device and method of manufacturing the same
- Patent number 7,186,925
- Issue date Mar 6, 2007
- Matsushita Electric Industrial Co., Ltd.
- Norihito Tsukahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and its manufacturing method
- Patent number 7,180,749
- Issue date Feb 20, 2007
- Matsushita Electric Industrial Co., Ltd.
- Norihito Tsukahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic circuit device and its manufacturing method
- Patent number 7,180,007
- Issue date Feb 20, 2007
- Matsushita Electric Industrial Co., Ltd.
- Kazuhiro Nishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for manufacturing electronic component-mounted...
- Patent number 7,176,055
- Issue date Feb 13, 2007
- Matsushita Electric Industrial Co., Ltd.
- Norihito Tsukahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package manufacturing method and semiconductor...
- Patent number 7,090,482
- Issue date Aug 15, 2006
- Matsushita Electric Industrial Co., Ltd.
- Norihito Tsukahara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method for electronic component-mounted component, ma...
- Patent number 7,084,008
- Issue date Aug 1, 2006
- Matsushita Electric Industrial Co., Ltd.
- Daisuke Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor element having protruded bump electrodes
- Patent number 7,071,090
- Issue date Jul 4, 2006
- Matsushita Electric Industrial Co., Ltd.
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered circuit board forming method and multilayered circuit...
- Patent number 6,971,167
- Issue date Dec 6, 2005
- Matsushita Electric Industrial Co., Ltd.
- Kazuhiro Nishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ANTENNA STRUCTURE AND ANTENNA ARRAY STRUCTURE
- Publication number 20250015514
- Publication date Jan 9, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- NORIHITO TSUKAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR MANUFACTURING FIBER ASSEMBLY
- Publication number 20220372659
- Publication date Nov 24, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- TAICHI NAKAMURA
- D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information Patent Application
FIBER ASSEMBLY AND METHOD FOR PRODUCING FIBER ASSEMBLY
- Publication number 20220341071
- Publication date Oct 27, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- TAICHI NAKAMURA
- D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information Patent Application
FIBER SHEET, METHOD FOR MANUFACTURING FIBER SHEET, AND CELL CULTURE...
- Publication number 20220073864
- Publication date Mar 10, 2022
- Panasonic Intellectual Property Management Co.,Ltd
- NORIHITO TSUKAHARA
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
ION-SENSITIVE SUBSTANCE, ION-SENSITIVE MEMBRANE USING THE SAME, AND...
- Publication number 20210362096
- Publication date Nov 25, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- KEI TOYOTA
- C07 - ORGANIC CHEMISTRY
Information Patent Application
CELL CULTURE CHIP
- Publication number 20210348097
- Publication date Nov 11, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- TAICHI NAKAMURA
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
FIBER MESH SHEET, METHOD FOR MANUFACTURING FIBER MESH SHEET, AND CE...
- Publication number 20210285138
- Publication date Sep 16, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- TAICHI NAKAMURA
- D04 - BRAIDING LACE-MAKING KNITTING TRIMMINGS NON-WOVEN FABRICS
Information Patent Application
FIELD ASYMMETRIC ION MOBILITY SPECTROMETER AND METHOD FOR SEPARATIN...
- Publication number 20170343510
- Publication date Nov 30, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- MASAHIKO TSUKUDA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140231981
- Publication date Aug 21, 2014
- PANASONIC CORPORATION
- Toshiyuki Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSED-CONTACT TYPE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTUR...
- Publication number 20140110827
- Publication date Apr 24, 2014
- PANASONIC CORPORATION
- Norihito Tsukahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIOSENSOR DEVICE
- Publication number 20140054170
- Publication date Feb 27, 2014
- Norihito Tsukahara
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140054757
- Publication date Feb 27, 2014
- PANASONIC CORPORATION
- Keiko Ikuta
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR FORMING ARTIFICIAL LIPID MEMBRANE
- Publication number 20110083793
- Publication date Apr 14, 2011
- PANASONIC CORPORATION
- Akio OKI
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF JOINING ELECTRONIC COMPONENT AND THE ELECTRONIC COMPONENT
- Publication number 20100244283
- Publication date Sep 30, 2010
- PANASONIC CORPORATION
- Norihito Tsukahara
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ANTENNA BUILT-IN MODULE, CARD TYPE INFORMATION DEVICE, AND METHODS...
- Publication number 20100163630
- Publication date Jul 1, 2010
- Matsushita Electric Industrial Co., Ltd.
- Shozo Ochi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PASTE APPLICATOR AND PASTE APPLICATION METHOD
- Publication number 20100080912
- Publication date Apr 1, 2010
- PANASONIC CORPORATION
- Masayoshi Koyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STORAGE MEDIUM WITH BUILT-IN ANTENNA
- Publication number 20100052996
- Publication date Mar 4, 2010
- Shozo Ochi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD
- Publication number 20090314528
- Publication date Dec 24, 2009
- PANASONIC CORPORATION
- Takayuki Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR JOINTING CIRCUIT BOARD
- Publication number 20090266592
- Publication date Oct 29, 2009
- Panasonic Corporation
- Masayoshi Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CIRCUIT DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20090133900
- Publication date May 28, 2009
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Kazuhiro Nishikawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor Memory Module Having Built-In Antenna
- Publication number 20080111756
- Publication date May 15, 2008
- Shozo Ochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Paste and Electronic Device Using Same
- Publication number 20070277909
- Publication date Dec 6, 2007
- Norihito Tsukahara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for manufacturing electronic component-mounted...
- Publication number 20070200217
- Publication date Aug 30, 2007
- Norihito Tsukahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic circuit device and method of manufacturing the same
- Publication number 20070127224
- Publication date Jun 7, 2007
- Norihito Tsukahara
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Circuit board and its manufacturing method
- Publication number 20070114058
- Publication date May 24, 2007
- Norihito Tsukahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connecting structure of circuit board and method for manufacturing...
- Publication number 20060014403
- Publication date Jan 19, 2006
- Daisuke Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit module and method for manufacturing the same
- Publication number 20050275088
- Publication date Dec 15, 2005
- Daisuke Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor element having protruded bump electrodes
- Publication number 20050146029
- Publication date Jul 7, 2005
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic circuit device, and method and apparatus for manufacturi...
- Publication number 20050093172
- Publication date May 5, 2005
- Norihito Tsukahara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Wiring board and method of manufacturing the same
- Publication number 20050087363
- Publication date Apr 28, 2005
- Norihito Tsukahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Norihito Tsukahara

Person

Patents Grantslast 30 patents

Device and method for manufacturing fiber assembly

Ion-sensitive substance, ion-sensitive membrane using the same, and...

Field asymmetric ion mobility spectrometer and method for separatin...

Paste dispenser for applying paste containing fillers using nozzle...

Semiconductor device and method for manufacturing the same

Pressed-contact type semiconductor device and method for manufactur...

Semiconductor device having a porous nickel plating part

Method of joining electronic component and the electronic component

Wiring board and wiring board manufacturing method

Circuit board and method for jointing circuit board

Method for forming artificial lipid membrane

Antenna built-in module, card type information device, and methods...

Electronic circuit device and method for manufacturing same

Storage medium with built-in antenna

Semiconductor memory module having built-in antenna

Wiring board and method of manufacturing the same

High density multilayer circuit module

Circuit board and its manufacturing method

Circuit board fabrication method and circuit board

Circuit board and method of manufacturing the same

Interconnection substrate and fabrication method thereof

Connecting structure of circuit board and method for manufacturing...

Electronic circuit device and method of manufacturing the same

Circuit board and its manufacturing method

Electronic circuit device and its manufacturing method

Method and apparatus for manufacturing electronic component-mounted...

Semiconductor device package manufacturing method and semiconductor...

Manufacturing method for electronic component-mounted component, ma...

Semiconductor element having protruded bump electrodes

Multilayered circuit board forming method and multilayered circuit...

Patents Applicationslast 30 patents

ANTENNA STRUCTURE AND ANTENNA ARRAY STRUCTURE

DEVICE AND METHOD FOR MANUFACTURING FIBER ASSEMBLY

FIBER ASSEMBLY AND METHOD FOR PRODUCING FIBER ASSEMBLY

FIBER SHEET, METHOD FOR MANUFACTURING FIBER SHEET, AND CELL CULTURE...

ION-SENSITIVE SUBSTANCE, ION-SENSITIVE MEMBRANE USING THE SAME, AND...

CELL CULTURE CHIP

FIBER MESH SHEET, METHOD FOR MANUFACTURING FIBER MESH SHEET, AND CE...

FIELD ASYMMETRIC ION MOBILITY SPECTROMETER AND METHOD FOR SEPARATIN...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

PRESSED-CONTACT TYPE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTUR...

BIOSENSOR DEVICE

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR FORMING ARTIFICIAL LIPID MEMBRANE

METHOD OF JOINING ELECTRONIC COMPONENT AND THE ELECTRONIC COMPONENT

ANTENNA BUILT-IN MODULE, CARD TYPE INFORMATION DEVICE, AND METHODS...

PASTE APPLICATOR AND PASTE APPLICATION METHOD

STORAGE MEDIUM WITH BUILT-IN ANTENNA

WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD

CIRCUIT BOARD AND METHOD FOR JOINTING CIRCUIT BOARD

ELECTRONIC CIRCUIT DEVICE AND METHOD FOR MANUFACTURING SAME

Semiconductor Memory Module Having Built-In Antenna

Solder Paste and Electronic Device Using Same

Method and apparatus for manufacturing electronic component-mounted...

Electronic circuit device and method of manufacturing the same

Circuit board and its manufacturing method

Connecting structure of circuit board and method for manufacturing...

Circuit module and method for manufacturing the same

Semiconductor element having protruded bump electrodes

Electronic circuit device, and method and apparatus for manufacturi...

Wiring board and method of manufacturing the same