Noriko Shimizu

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Yokohama-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Processing method and processing device of semiconductor wafer, and...
- Patent number 8,790,995
- Issue date Jul 29, 2014
- Kabushiki Kaisha Toshiba
- Shinya Takyu
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing a semiconductor device and substrate separa...
- Patent number 8,771,456
- Issue date Jul 8, 2014
- Kabushiki Kaisha Toshiba
- Noriko Shimizu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method and apparatus for cleaving a wafer through expansion resulti...
- Patent number 7,294,558
- Issue date Nov 13, 2007
- Kabushiki Kaisha Toshiba
- Noriko Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SUBSTRATE SEPARA...
- Publication number 20130248099
- Publication date Sep 26, 2013
- Kabushiki Kaisha Toshiba
- Noriko SHIMIZU
- B32 - LAYERED PRODUCTS
Information Patent Application
PROCESSING METHOD AND PROCESSING DEVICE OF SEMICONDUCTOR WAFER, AND...
- Publication number 20130001766
- Publication date Jan 3, 2013
- Kabushiki Kaisha Toshiba
- Shinya TAKYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20120329369
- Publication date Dec 27, 2012
- Kabushiki Kaisha Toshiba
- Noriko SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20080299686
- Publication date Dec 4, 2008
- Kabushiki Kaisha Toshiba
- Motoshige KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for cleaving a wafer through expansion resulti...
- Publication number 20050196899
- Publication date Sep 8, 2005
- Noriko Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR