Norio Okabe

Person

Hitachi-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit tape having adhesive film semiconductor device and a method...
- Patent number 7,202,570
- Issue date Apr 10, 2007
- Renesas Technology Corp.
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring tape for semiconductor device including a buffer layer havin...
- Patent number 7,038,325
- Issue date May 2, 2006
- Hitachi Cable, Ltd.
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit tape having adhesive film, semiconductor device, and a meth...
- Patent number 6,791,194
- Issue date Sep 14, 2004
- Hitachi, Ltd.
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, tab tape for semiconductor device, method of...
- Patent number 6,506,627
- Issue date Jan 14, 2003
- Hitachi Cable, Ltd.
- Gen Murakamz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a porous buffer layer for semiconductor...
- Patent number 6,433,440
- Issue date Aug 13, 2002
- Hitachi, Ltd.
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape carrier for BGA and semiconductor device using the same
- Patent number 6,376,916
- Issue date Apr 23, 2002
- Hitachi Cable, Ltd.
- Masayuki Hosono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing BGA type semiconductor device, TAB tape for B...
- Patent number 6,353,259
- Issue date Mar 5, 2002
- Hitachi Cable, Ltd.
- Takumi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, tab tape for semiconductor device, method of...
- Patent number 6,323,058
- Issue date Nov 27, 2001
- Hitachi Cable Ltd.
- Gen Murakamz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape carrier for BGA and semiconductor device using the same
- Patent number 6,281,570
- Issue date Aug 28, 2001
- Hitachi Cable, Ltd.
- Yasuharu Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit tape having adhesive film, semiconductor device, and a meth...
- Patent number 6,114,753
- Issue date Sep 5, 2000
- Hitachi, Ltd.
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, interposer for semiconductor device
- Patent number 6,031,292
- Issue date Feb 29, 2000
- Hitachi Cable, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer for semiconductor device
- Patent number 5,866,948
- Issue date Feb 2, 1999
- Hitachi Cable, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing double-sided circuit tape carrier
- Patent number 5,837,154
- Issue date Nov 17, 1998
- Hitachi Cable, Ltd.
- Norio Okabe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Circuit tape having adhesive film semiconductor device and a method...
- Publication number 20040224149
- Publication date Nov 11, 2004
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring tape for semiconductor device including a buffer layer havin...
- Publication number 20040195702
- Publication date Oct 7, 2004
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit tape having adhesive film, semiconductor device, and a meth...
- Publication number 20020160185
- Publication date Oct 31, 2002
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and wiring tape for semiconductor device
- Publication number 20020158343
- Publication date Oct 31, 2002
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for producing BGA type semiconductor device, TAB tape for B...
- Publication number 20020030248
- Publication date Mar 14, 2002
- Hitachi Cable, Ltd.
- Takumi Sato
- H01 - BASIC ELECTRIC ELEMENTS

Norio Okabe

Person

Patents Grantslast 30 patents

Circuit tape having adhesive film semiconductor device and a method...

Wiring tape for semiconductor device including a buffer layer havin...

Circuit tape having adhesive film, semiconductor device, and a meth...

Semiconductor device, tab tape for semiconductor device, method of...

Semiconductor device having a porous buffer layer for semiconductor...

Tape carrier for BGA and semiconductor device using the same

Process for producing BGA type semiconductor device, TAB tape for B...

Semiconductor device, tab tape for semiconductor device, method of...

Tape carrier for BGA and semiconductor device using the same

Circuit tape having adhesive film, semiconductor device, and a meth...

Semiconductor device, interposer for semiconductor device

Interposer for semiconductor device

Method of manufacturing double-sided circuit tape carrier

Patents Applicationslast 30 patents

Circuit tape having adhesive film semiconductor device and a method...

Wiring tape for semiconductor device including a buffer layer havin...

Circuit tape having adhesive film, semiconductor device, and a meth...

Semiconductor device and wiring tape for semiconductor device

Process for producing BGA type semiconductor device, TAB tape for B...