Norio Sakai

Person

Kyoto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Coil component
- Patent number 11,430,601
- Issue date Aug 30, 2022
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor component manufacturing method and inductor component
- Patent number 11,239,022
- Issue date Feb 1, 2022
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor component
- Patent number 11,164,695
- Issue date Nov 2, 2021
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component
- Patent number 11,139,101
- Issue date Oct 5, 2021
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil module
- Patent number 11,075,029
- Issue date Jul 27, 2021
- Murata Manufacturing Co., Ltd.
- Shinichiro Banba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency component
- Patent number 10,912,188
- Issue date Feb 2, 2021
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component
- Patent number 10,886,059
- Issue date Jan 5, 2021
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor device, inductor array, and multilayered substrate, and me...
- Patent number 10,734,150
- Issue date Aug 4, 2020
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor component
- Patent number 10,734,156
- Issue date Aug 4, 2020
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor component and manufacturing method for inductor component
- Patent number 10,726,988
- Issue date Jul 28, 2020
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency module and manufacturing method therefor
- Patent number 10,559,535
- Issue date Feb 11, 2020
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component and module including the same
- Patent number 10,553,341
- Issue date Feb 4, 2020
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 10,553,347
- Issue date Feb 4, 2020
- Murata Manufacturing Co., Ltd.
- Shinichiro Banba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor component and method of manufacturing inductor component
- Patent number 10,506,717
- Issue date Dec 10, 2019
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical element, mobile device, and method for manufacturing ele...
- Patent number 10,476,133
- Issue date Nov 12, 2019
- Murata Manufacturing Co., Ltd.
- Bunta Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil module
- Patent number 10,410,782
- Issue date Sep 10, 2019
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component, coil module, and method for manufacturing coil comp...
- Patent number 10,403,431
- Issue date Sep 3, 2019
- Murata Manufacturing Co., Ltd.
- Shinichiro Banba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin multilayer substrate
- Patent number 10,080,280
- Issue date Sep 18, 2018
- Murata Manufacturing Co., Ltd.
- Norio Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic circuit module
- Patent number 10,056,311
- Issue date Aug 21, 2018
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin multilayer substrate
- Patent number 9,769,917
- Issue date Sep 19, 2017
- Murata Manufacturing Co., Ltd.
- Norio Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component-embedded resin substrate
- Patent number 9,526,176
- Issue date Dec 20, 2016
- Murata Manufacturing Co., Ltd.
- Norio Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring substrate, probe card, and method for manufacturi...
- Patent number 9,456,494
- Issue date Sep 27, 2016
- Murata Manufacturing Co., Ltd.
- Norio Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer flexible substrate
- Patent number 9,253,881
- Issue date Feb 2, 2016
- Murata Manufacturing Co., Ltd.
- Norio Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer ceramic electronic device and method for manufacturing t...
- Patent number 9,226,400
- Issue date Dec 29, 2015
- Murata Manufacturing Co., Ltd.
- Masato Nomiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer substrate with built-in chip-ty...
- Patent number 8,720,050
- Issue date May 13, 2014
- Murata Manufacturing Co., Ltd.
- Osamu Chikagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate and manufacturing method thereof
- Patent number 8,604,349
- Issue date Dec 10, 2013
- Murata Manufacturing Co., Ltd.
- Norio Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer ceramic electronic device
- Patent number 8,371,026
- Issue date Feb 12, 2013
- Murata Manufacturing Co., Ltd.
- Masato Nomiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via hole forming method using electrophotographic printing method
- Patent number 8,308,887
- Issue date Nov 13, 2012
- Murata Manufacturing Co., Ltd.
- Kazuhiro Isebo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging material with electromagnetic coupling module
- Patent number 8,299,968
- Issue date Oct 30, 2012
- Murata Manufacturing Co., Ltd.
- Makoto Osamura
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Container with electromagnetic coupling module
- Patent number 8,031,124
- Issue date Oct 4, 2011
- Murata Manufacturing Co., Ltd.
- Noboru Kato
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
INDUCTOR COMPONENT AND METHOD OF MANUFACTURING INDUCTOR COMPONENT
- Publication number 20180332709
- Publication date Nov 15, 2018
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20180166394
- Publication date Jun 14, 2018
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR COMPONENT
- Publication number 20180090263
- Publication date Mar 29, 2018
- MURATA MANUFACTURING CO., LTD.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN MULTILAYER SUBSTRATE
- Publication number 20170347447
- Publication date Nov 30, 2017
- MURATA MANUFACTURING CO., LTD.
- Norio Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CIRCUIT MODULE
- Publication number 20170323838
- Publication date Nov 9, 2017
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT
- Publication number 20170301456
- Publication date Oct 19, 2017
- MURATA MANUFACTURING CO., LTD.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY COMPONENT
- Publication number 20170231085
- Publication date Aug 10, 2017
- MURATA MANUFACTURING CO., LTD.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT
- Publication number 20170221624
- Publication date Aug 3, 2017
- MURATA MANUFACTURING CO., LTD.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR COMPONENT
- Publication number 20170213638
- Publication date Jul 27, 2017
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR COMPONENT AND MANUFACTURING METHOD FOR INDUCTOR COMPONENT
- Publication number 20170186528
- Publication date Jun 29, 2017
- MURATA MANUFACTURING CO., LTD.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR COMPONENT MANUFACTURING METHOD AND INDUCTOR COMPONENT
- Publication number 20170178796
- Publication date Jun 22, 2017
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL MODULE
- Publication number 20170092415
- Publication date Mar 30, 2017
- MURATA MANUFACTURING CO., LTD.
- Shinichiro BANBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT
- Publication number 20170084384
- Publication date Mar 23, 2017
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT AND MODULE INCLUDING THE SAME
- Publication number 20170062113
- Publication date Mar 2, 2017
- MURATA MANUFACTURING CO., LTD.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL MODULE
- Publication number 20170018349
- Publication date Jan 19, 2017
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT, COIL MODULE, AND METHOD FOR MANUFACTURING COIL COMP...
- Publication number 20160372259
- Publication date Dec 22, 2016
- MURATA MANUFACTURING CO., LTD.
- Shinichiro BANBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL ELEMENT, MOBILE DEVICE, AND METHOD FOR MANUFACTURING ELE...
- Publication number 20160372819
- Publication date Dec 22, 2016
- Murata Manufacturing Co., Ltd.
- Bunta OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR DEVICE, INDUCTOR ARRAY, AND MULTILAYERED SUBSTRATE, AND ME...
- Publication number 20160372246
- Publication date Dec 22, 2016
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE
- Publication number 20160358707
- Publication date Dec 8, 2016
- MURATA MANUFACTURING CO., LTD.
- Shinichiro BANBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE PROCESSING APPARATUS, IMAGE PROCESSING METHOD, AND RECORDING...
- Publication number 20150222764
- Publication date Aug 6, 2015
- Norio SAKAI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
RESIN MULTILAYER SUBSTRATE
- Publication number 20140321076
- Publication date Oct 30, 2014
- Norio Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE, METHOD FOR MANUFACTURING THE MODULE, AND ELECTRONIC APPARA...
- Publication number 20140251670
- Publication date Sep 11, 2014
- Murata Manufacturing Co., Ltd.
- Norio Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT-EMBEDDED RESIN SUBSTRATE
- Publication number 20140218884
- Publication date Aug 7, 2014
- Murata Manufacturing Co., Ltd.
- Norio Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING SUBSTRATE, PROBE CARD, AND METHOD FOR MANUFACTURI...
- Publication number 20140209356
- Publication date Jul 31, 2014
- Murata Manufacturing Co., Ltd.
- Norio SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING T...
- Publication number 20140016288
- Publication date Jan 16, 2014
- Murata Manufacturing Co., Ltd.
- Masato Nomiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER FLEXIBLE SUBSTRATE
- Publication number 20130256001
- Publication date Oct 3, 2013
- Murata Manufacturing Co., Ltd.
- Norio SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT INCORPORATING BOARD AND COMPOSITE MODULE
- Publication number 20130050957
- Publication date Feb 28, 2013
- Murata Manufacturing Co., Ltd.
- Nobuaki OGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20120205145
- Publication date Aug 16, 2012
- Murata Manufacturing Co., Ltd.
- Norio SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20120176751
- Publication date Jul 12, 2012
- Murata Manufacturing Co., Ltd.
- Norio SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA HOLE FORMING METHOD USING ELECTROPHOTOGRAPHIC PRINTING METHOD
- Publication number 20110265948
- Publication date Nov 3, 2011
- Murata Manufacturing Co., Ltd.
- Kazuhiro ISEBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Norio Sakai

Person

Patents Grantslast 30 patents

Coil component

Inductor component manufacturing method and inductor component

Inductor component

Coil component

Coil module

High-frequency component

Coil component

Inductor device, inductor array, and multilayered substrate, and me...

Inductor component

Inductor component and manufacturing method for inductor component

High-frequency module and manufacturing method therefor

Coil component and module including the same

Module

Inductor component and method of manufacturing inductor component

Electrical element, mobile device, and method for manufacturing ele...

Coil module

Coil component, coil module, and method for manufacturing coil comp...

Resin multilayer substrate

Electronic circuit module

Resin multilayer substrate

Component-embedded resin substrate

Multilayer wiring substrate, probe card, and method for manufacturi...

Multilayer flexible substrate

Multilayer ceramic electronic device and method for manufacturing t...

Method for manufacturing multilayer substrate with built-in chip-ty...

Multilayer substrate and manufacturing method thereof

Method for manufacturing multilayer ceramic electronic device

Via hole forming method using electrophotographic printing method

Packaging material with electromagnetic coupling module

Container with electromagnetic coupling module

Patents Applicationslast 30 patents

INDUCTOR COMPONENT AND METHOD OF MANUFACTURING INDUCTOR COMPONENT

HIGH-FREQUENCY MODULE AND MANUFACTURING METHOD THEREFOR

INDUCTOR COMPONENT

RESIN MULTILAYER SUBSTRATE

ELECTRONIC CIRCUIT MODULE

COIL COMPONENT

HIGH-FREQUENCY COMPONENT

COIL COMPONENT

INDUCTOR COMPONENT

INDUCTOR COMPONENT AND MANUFACTURING METHOD FOR INDUCTOR COMPONENT

INDUCTOR COMPONENT MANUFACTURING METHOD AND INDUCTOR COMPONENT

COIL MODULE

COIL COMPONENT

COIL COMPONENT AND MODULE INCLUDING THE SAME

COIL MODULE

COIL COMPONENT, COIL MODULE, AND METHOD FOR MANUFACTURING COIL COMP...

ELECTRICAL ELEMENT, MOBILE DEVICE, AND METHOD FOR MANUFACTURING ELE...

INDUCTOR DEVICE, INDUCTOR ARRAY, AND MULTILAYERED SUBSTRATE, AND ME...

MODULE

IMAGE PROCESSING APPARATUS, IMAGE PROCESSING METHOD, AND RECORDING...

RESIN MULTILAYER SUBSTRATE

MODULE, METHOD FOR MANUFACTURING THE MODULE, AND ELECTRONIC APPARA...

COMPONENT-EMBEDDED RESIN SUBSTRATE

MULTILAYER WIRING SUBSTRATE, PROBE CARD, AND METHOD FOR MANUFACTURI...

MULTILAYER CERAMIC ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING T...

MULTILAYER FLEXIBLE SUBSTRATE

ELECTRONIC COMPONENT INCORPORATING BOARD AND COMPOSITE MODULE

MULTILAYER SUBSTRATE AND MANUFACTURING METHOD THEREOF

ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREFOR

VIA HOLE FORMING METHOD USING ELECTROPHOTOGRAPHIC PRINTING METHOD