Noritaka Anzai

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor apparatus with decoupling capacitor
- Patent number 8,018,055
- Issue date Sep 13, 2011
- Oki Electric Industry Co., Ltd.
- Makoto Terui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor apparatus with decoupling capacitor
- Patent number 7,714,434
- Issue date May 11, 2010
- Oki Electric Industry Co., Ltd.
- Makoto Terui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of producing the same
- Patent number 7,616,167
- Issue date Nov 10, 2009
- Oki Semiconductor Co., Ltd.
- Noritaka Anzai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device that suppresses variations in high frequency c...
- Patent number 7,545,036
- Issue date Jun 9, 2009
- Oki Semiconductor Co., Ltd.
- Makoto Terui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with signal line having decreased characterist...
- Patent number 7,538,417
- Issue date May 26, 2009
- Oki Semiconductor Co., Ltd.
- Noritaka Anzai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 7,511,351
- Issue date Mar 31, 2009
- Oki Electric Industry Co., Ltd.
- Noritaka Anzai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus with decoupling capacitor
- Patent number 7,459,765
- Issue date Dec 2, 2008
- Oki Electric Industry Co., Ltd.
- Makoto Terui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with signal line having decreased characterist...
- Patent number 7,239,028
- Issue date Jul 3, 2007
- Oki Electric Industry Co., Ltd.
- Noritaka Anzai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus with decoupling capacitor
- Patent number 7,173,335
- Issue date Feb 6, 2007
- Oki Electric Industry Co., Ltd.
- Makoto Terui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 7,026,699
- Issue date Apr 11, 2006
- Oki Electric Industry Co., Ltd.
- Noritaka Anzai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with signal line having decreased characterist...
- Patent number 6,982,494
- Issue date Jan 3, 2006
- Oki Electric Industry Co., Ltd.
- Noritaka Anzai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-molded semiconductor device that includes at least one additi...
- Patent number 6,833,607
- Issue date Dec 21, 2004
- Oki Electric Industry Co., Ltd.
- Noritaka Anzai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus with decoupling capacitor
- Patent number 6,806,564
- Issue date Oct 19, 2004
- Oki Electric Industry Co., Ltd.
- Makoto Terui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor apparatus with decoupling capacitor
- Patent number 6,707,146
- Issue date Mar 16, 2004
- Oki Electric Industry Co., Ltd.
- Makoto Terui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor apparatus with decoupling capacitor
- Patent number 6,608,375
- Issue date Aug 19, 2003
- Oki Electric Industry Co., Ltd.
- Makoto Terui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin-sealed semiconductor device and method of manufacturing the d...
- Patent number 6,541,306
- Issue date Apr 1, 2003
- Oki Electric Industry Co., Ltd.
- Shinji Ohuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealed-type semiconductor device and method of manufacturing...
- Patent number 6,323,551
- Issue date Nov 27, 2001
- Oki Electric Industry Co., Ltd.
- Noritaka Anzai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-sealed semiconductor device and method of manufacturing the d...
- Patent number 6,274,938
- Issue date Aug 14, 2001
- Oki Electric Industry Co., Ltd.
- Shinji Ohuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad for stress releif between a substrate and an external subs...
- Patent number 6,259,163
- Issue date Jul 10, 2001
- Oki Electric Industry Co., Ltd.
- Shinji Ohuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices having solder bumps w...
- Patent number 6,251,704
- Issue date Jun 26, 2001
- Oki Electric Industry Co., Ltd.
- Shinji Ohuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,204,563
- Issue date Mar 20, 2001
- Oki Electric Industry Co., Ltd.
- Shinji Ohuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealing type semiconductor device
- Patent number 5,999,413
- Issue date Dec 7, 1999
- Oki Electric Industry Co., Ltd.
- Shinji Ohuchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor apparatus with decoupling capacitor
- Publication number 20100207244
- Publication date Aug 19, 2010
- Oki Electric Industry Co., Ltd.
- Makoto Terui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor apparatus with decoupling capacitor
- Publication number 20090096063
- Publication date Apr 16, 2009
- Oki Electric Industry Co., Ltd.
- Makoto Terui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor apparatus with decoupling capacitor
- Publication number 20070296069
- Publication date Dec 27, 2007
- Makoto Terui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method of producing the same
- Publication number 20070236393
- Publication date Oct 11, 2007
- Oki Electric Industry Co., Ltd.
- Noritaka Anzai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with signal line having decreased characterist...
- Publication number 20070187824
- Publication date Aug 16, 2007
- Noritaka Anzai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device that suppresses variations in high frequency c...
- Publication number 20070021089
- Publication date Jan 25, 2007
- Makoto Terui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device which includes an inductor therein and a manuf...
- Publication number 20060038257
- Publication date Feb 23, 2006
- Noritaka Anzai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20060022354
- Publication date Feb 2, 2006
- Noritaka Anzai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20050263847
- Publication date Dec 1, 2005
- Noritaka Anzai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20040238929
- Publication date Dec 2, 2004
- Noritaka Anzai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor apparatus with decoupling capacitor
- Publication number 20040145041
- Publication date Jul 29, 2004
- Makoto Terui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device
- Publication number 20040026782
- Publication date Feb 12, 2004
- Noritaka Anzai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030205808
- Publication date Nov 6, 2003
- Makoto Terui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030189251
- Publication date Oct 9, 2003
- Makoto Terui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin-molded semiconductor device
- Publication number 20030102543
- Publication date Jun 5, 2003
- Noritaka Anzai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor apparatus with decoupling capacitor
- Publication number 20020195705
- Publication date Dec 26, 2002
- Makoto Terui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor apparatus with decoupling capacitor
- Publication number 20020145180
- Publication date Oct 10, 2002
- Makoto Terui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin-sealed semiconductor device and method of manufacturing the d...
- Publication number 20020000676
- Publication date Jan 3, 2002
- Shinji Ohuchi
- H01 - BASIC ELECTRIC ELEMENTS

Noritaka Anzai

Person

Patents Grantslast 30 patents

Semiconductor apparatus with decoupling capacitor

Semiconductor apparatus with decoupling capacitor

Semiconductor device and method of producing the same

Semiconductor device that suppresses variations in high frequency c...

Semiconductor device with signal line having decreased characterist...

Semiconductor device and method for fabricating the same

Semiconductor apparatus with decoupling capacitor

Semiconductor device with signal line having decreased characterist...

Semiconductor apparatus with decoupling capacitor

Semiconductor device and method for fabricating the same

Semiconductor device with signal line having decreased characterist...

Resin-molded semiconductor device that includes at least one additi...

Semiconductor apparatus with decoupling capacitor

Semiconductor apparatus with decoupling capacitor

Semiconductor apparatus with decoupling capacitor

Resin-sealed semiconductor device and method of manufacturing the d...

Resin sealed-type semiconductor device and method of manufacturing...

Resin-sealed semiconductor device and method of manufacturing the d...

Bond pad for stress releif between a substrate and an external subs...

Method of manufacturing semiconductor devices having solder bumps w...

Semiconductor device

Resin sealing type semiconductor device

Patents Applicationslast 30 patents

Semiconductor apparatus with decoupling capacitor

Semiconductor apparatus with decoupling capacitor

Semiconductor apparatus with decoupling capacitor

Semiconductor device and method of producing the same

Semiconductor device with signal line having decreased characterist...

Semiconductor device that suppresses variations in high frequency c...

Semiconductor device which includes an inductor therein and a manuf...

Semiconductor device

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Semiconductor apparatus with decoupling capacitor

Semiconductor device

Semiconductor device

Semiconductor device

Resin-molded semiconductor device

Semiconductor apparatus with decoupling capacitor

Semiconductor apparatus with decoupling capacitor

Resin-sealed semiconductor device and method of manufacturing the d...