Number | Date | Country | Kind |
---|---|---|---|
9-245808 | Sep 1997 | JP |
Number | Name | Date | Kind |
---|---|---|---|
5068712 | Murakami et al. | Nov 1991 | |
5286679 | Farnworth et al. | Feb 1994 | |
5300459 | Ushikubo et al. | Apr 1994 | |
5466888 | Beng et al. | Nov 1995 | |
5519251 | Sato et al. | May 1996 | |
5583375 | Tsubosaki et al. | Dec 1996 | |
5759875 | Ahmad | Jun 1998 |
Number | Date | Country |
---|---|---|
0 651 040 | May 1995 | EP |
9729514 | Aug 1997 | WO |
Entry |
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Michael Pecht, Handbook of Electronic Package Design, pp. 765-772, 1991.* |
“Development of a Tapeless Lead-On-Chip (LOC) Package”, M. Amagai et al.; Texas Instruments Japan Limited, Miho Plant; Institute of Electrical and Electronics Engineers; May 1, 1994; pp. 506-512. |