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Noritaka Katagiri
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Nagano-shi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Wiring substrate, semiconductor device, and method of manufacturing...
Patent number
9,741,647
Issue date
Aug 22, 2017
Shinko Electric Industries Co., Ltd.
Shigetsugu Muramatsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bump structure, wiring substrate, semiconductor apparatus and bump...
Patent number
9,485,864
Issue date
Nov 1, 2016
Shinko Electric Industries Co., Ltd.
Kei Imafuji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer wiring board and method of fabrication thereof
Patent number
6,759,600
Issue date
Jul 6, 2004
Shinko Electric Industries Co., Ltd.
Toshinori Koyama
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of producing multilayer circuit board
Patent number
6,350,365
Issue date
Feb 26, 2002
Shinko Electric Industries Co., Ltd.
Toshinori Koyama
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
BUMP STRUCTURE, WIRING SUBSTRATE, SEMICONDUCTOR APPARATUS AND BUMP...
Publication number
20150029689
Publication date
Jan 29, 2015
Shinko Electric Industries Co., Ltd.
Kei IMAFUJI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING...
Publication number
20120119377
Publication date
May 17, 2012
Shinko Electric Industries Co., Ltd.
Shigetsugu Muramatsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multilayer wiring board and method of fabrication thereof
Publication number
20020157864
Publication date
Oct 31, 2002
Toshinori Koyama
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Application
Process for producing multilayer circuit board
Publication number
20020083586
Publication date
Jul 4, 2002
Takahiro Iijima
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC