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Norman L. OWENS
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Sun Lakes, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device having corrugated leads and method for forming
Patent number
10,134,660
Issue date
Nov 20, 2018
NXP USA, INC.
Jinbang Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die-to-die inductive communication devices and methods
Patent number
9,466,413
Issue date
Oct 11, 2016
FREESCALE SEMICONDUCTOR, INC.
Fred T. Brauchler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-strand substrate for ball-grid array assemblies and method
Patent number
7,199,306
Issue date
Apr 3, 2007
FREESCALE SEMICONDUCTOR, INC.
Norman Lee Owens
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor component comprising leadframe, semiconductor chip an...
Patent number
7,074,647
Issue date
Jul 11, 2006
FREESCALE SEMICONDUCTOR, INC.
Norman L. Owens
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-strand substrate for ball-grid array assemblies and method
Patent number
6,710,265
Issue date
Mar 23, 2004
Motorola, Inc.
Norman Lee Owens
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multi-strand substrate for ball-grid array assemblies and method
Patent number
6,465,743
Issue date
Oct 15, 2002
Motorola, Inc.
Norman Lee Owens
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having an outwardly arced die cavity
Patent number
4,918,512
Issue date
Apr 17, 1990
Motorola, Inc.
Norman L. Owens
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Compliant standoff for semiconductor packages
Patent number
4,816,896
Issue date
Mar 28, 1989
Motorola Inc.
Norman L. Owens
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING CORRUGATED LEADS AND METHOD FOR FORMING
Publication number
20180277464
Publication date
Sep 27, 2018
NXP USA, Inc.
JINBANG TANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE-TO-DIE INDUCTIVE COMMUNICATION DEVICES AND METHODS
Publication number
20150004902
Publication date
Jan 1, 2015
John M. PIGOTT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE-TO-DIE INDUCTIVE COMMUNICATION DEVICES AND METHODS
Publication number
20150001948
Publication date
Jan 1, 2015
Fred T. BRAUCHLER
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Application
MULTI-STRAND SUBSTRATE FOR BALL-GRID ARRAY ASSEMBLIES AND METHOD
Publication number
20080289867
Publication date
Nov 27, 2008
FREESCALE SEMICONDUCTOR, INC.
NORMAN LEE OWENS
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTI-STRAND SUBSTRATE FOR BALL-GRID ARRAY ASSEMBLIES AND METHOD
Publication number
20070137889
Publication date
Jun 21, 2007
Norman Lee Owens
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor component and method of manufacturing same
Publication number
20050006730
Publication date
Jan 13, 2005
MOTOROLA, INC.
Norman L. Owens
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-strand substrate for ball-grid array assemblies and method
Publication number
20040129452
Publication date
Jul 8, 2004
Norman Lee Owens
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multi-strand substrate for ball-grid array assemblies and method
Publication number
20030027377
Publication date
Feb 6, 2003
Norman Lee Owens
H01 - BASIC ELECTRIC ELEMENTS