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San Diego, CA, US
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Patent Application
INDUCTOR PACKAGES EMPLOYING WIRE BONDS OVER A LEAD FRAME TO FORM IN...
Publication number
20240038439
Publication date
Feb 1, 2024
QUALCOMM Incorporated
Kai Liu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
INTEGRATED DEVICE AND INTEGRATED PASSIVE DEVICE COMPRISING MAGNETIC...
Publication number
20240006308
Publication date
Jan 4, 2024
QUALCOMM Incorporated
Kai LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THIN FILM RESISTOR (TFR) DEVICE STRUCTURE FOR HIGH PERFORMANCE RADI...
Publication number
20230395491
Publication date
Dec 7, 2023
QUALCOMM Incorporated
Je-Hsiung LAN
H01 - BASIC ELECTRIC ELEMENTS