Nusrat Sherali

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Durham, NC, US

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Patents Grantslast 30 patents

Information Patent Grant
Movable image capture devices and methods for capture of images fro...
- Patent number 9,894,259
- Issue date Feb 13, 2018
- Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Jacob Kakou
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Through-hole-vias in multi-layer printed circuit boards
- Patent number 9,277,653
- Issue date Mar 1, 2016
- Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Moises Cases
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole-vias in multi-layer printed circuit boards
- Patent number 8,766,107
- Issue date Jul 1, 2014
- International Business Machines Corporation
- Moises Cases
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole-vias in multi-layer printed circuit boards
- Patent number 8,658,911
- Issue date Feb 25, 2014
- International Business Machines Corporation
- Moises Cases
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through hole-vias in multi-layer printed circuit boards
- Patent number 8,242,384
- Issue date Aug 14, 2012
- International Business Machines Corporation
- Moises Cases
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MOVABLE IMAGE CAPTURE DEVICES AND METHODS FOR CAPTURE OF IMAGES FRO...
- Publication number 20160381275
- Publication date Dec 29, 2016
- LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
- Jacob Kakou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THROUGH-HOLE-VIAS IN MULTI-LAYER PRINTED CIRCUIT BOARDS
- Publication number 20140123489
- Publication date May 8, 2014
- International Business Machines Corporation
- MOISES CASES
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Through-Hole-Vias In Multi-Layer Printed Circuit Boards
- Publication number 20120200346
- Publication date Aug 9, 2012
- International Business Machines Corporation
- Moises Cases
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Through-Hole-Vias In Multi-Layer Printed Circuit Boards
- Publication number 20120193135
- Publication date Aug 2, 2012
- International Business Machines Corporation
- Moises Cases
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Through-Hole-Vias In Multi-Layer Printed Circuit Boards
- Publication number 20110073359
- Publication date Mar 31, 2011
- International Business Machines Corporation
- Moises Cases
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR