Oliver Aubel

Person

Dresden, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer with improved plating current distribution
- Patent number 9,627,317
- Issue date Apr 18, 2017
- GLOBALFOUNDRIES Inc.
- Thomas Werner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Long-term heat treated integrated circuit arrangements and methods...
- Patent number 9,543,199
- Issue date Jan 10, 2017
- Infineon Technologies AG
- Oliver Aubel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including a die seal leakage detection mate...
- Patent number 9,455,232
- Issue date Sep 27, 2016
- GLOBALFOUNDRIES Inc.
- Thomas Werner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical breakdown protection layer
- Patent number 9,362,239
- Issue date Jun 7, 2016
- GLOBALFOUNDRIES Inc.
- Oliver Aubel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer with improved plating current distribution
- Patent number 9,349,641
- Issue date May 24, 2016
- GLOBALFOUNDRIES Inc.
- Thomas Werner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising metal-based eFuses of enhanced prog...
- Patent number 8,653,624
- Issue date Feb 18, 2014
- GLOBALFOUNDRIES Inc.
- Christian Hennesthal
- G11 - INFORMATION STORAGE
Information Patent Grant
Long-term heat-treated integrated circuit arrangements and methods...
- Patent number 8,643,183
- Issue date Feb 4, 2014
- Infineon Technologies AG
- Oliver Aubel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Built-in compliance in test structures for leakage and dielectric b...
- Patent number 8,314,625
- Issue date Nov 20, 2012
- GLOBALFOUNDRIES Inc.
- Oliver Aubel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising eFUSES of enhanced programming effi...
- Patent number 8,268,679
- Issue date Sep 18, 2012
- GLOBALFOUNDRIES, INC.
- Oliver Aubel
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Unified test structure for stress migration tests
- Patent number 8,174,010
- Issue date May 8, 2012
- GLOBALFOUNDRIES, INC.
- Frank Feustel
- G01 - MEASURING TESTING
Information Patent Grant
Providing superior electromigration performance and reducing deteri...
- Patent number 8,153,524
- Issue date Apr 10, 2012
- Advanced Micro Devices, Inc.
- Oliver Aubel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC chip stress testing
- Patent number 7,512,506
- Issue date Mar 31, 2009
- International Business Machines Corporation
- Oliver Aubel
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
COIL INDUCTOR
- Publication number 20160260794
- Publication date Sep 8, 2016
- GLOBALFOUNDRIES INC.
- Oliver Aubel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER WITH IMPROVED PLATING CURRENT DISTRIBUTION
- Publication number 20160240473
- Publication date Aug 18, 2016
- GLOBALFOUNDRIES INC.
- Thomas Werner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL BREAKDOWN PROTECTION LAYER
- Publication number 20160111382
- Publication date Apr 21, 2016
- GLOBALFOUNDRIES INC.
- Oliver Aubel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING A DIE SEAL LEAKAGE DETECTION MATE...
- Publication number 20160111381
- Publication date Apr 21, 2016
- GLOBALFOUNDRIES INC.
- Thomas Werner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER WITH IMPROVED PLATING CURRENT DISTRIBUTION
- Publication number 20160079116
- Publication date Mar 17, 2016
- GLOBALFOUNDRIES INC.
- Thomas Werner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Long-term heat treated integrated circuit arrangements and methods...
- Publication number 20160049329
- Publication date Feb 18, 2016
- INFINEON TECHNOLOGIES AG
- Oliver Aubel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING METAL-BASED eFUSES OF ENHANCED PROG...
- Publication number 20130307114
- Publication date Nov 21, 2013
- GLOBALFOUNDRIES INC.
- Jens Poppe
- G11 - INFORMATION STORAGE
Information Patent Application
Performance Enhancement in Metallization Systems of Microstructure...
- Publication number 20120153479
- Publication date Jun 21, 2012
- GLOBALFOUNDRIES INC.
- Oliver Aubel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING METAL-BASED eFUSES OF ENHANCED PROG...
- Publication number 20110156858
- Publication date Jun 30, 2011
- Jens Poppe
- G11 - INFORMATION STORAGE
Information Patent Application
RECESSED INTERLAYER DIELECTRIC IN A METALLIZATION STRUCTURE OF A SE...
- Publication number 20110049727
- Publication date Mar 3, 2011
- Oliver Aubel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROVIDING SUPERIOR ELECTROMIGRATION PERFORMANCE AND REDUCING DETERI...
- Publication number 20100221911
- Publication date Sep 2, 2010
- Oliver Aubel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUILT-IN COMPLIANCE IN TEST STRUCTURES FOR LEAKAGE AND DIELECTRIC B...
- Publication number 20100134125
- Publication date Jun 3, 2010
- Oliver Aubel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERFORMANCE ENHANCEMENT IN METALLIZATION SYSTEMS OF MICROSTRUCTURE...
- Publication number 20100133700
- Publication date Jun 3, 2010
- Thomas Werner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING eFUSES OF ENHANCED PROGRAMMING EFFI...
- Publication number 20100107403
- Publication date May 6, 2010
- Oliver Aubel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC CHIP STRESS TESTING
- Publication number 20080297188
- Publication date Dec 4, 2008
- International Business Machines Corporation
- Oliver Aubel
- G01 - MEASURING TESTING
Information Patent Application
UNIFIED TEST STRUCTURE FOR STRESS MIGRATION TESTS
- Publication number 20080265247
- Publication date Oct 30, 2008
- Frank Feustel
- G01 - MEASURING TESTING
Information Patent Application
Long-term heat-treated integrated circuit arrangements and methods...
- Publication number 20070105366
- Publication date May 10, 2007
- Oliver Aubel
- H01 - BASIC ELECTRIC ELEMENTS

Oliver Aubel

Person

Patents Grantslast 30 patents

Wafer with improved plating current distribution

Long-term heat treated integrated circuit arrangements and methods...

Semiconductor structure including a die seal leakage detection mate...

Vertical breakdown protection layer

Wafer with improved plating current distribution

Semiconductor device comprising metal-based eFuses of enhanced prog...

Long-term heat-treated integrated circuit arrangements and methods...

Built-in compliance in test structures for leakage and dielectric b...

Semiconductor device comprising eFUSES of enhanced programming effi...

Unified test structure for stress migration tests

Providing superior electromigration performance and reducing deteri...

IC chip stress testing

Patents Applicationslast 30 patents

COIL INDUCTOR

WAFER WITH IMPROVED PLATING CURRENT DISTRIBUTION

VERTICAL BREAKDOWN PROTECTION LAYER

SEMICONDUCTOR STRUCTURE INCLUDING A DIE SEAL LEAKAGE DETECTION MATE...

WAFER WITH IMPROVED PLATING CURRENT DISTRIBUTION

Long-term heat treated integrated circuit arrangements and methods...

SEMICONDUCTOR DEVICE COMPRISING METAL-BASED eFUSES OF ENHANCED PROG...

Performance Enhancement in Metallization Systems of Microstructure...

SEMICONDUCTOR DEVICE COMPRISING METAL-BASED eFUSES OF ENHANCED PROG...

RECESSED INTERLAYER DIELECTRIC IN A METALLIZATION STRUCTURE OF A SE...

PROVIDING SUPERIOR ELECTROMIGRATION PERFORMANCE AND REDUCING DETERI...

BUILT-IN COMPLIANCE IN TEST STRUCTURES FOR LEAKAGE AND DIELECTRIC B...

PERFORMANCE ENHANCEMENT IN METALLIZATION SYSTEMS OF MICROSTRUCTURE...

SEMICONDUCTOR DEVICE COMPRISING eFUSES OF ENHANCED PROGRAMMING EFFI...

IC CHIP STRESS TESTING

UNIFIED TEST STRUCTURE FOR STRESS MIGRATION TESTS

Long-term heat-treated integrated circuit arrangements and methods...