Omar J. Bchir

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices having electro-optical substrates
- Patent number 11,525,956
- Issue date Dec 13, 2022
- Micron Technology, Inc.
- Omar J. Bchir
- G11 - INFORMATION STORAGE
Information Patent Grant
Optoelectronic module package
- Patent number 11,239,377
- Issue date Feb 1, 2022
- Rockley Photonics Limited
- Gerald Cois Byrd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having photon integrated circuit (PIC) chips
- Patent number 11,024,617
- Issue date Jun 1, 2021
- Micron Technology, Inc.
- Omar J. Bchir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having electro-optical substrates
- Patent number 10,928,585
- Issue date Feb 23, 2021
- Micron Technology, Inc.
- Omar J. Bchir
- G11 - INFORMATION STORAGE
Information Patent Grant
Embedded thin film magnetic carrier for integrated voltage regulator
- Patent number 10,199,152
- Issue date Feb 5, 2019
- QUALCOMM Incorporated
- Mete Erturk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Panel level packaging for MEMS application
- Patent number 10,150,667
- Issue date Dec 11, 2018
- OBSIDIAN SENSORS, INC.
- Yaoling Pan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mechanical adhesion of copper metallization to dielectric with part...
- Patent number 9,929,097
- Issue date Mar 27, 2018
- Intel Corporation
- Ravi Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforced wafer level package comprising a core layer for reducing...
- Patent number 9,806,063
- Issue date Oct 31, 2017
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and method of forming the same
- Patent number 9,679,841
- Issue date Jun 13, 2017
- QUALCOMM Incorporated
- Houssam Wafic Jomaa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded bridge structure in a substrate
- Patent number 9,642,259
- Issue date May 2, 2017
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate comprising surface interconnect and cavity compri...
- Patent number 9,609,751
- Issue date Mar 28, 2017
- QUALCOMM Incorporated
- Houssam Wafic Jomaa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with embedded components and method of making...
- Patent number 9,601,435
- Issue date Mar 21, 2017
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure with reduced height
- Patent number 9,484,327
- Issue date Nov 1, 2016
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder on trace technology for interconnect attachment
- Patent number 9,461,008
- Issue date Oct 4, 2016
- QUALCOMM Incorporated
- Rajneesh Kumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual epoxy dielectric and photosensitive solder mask coatings, and...
- Patent number 9,398,699
- Issue date Jul 19, 2016
- Intel Corporation
- Houssam Jomaa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System, apparatus, and method for split die interconnection
- Patent number 9,379,090
- Issue date Jun 28, 2016
- QUALCOMM Incorporated
- Ahmer Raza Syed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate with testing pads on fine pitch traces
- Patent number 9,370,097
- Issue date Jun 14, 2016
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package on package (PoP) integrated device comprising a plurality o...
- Patent number 9,355,898
- Issue date May 31, 2016
- QUALCOMM Incorporated
- Rajneesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface finish on trace for a thermal compression flip chip (TCFC)
- Patent number 9,269,681
- Issue date Feb 23, 2016
- QUALCOMM Incorporated
- Houssam W. Jomaa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra fine pitch and spacing interconnects for substrate
- Patent number 9,159,670
- Issue date Oct 13, 2015
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical adhesion of copper metallization to dielectric with part...
- Patent number 9,040,842
- Issue date May 26, 2015
- Intel Corporation
- Ravi Nalla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Barrier layer on bump and non-wettable coating on trace
- Patent number 8,802,556
- Issue date Aug 12, 2014
- QUALCOMM Incorporated
- Omar J. Bchir
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultra fine pitch and spacing interconnects for substrate
- Patent number 8,772,951
- Issue date Jul 8, 2014
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for improving package warpage and connection reliability th...
- Patent number 8,742,603
- Issue date Jun 3, 2014
- QUALCOMM Incorporated
- Omar J. Bchir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective seed layer treatment for feature plating
- Patent number 8,703,602
- Issue date Apr 22, 2014
- QUALCOMM Incorporated
- Omar J. Bchir
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Mechanical adhesion of copper metallization to dielectric with part...
- Patent number 8,425,785
- Issue date Apr 23, 2013
- Intel Corporation
- Ravi Nalla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sacrificial material to facilitate thin die attach
- Patent number 8,368,232
- Issue date Feb 5, 2013
- QUALCOMM Incorporated
- Omar J. Bchir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual epoxy dielectric and photosensitive solder mask coatings, and...
- Patent number 8,276,269
- Issue date Oct 2, 2012
- Intel Corporation
- Houssam Jomaa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming solder bumps on substrates
- Patent number 8,252,677
- Issue date Aug 28, 2012
- Intel Corporation
- Omar Bchir
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nanoclays in polymer compositions, articles containing same, proces...
- Patent number 8,163,830
- Issue date Apr 24, 2012
- Intel Corporation
- Praveen Bhimaraj
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
HYBRID CORE SUBSTRATE WITH EMBEDDED COMPONENTS
- Publication number 20240339414
- Publication date Oct 10, 2024
- QUALCOMM Incorporated
- Jaehyun YEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC MODULE PACKAGE
- Publication number 20220262962
- Publication date Aug 18, 2022
- ROCKLEY PHOTONICS LIMITED
- Gerald Cois BYRD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC MODULE PACKAGE
- Publication number 20220109075
- Publication date Apr 7, 2022
- ROCKLEY PHOTONICS LIMITED
- Gerald Cois BYRD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING PHOTON INTEGRATED CIRCUIT (PIC) CHIPS
- Publication number 20210272944
- Publication date Sep 2, 2021
- Micron Technology, Inc.
- Omar J. Bchir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING ELECTRO-OPTICAL SUBSTRATES
- Publication number 20210165162
- Publication date Jun 3, 2021
- Micron Technology, Inc.
- Omar J. Bchir
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING ELECTRO-OPTICAL SUBSTRATES
- Publication number 20200132930
- Publication date Apr 30, 2020
- Micron Technology, Inc.
- Omar J. Bchir
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING PHOTON INTEGRATED CIRCUIT (PIC) CHIPS
- Publication number 20200132946
- Publication date Apr 30, 2020
- Micron Technology, Inc.
- Omar J. Bchir
- G02 - OPTICS
Information Patent Application
OPTOELECTRONIC MODULE PACKAGE
- Publication number 20190044002
- Publication date Feb 7, 2019
- ROCKLEY PHOTONICS LIMITED
- Gerald Cois Byrd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PANEL LEVEL PACKAGING FOR MEMS APPLICATION
- Publication number 20180230004
- Publication date Aug 16, 2018
- OBSIDIAN SENSORS, INC.
- Yaoling PAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REINFORCED WAFER LEVEL PACKAGE COMPRISING A CORE LAYER FOR REDUCING...
- Publication number 20160322332
- Publication date Nov 3, 2016
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH EMBEDDED COMPONENTS AND METHOD OF MAKING...
- Publication number 20160218064
- Publication date Jul 28, 2016
- QUALCOMM Incorporated
- Chin-Kwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR CONTROLLING EQUIVALENT SERIES RESISTANCE OF A CAPACITOR
- Publication number 20160183386
- Publication date Jun 23, 2016
- QUALCOMM Incorporated
- Young Kyu SONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED THIN FILM MAGNETIC CARRIER FOR INTEGRATED VOLTAGE REGULATOR
- Publication number 20160163443
- Publication date Jun 9, 2016
- QUALCOMM Incorporated
- Mete ERTURK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, APPARATUS, AND METHOD OF INTERCONNECTION IN A SUBSTRATE
- Publication number 20160093567
- Publication date Mar 31, 2016
- QUALCOMM Incorporated
- Chin-Kwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICAL ADHESION OF COPPER METALLIZATION TO DIELECTRIC WITH PART...
- Publication number 20160079174
- Publication date Mar 17, 2016
- Ravi Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE (PoP) INTEGRATED DEVICE COMPRISING A PLURALITY O...
- Publication number 20160035622
- Publication date Feb 4, 2016
- QUALCOMM Incorporated
- Rajneesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND METHOD OF FORMING THE SAME
- Publication number 20150333004
- Publication date Nov 19, 2015
- QUALCOMM Incorporated
- Houssam Wafic JOMAA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE COMPRISING SURFACE INTERCONNECT AND CAVITY COMPRI...
- Publication number 20150296616
- Publication date Oct 15, 2015
- QUALCOMM Incorporated
- Houssam Wafic Jomaa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR IMPROVING PACKAGE WARPAGE AND CONNECTION RELIABILITY TH...
- Publication number 20150221528
- Publication date Aug 6, 2015
- QUALCOMM Incorporated
- Omar James Bchir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BRIDGE STRUCTURE IN A SUBSTRATE
- Publication number 20150116965
- Publication date Apr 30, 2015
- QUALCOMM INCORPORATED
- Chin-Kwan Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRA FINE PITCH AND SPACING INTERCONNECTS FOR SUBSTRATE
- Publication number 20150061143
- Publication date Mar 5, 2015
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYER ON BUMP AND NON-WETTABLE COATING ON TRACE
- Publication number 20140322868
- Publication date Oct 30, 2014
- Omar James Bchir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE STRUCTURE WITH REDUCED HEIGHT
- Publication number 20140264946
- Publication date Sep 18, 2014
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH TESTING PADS ON FINE PITCH TRACES
- Publication number 20140247573
- Publication date Sep 4, 2014
- QUALCOMM Incorporated
- Chin-Kwan Kim
- G01 - MEASURING TESTING
Information Patent Application
PROCESS FOR IMPROVING PACKAGE WARPAGE AND CONNECTION RELIABILITY TH...
- Publication number 20140227835
- Publication date Aug 14, 2014
- QUALCOMM Incorporated
- Omar James Bchir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANCHORING A TRACE ON A SUBSTRATE TO REDUCE PEELING OF THE TRACE
- Publication number 20140175658
- Publication date Jun 26, 2014
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE HAVING THERMAL COMPRESSION FLIP CHIP (TCFC) AND CHIP WITH R...
- Publication number 20140159238
- Publication date Jun 12, 2014
- QUALCOMM Incorporated
- Manuel Aldrete
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE FINISH ON TRACE FOR A THERMAL COMPRESSION FLIP CHIP (TCFC)
- Publication number 20140138831
- Publication date May 22, 2014
- QUALCOMM Incorporated
- Houssam W. Jomaa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING A LOW COEFFICIENT OF THERMAL EXPANSION (CTE) COPPE...
- Publication number 20140138129
- Publication date May 22, 2014
- QUALCOMM Incorporated
- Layal L. Rouhana
- B82 - NANO-TECHNOLOGY
Information Patent Application
BARRIER LAYER ON BUMP AND NON-WETTABLE COATING ON TRACE
- Publication number 20140131857
- Publication date May 15, 2014
- QUALCOMM Incorporated
- Omar J. Bchir
- H01 - BASIC ELECTRIC ELEMENTS

Omar J. Bchir

Person

Patents Grantslast 30 patents

Semiconductor devices having electro-optical substrates

Optoelectronic module package

Semiconductor packages having photon integrated circuit (PIC) chips

Semiconductor devices having electro-optical substrates

Embedded thin film magnetic carrier for integrated voltage regulator

Panel level packaging for MEMS application

Mechanical adhesion of copper metallization to dielectric with part...

Reinforced wafer level package comprising a core layer for reducing...

Substrate and method of forming the same

Embedded bridge structure in a substrate

Package substrate comprising surface interconnect and cavity compri...

Semiconductor package with embedded components and method of making...

Package-on-package structure with reduced height

Solder on trace technology for interconnect attachment

Dual epoxy dielectric and photosensitive solder mask coatings, and...

System, apparatus, and method for split die interconnection

Package substrate with testing pads on fine pitch traces

Package on package (PoP) integrated device comprising a plurality o...

Surface finish on trace for a thermal compression flip chip (TCFC)

Ultra fine pitch and spacing interconnects for substrate

Mechanical adhesion of copper metallization to dielectric with part...

Barrier layer on bump and non-wettable coating on trace

Ultra fine pitch and spacing interconnects for substrate

Process for improving package warpage and connection reliability th...

Selective seed layer treatment for feature plating

Mechanical adhesion of copper metallization to dielectric with part...

Sacrificial material to facilitate thin die attach

Dual epoxy dielectric and photosensitive solder mask coatings, and...

Method of forming solder bumps on substrates

Nanoclays in polymer compositions, articles containing same, proces...

Patents Applicationslast 30 patents

HYBRID CORE SUBSTRATE WITH EMBEDDED COMPONENTS

OPTOELECTRONIC MODULE PACKAGE

OPTOELECTRONIC MODULE PACKAGE

SEMICONDUCTOR PACKAGES HAVING PHOTON INTEGRATED CIRCUIT (PIC) CHIPS

SEMICONDUCTOR DEVICES HAVING ELECTRO-OPTICAL SUBSTRATES

SEMICONDUCTOR DEVICES HAVING ELECTRO-OPTICAL SUBSTRATES

SEMICONDUCTOR PACKAGES HAVING PHOTON INTEGRATED CIRCUIT (PIC) CHIPS

OPTOELECTRONIC MODULE PACKAGE

PANEL LEVEL PACKAGING FOR MEMS APPLICATION

REINFORCED WAFER LEVEL PACKAGE COMPRISING A CORE LAYER FOR REDUCING...

SEMICONDUCTOR PACKAGE WITH EMBEDDED COMPONENTS AND METHOD OF MAKING...

TECHNIQUES FOR CONTROLLING EQUIVALENT SERIES RESISTANCE OF A CAPACITOR

EMBEDDED THIN FILM MAGNETIC CARRIER FOR INTEGRATED VOLTAGE REGULATOR

SYSTEM, APPARATUS, AND METHOD OF INTERCONNECTION IN A SUBSTRATE

MECHANICAL ADHESION OF COPPER METALLIZATION TO DIELECTRIC WITH PART...

PACKAGE ON PACKAGE (PoP) INTEGRATED DEVICE COMPRISING A PLURALITY O...

SUBSTRATE AND METHOD OF FORMING THE SAME

PACKAGE SUBSTRATE COMPRISING SURFACE INTERCONNECT AND CAVITY COMPRI...

PROCESS FOR IMPROVING PACKAGE WARPAGE AND CONNECTION RELIABILITY TH...

EMBEDDED BRIDGE STRUCTURE IN A SUBSTRATE

ULTRA FINE PITCH AND SPACING INTERCONNECTS FOR SUBSTRATE

BARRIER LAYER ON BUMP AND NON-WETTABLE COATING ON TRACE

PACKAGE-ON-PACKAGE STRUCTURE WITH REDUCED HEIGHT

PACKAGE SUBSTRATE WITH TESTING PADS ON FINE PITCH TRACES

PROCESS FOR IMPROVING PACKAGE WARPAGE AND CONNECTION RELIABILITY TH...

ANCHORING A TRACE ON A SUBSTRATE TO REDUCE PEELING OF THE TRACE

PACKAGE HAVING THERMAL COMPRESSION FLIP CHIP (TCFC) AND CHIP WITH R...

SURFACE FINISH ON TRACE FOR A THERMAL COMPRESSION FLIP CHIP (TCFC)

SUBSTRATE HAVING A LOW COEFFICIENT OF THERMAL EXPANSION (CTE) COPPE...

BARRIER LAYER ON BUMP AND NON-WETTABLE COATING ON TRACE