Onorato DI COLA

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Patents Grantslast 30 patents

Information Patent Grant
Hybrid bonding method for semiconductor wafers and related three-di...
- Patent number 11,127,776
- Issue date Sep 21, 2021
- LFoundry S.r.l.
- Giovanni De Amicis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated sensor of ionizing radiation and ionizing particles
- Patent number 11,081,614
- Issue date Aug 3, 2021
- LFoundry S.r.l.
- Angelo Rivetti
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADVANCED INTERCONNECTION FOR WAFER ON WAFER PACKAGING
- Publication number 20240170426
- Publication date May 23, 2024
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SENSOR OF IONIZING RADIATION AND IONIZING PARTICLES
- Publication number 20200328321
- Publication date Oct 15, 2020
- LFOUNDRY S.R.L.
- Angelo RIVETTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING METHOD FOR SEMICONDUCTOR WAFERS AND RELATED THREE-DI...
- Publication number 20200212086
- Publication date Jul 2, 2020
- LFOUNDRY S.R.L.
- Giovanni DE AMICIS
- H01 - BASIC ELECTRIC ELEMENTS