Onur Ozkan

Person

Scottsdale, AZ, US

People

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNEC...
- Publication number 20240096809
- Publication date Mar 21, 2024
- Intel Corporation
- Hiroki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDED GLASS CARRIERS FOR MAKING PACKAGE SUBSTRATES
- Publication number 20240079259
- Publication date Mar 7, 2024
- Intel Corporation
- Jacob VEHONSKY
- B32 - LAYERED PRODUCTS
Information Patent Application
IC PACKAGE WITH MICRO LEDS
- Publication number 20240079530
- Publication date Mar 7, 2024
- Intel Corporation
- Jacob VEHONSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING ONE OR MORE ELECTRICAL INTERCONNECTS
- Publication number 20240006298
- Publication date Jan 4, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE DEFECTS IN INTERCONNECTS BETWEEN S...
- Publication number 20230097624
- Publication date Mar 30, 2023
- Intel Corporation
- Kyle McElhinny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEFORMABLE SEMICONDUCTOR DEVICE CONNECTION
- Publication number 20230086180
- Publication date Mar 23, 2023
- Intel Corporation
- Onur Ozkan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING ARCHITECTURE WITH CUSTOMIZED VARIABLE METAL TH...
- Publication number 20230087810
- Publication date Mar 23, 2023
- Intel Corporation
- Jeremy D. ECTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Package Having Internal I/O Structures With Modu...
- Publication number 20230086649
- Publication date Mar 23, 2023
- Intel Corporation
- Onur OZKAN
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Applicationslast 30 patents

MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNEC...

DUAL SIDED GLASS CARRIERS FOR MAKING PACKAGE SUBSTRATES

IC PACKAGE WITH MICRO LEDS

SUBSTRATE HAVING ONE OR MORE ELECTRICAL INTERCONNECTS

METHODS AND APPARATUS TO REDUCE DEFECTS IN INTERCONNECTS BETWEEN S...

DEFORMABLE SEMICONDUCTOR DEVICE CONNECTION

ELECTRONIC PACKAGING ARCHITECTURE WITH CUSTOMIZED VARIABLE METAL TH...

Semiconductor Chip Package Having Internal I/O Structures With Modu...