Ordwin Haase

Person

Taufkirchen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Double-sided coolable semiconductor package
- Patent number 12,266,586
- Issue date Apr 1, 2025
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double sided semiconductor package
- Patent number 11,515,228
- Issue date Nov 29, 2022
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with passive electrical component and method...
- Patent number 11,217,504
- Issue date Jan 4, 2022
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having overlapping electrically conductive re...
- Patent number 11,018,072
- Issue date May 25, 2021
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an electromagnetic shielding structure...
- Patent number 10,985,110
- Issue date Apr 20, 2021
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and a circuit arrangement for determining a demagnetization...
- Patent number 9,069,020
- Issue date Jun 30, 2015
- Infineon Technologies AG
- Marc Fahlenkamp
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Circuit configuration for signal balancing in antiphase bus drivers
- Patent number 6,922,073
- Issue date Jul 26, 2005
- Infineon Technologies AG
- Ordwin Haase
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
DC voltage chopper for DC voltage
- Patent number 6,882,132
- Issue date Apr 19, 2005
- Infineon Technologies AG
- Ordwin Haase
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Output driver circuit
- Patent number 6,362,667
- Issue date Mar 26, 2002
- Infineon Technologies AG
- Dirk Killat
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
DOUBLE-SIDED COOLABLE SEMICONDUCTOR PACKAGE
- Publication number 20220319948
- Publication date Oct 6, 2022
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double Sided Semiconductor Package
- Publication number 20210134697
- Publication date May 6, 2021
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING OVERLAPPING ELECTRICALLY CONDUCTIVE RE...
- Publication number 20200035580
- Publication date Jan 30, 2020
- INFINEON TECHNOLOGIES AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Passive Electrical Component and Method...
- Publication number 20200035581
- Publication date Jan 30, 2020
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Having an Electromagnetic Shielding Structure...
- Publication number 20200035616
- Publication date Jan 30, 2020
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND A CIRCUIT ARRANGEMENT FOR DETERMINING A DEMAGNETIZATION...
- Publication number 20140112028
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Marc Fahlenkamp
- G01 - MEASURING TESTING
Information Patent Application
DC voltage chopper for DC voltage
- Publication number 20040145927
- Publication date Jul 29, 2004
- Ordwin Haase
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Circuit configuration for signal balancing in antiphase bus drivers
- Publication number 20040124905
- Publication date Jul 1, 2004
- Ordwin Haase
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Output driver circuit
- Publication number 20010024133
- Publication date Sep 27, 2001
- Dirk Killat
- H03 - BASIC ELECTRONIC CIRCUITRY

Ordwin Haase

Person

Patents Grantslast 30 patents

Double-sided coolable semiconductor package

Double sided semiconductor package

Semiconductor package with passive electrical component and method...

Semiconductor package having overlapping electrically conductive re...

Semiconductor package having an electromagnetic shielding structure...

Method and a circuit arrangement for determining a demagnetization...

Circuit configuration for signal balancing in antiphase bus drivers

DC voltage chopper for DC voltage

Output driver circuit

Patents Applicationslast 30 patents

DOUBLE-SIDED COOLABLE SEMICONDUCTOR PACKAGE

Double Sided Semiconductor Package

SEMICONDUCTOR PACKAGE HAVING OVERLAPPING ELECTRICALLY CONDUCTIVE RE...

Semiconductor Package with Passive Electrical Component and Method...

Semiconductor Package Having an Electromagnetic Shielding Structure...

METHOD AND A CIRCUIT ARRANGEMENT FOR DETERMINING A DEMAGNETIZATION...

DC voltage chopper for DC voltage

Circuit configuration for signal balancing in antiphase bus drivers

Output driver circuit