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Osamu Kakutani

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Patents Grantslast 30 patents

  • Information Patent Grant

    Bonding apparatus and alignment method
    • Patent number 12,080,679
    • Issue date Sep 3, 2024
    • Shinkawa Ltd.
    • Toru Maeda
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding apparatus
    • Patent number 12,057,427
    • Issue date Aug 6, 2024
    • Shinkawa Ltd.
    • Osamu Kakutani
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Linear motor
    • Patent number 10,700,585
    • Issue date Jun 30, 2020
    • Hitachi Metals, Ltd.
    • Seiki Takedomi
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Grant

    Bonding apparatus and bonding method
    • Patent number 10,388,555
    • Issue date Aug 20, 2019
    • Shinkawa Ltd.
    • Osamu Kakutani
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding device
    • Patent number 10,361,166
    • Issue date Jul 23, 2019
    • Shinkawa Ltd.
    • Osamu Kakutani
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Heater for bonding apparatus and method of cooling the same
    • Patent number 10,350,692
    • Issue date Jul 16, 2019
    • Shinkawa Ltd.
    • Kohei Seyama
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding tool cooling apparatus and method for cooling bonding tool
    • Patent number 9,576,927
    • Issue date Feb 21, 2017
    • Shinkawa Ltd.
    • Osamu Kakutani
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Ultrasonic horn
    • Patent number 8,511,534
    • Issue date Aug 20, 2013
    • Kabushiki Kaisha Shinkawa
    • Osamu Kakutani
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Ultrasonic horn
    • Patent number 8,434,656
    • Issue date May 7, 2013
    • Kabushiki Kaisha Shinkawa
    • Osamu Kakutani
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Ultrasonic horn
    • Patent number 8,152,043
    • Issue date Apr 10, 2012
    • Kabushiki Kaisha Shinkawa
    • Osamu Kakutani
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Ultrasonic horn
    • Patent number 8,052,026
    • Issue date Nov 8, 2011
    • Kabushiki Kaisha Shinkawa
    • Osamu Kakutani
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding apparatus and bonding stage height adjustment method for th...
    • Patent number 7,886,956
    • Issue date Feb 15, 2011
    • Shinkawa Ltd.
    • Kohei Seyama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding arm swinging type bonding apparatus
    • Patent number 7,389,805
    • Issue date Jun 24, 2008
    • Kabushiki Kaisha Shinkawa
    • Osamu Kakutani
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus
    • Patent number 7,306,132
    • Issue date Dec 11, 2007
    • Kabushiki Kaisha Shinkawa
    • Osamu Kakutani
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus
    • Patent number 7,293,686
    • Issue date Nov 13, 2007
    • Kabushiki Kaisha Shinkawa
    • Osamu Kakutani
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus
    • Patent number 7,096,912
    • Issue date Aug 29, 2006
    • Kabushiki Kaisha Shinkawa
    • Osamu Kakutani
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Transducer and a bonding apparatus using the same
    • Patent number 6,766,936
    • Issue date Jul 27, 2004
    • Kabushiki Kaisha Shinkawa
    • Ryuichi Kyomasu
    • B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
  • Information Patent Grant

    Die packing device
    • Patent number 6,760,968
    • Issue date Jul 13, 2004
    • Kabushiki Kaisha Shinkawa
    • Tsutomu Mimata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Die holding mechanism for a die with connecting wires thereon
    • Patent number 6,505,397
    • Issue date Jan 14, 2003
    • Kabushiki Kaisha Shinkawa
    • Tsutomu Mimata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multi-chip bonding method and apparatus
    • Patent number 6,383,844
    • Issue date May 7, 2002
    • Kabushiki Kaisha Shinkawa
    • Tsutomu Mimata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Manufacturing method
    • Patent number 4,763,827
    • Issue date Aug 16, 1988
    • Hitachi, Ltd.
    • Kenji Watanabe
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Manufacturing apparatus
    • Patent number 4,674,670
    • Issue date Jun 23, 1987
    • Hitachi, Ltd.
    • Kenji Watanabe
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
    • Publication number 20240105672
    • Publication date Mar 28, 2024
    • SHINKAWA LTD.
    • Shigeru HAYATA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING APPARATUS AND ALIGNMENT METHOD
    • Publication number 20240105673
    • Publication date Mar 28, 2024
    • SHINKAWA LTD.
    • Toru MAEDA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRE BONDING APPARATUS
    • Publication number 20230125756
    • Publication date Apr 27, 2023
    • SHINKAWA LTD.
    • Osamu KAKUTANI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Linear Motor
    • Publication number 20180069464
    • Publication date Mar 8, 2018
    • Hitachi Metals, Ltd.
    • Seiki Takedomi
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    BONDING DEVICE
    • Publication number 20170053889
    • Publication date Feb 23, 2017
    • SHINKAWA LTD.
    • OSAMU KAKUTANI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING APPARATUS AND BONDING METHOD
    • Publication number 20160365267
    • Publication date Dec 15, 2016
    • SHINKAWA LTD.
    • OSAMU KAKUTANI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING TOOL COOLING APPARATUS AND METHOD FOR COOLING BONDING TOOL
    • Publication number 20150333032
    • Publication date Nov 19, 2015
    • SHINKAWA LTD.
    • OSAMU KAKUTANI
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    HEATER FOR BONDING APPARATUS AND METHOD OF COOLING THE SAME
    • Publication number 20150183040
    • Publication date Jul 2, 2015
    • SHINKAWA LTD.
    • Kohei SEYAMA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ULTRASONIC HORN
    • Publication number 20120018490
    • Publication date Jan 26, 2012
    • SHINKAWA LTD.
    • Osamu Kakutani
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ULTRASONIC HORN
    • Publication number 20120018489
    • Publication date Jan 26, 2012
    • SHINKAWA LTD.
    • Osamu Kakutani
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ULTRASONIC HORN
    • Publication number 20120018491
    • Publication date Jan 26, 2012
    • SHINKAWA LTD.
    • Osamu Kakutani
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING APPARATUS AND BONDING STAGE HEIGHT ADJUSTMENT METHOD FOR TH...
    • Publication number 20100301101
    • Publication date Dec 2, 2010
    • SHINKAWA LTD.
    • Kohei Seyama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Hydrostatic guide system
    • Publication number 20080304772
    • Publication date Dec 11, 2008
    • KABUSHIKI KAISHA SHINKAWA
    • Osamu Kakutani
    • F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
  • Information Patent Application

    Ultrasonic horn
    • Publication number 20070080193
    • Publication date Apr 12, 2007
    • KABUSHIKI KAISHA SHINKAWA
    • Osamu Kakutani
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Bonding apparatus
    • Publication number 20050274771
    • Publication date Dec 15, 2005
    • KABUSHIKI KAISHA SHINKAWA
    • Osamu Kakutani
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Bonding apparatus
    • Publication number 20050211746
    • Publication date Sep 29, 2005
    • KABUSHIKI KAISHA SHINKAWA
    • Osamu Kakutani
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Bonding arm swinging type bonding apparatus
    • Publication number 20050184127
    • Publication date Aug 25, 2005
    • KABUSHIKI KAISHA SHINKAWA
    • Osamu Kakutani
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Bonding apparatus
    • Publication number 20050109815
    • Publication date May 26, 2005
    • KABUSHIKI KAISHA SHINKAWA
    • Osamu Kakutani
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Bonding apparatus
    • Publication number 20040188026
    • Publication date Sep 30, 2004
    • KABUSHIKI KAISHA SHINKAWA
    • Osamu Kakutani
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Transducer and a bonding apparatus using the same
    • Publication number 20030047583
    • Publication date Mar 13, 2003
    • KABUSHIKI KAISHA SHINKAWA
    • Ryuichi Kyomasu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Die packing device and die bonding apparatus
    • Publication number 20020046460
    • Publication date Apr 25, 2002
    • KABUSHIKI KAISHA SHINAWA
    • Tsutomu Mimata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Multi-chip bonding method and apparatus
    • Publication number 20010005602
    • Publication date Jun 28, 2001
    • KABUSHIKI KAISHA SHINKAWA
    • Tsutomu Mimata
    • H01 - BASIC ELECTRIC ELEMENTS