Osamu Miyata

Person

Kyoto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,057,362
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 11,842,972
- Issue date Dec 12, 2023
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 11,355,462
- Issue date Jun 7, 2022
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,069,591
- Issue date Jul 20, 2021
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 10,818,628
- Issue date Oct 27, 2020
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 10,522,494
- Issue date Dec 31, 2019
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,431,516
- Issue date Oct 1, 2019
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 9,831,204
- Issue date Nov 28, 2017
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 9,721,865
- Issue date Aug 1, 2017
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 9,601,441
- Issue date Mar 21, 2017
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 9,312,228
- Issue date Apr 12, 2016
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 9,117,774
- Issue date Aug 25, 2015
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 9,111,819
- Issue date Aug 18, 2015
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 8,928,156
- Issue date Jan 6, 2015
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 8,786,106
- Issue date Jul 22, 2014
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 8,754,535
- Issue date Jun 17, 2014
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with front and back side resin layers having d...
- Patent number 8,723,339
- Issue date May 13, 2014
- Rohm Co., Ltd.
- Masaki Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with front and back side resin layers having d...
- Patent number 8,664,779
- Issue date Mar 4, 2014
- Rohm Co., Ltd.
- Masaki Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,659,174
- Issue date Feb 25, 2014
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, method of manufacturing semiconductor chip, and...
- Patent number 8,653,657
- Issue date Feb 18, 2014
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 8,575,764
- Issue date Nov 5, 2013
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,432,046
- Issue date Apr 30, 2013
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 8,405,227
- Issue date Mar 26, 2013
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with front and back side resin layers having d...
- Patent number 8,164,201
- Issue date Apr 24, 2012
- Rohm Co., Ltd.
- Masaki Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,063,495
- Issue date Nov 22, 2011
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a conductive member including an end fa...
- Patent number 7,928,581
- Issue date Apr 19, 2011
- Rohm Co., Ltd.
- Kazumasa Tanida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 7,714,448
- Issue date May 11, 2010
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip bonding structure
- Patent number 7,598,613
- Issue date Oct 6, 2009
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor device
- Patent number 7,518,230
- Issue date Apr 14, 2009
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating lead frame and method of fabricating semicond...
- Patent number 7,456,049
- Issue date Nov 25, 2008
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20240055384
- Publication date Feb 15, 2024
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20220285305
- Publication date Sep 8, 2022
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210313245
- Publication date Oct 7, 2021
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20210013168
- Publication date Jan 14, 2021
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20200105699
- Publication date Apr 2, 2020
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190393116
- Publication date Dec 26, 2019
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20180068970
- Publication date Mar 8, 2018
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20170301640
- Publication date Oct 19, 2017
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170162463
- Publication date Jun 8, 2017
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160181210
- Publication date Jun 23, 2016
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20150348862
- Publication date Dec 3, 2015
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150311165
- Publication date Oct 29, 2015
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150091169
- Publication date Apr 2, 2015
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140291845
- Publication date Oct 2, 2014
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20140246789
- Publication date Sep 4, 2014
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140077373
- Publication date Mar 20, 2014
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FRONT AND BACK SIDE RESIN LAYERS HAVING D...
- Publication number 20140070413
- Publication date Mar 13, 2014
- Rohm Co., Ltd.
- Masaki Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130221530
- Publication date Aug 29, 2013
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20130175708
- Publication date Jul 11, 2013
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FRONT AND BACK SIDE RESIN LAYERS HAVING D...
- Publication number 20120193766
- Publication date Aug 2, 2012
- Rohm Co., Ltd.
- Masaki Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120032325
- Publication date Feb 9, 2012
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing semiconductor device
- Publication number 20100187659
- Publication date Jul 29, 2010
- ROHM CO., LTD.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20090224409
- Publication date Sep 10, 2009
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip, method of manufacturing semiconductor chip, and...
- Publication number 20090127705
- Publication date May 21, 2009
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Semiconductor Device Assembly
- Publication number 20090121347
- Publication date May 14, 2009
- Rohm Co., Ltd.
- Masaki Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20080272488
- Publication date Nov 6, 2008
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20080246163
- Publication date Oct 9, 2008
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacture Method for Semiconductor Device and Semiconductor Device
- Publication number 20080036043
- Publication date Feb 14, 2008
- Rohm Co., Ltd.
- Kazumasa Tanida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method for Manufacturing Semiconductor Device
- Publication number 20080006910
- Publication date Jan 10, 2008
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20070230153
- Publication date Oct 4, 2007
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS

Osamu Miyata

Person

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device with a semiconductor chip connected in a flip...

Semiconductor device with a semiconductor chip connected in a flip...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device with a semiconductor chip connected in a flip...

Semiconductor device with a semiconductor chip connected in a flip...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device with a semiconductor chip connected in a flip...

Semiconductor device with a semiconductor chip connected in a flip...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device with a semiconductor chip connected in a flip...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device with a semiconductor chip connected in a flip...

Semiconductor device with front and back side resin layers having d...

Semiconductor device with front and back side resin layers having d...

Semiconductor device

Semiconductor chip, method of manufacturing semiconductor chip, and...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device

Semiconductor device with a semiconductor chip connected in a flip...

Semiconductor device with front and back side resin layers having d...

Semiconductor device

Semiconductor device having a conductive member including an end fa...

Semiconductor device and method for manufacturing semiconductor device

Flip chip bonding structure

Semiconductor chip and semiconductor device

Method of fabricating lead frame and method of fabricating semicond...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH FRONT AND BACK SIDE RESIN LAYERS HAVING D...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

SEMICONDUCTOR DEVICE WITH FRONT AND BACK SIDE RESIN LAYERS HAVING D...

SEMICONDUCTOR DEVICE

Semiconductor device and method for manufacturing semiconductor device

Semiconductor Device

Semiconductor chip, method of manufacturing semiconductor chip, and...

Semiconductor Device and Semiconductor Device Assembly

Semiconductor Device

Semiconductor Device

Manufacture Method for Semiconductor Device and Semiconductor Device

Semiconductor Device and Method for Manufacturing Semiconductor Device

Semiconductor Device