TREA

Osamu Nagai

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  • Ota-ku, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer grinding method
    • Patent number 7,758,402
    • Issue date Jul 20, 2010
    • Disco Corporation
    • Shinji Yoshida
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Wafer grinding method
    • Patent number 7,462,094
    • Issue date Dec 9, 2008
    • Disco Corporation
    • Shinji Yoshida
    • B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

  • Information Patent Application

    GRINDING APPARATUS
    • Publication number 20220274222
    • Publication date Sep 1, 2022
    • Disco Corporation
    • Yohei WAKABAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SPIN ETCHING METHOD FOR SEMICONDUCTOR WAFER
    • Publication number 20090209110
    • Publication date Aug 20, 2009
    • Disco Corporation
    • Ayumu Okano
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wafer grinding method
    • Publication number 20080090505
    • Publication date Apr 17, 2008
    • Disco Corporation
    • Shinji Yoshida
    • B24 - GRINDING POLISHING
  • Information Patent Application

    Wafer grinding method
    • Publication number 20080076334
    • Publication date Mar 27, 2008
    • Disco Corporation
    • Shinji Yoshida
    • B24 - GRINDING POLISHING